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CW021A
machined rolled plate both sides PVC rolled
- Form machined rolled plate both sides PVC rolled
- Material Copper
- Material CW021A
- Material chemically EN 573-3 SE-Cu (Cu-HCP)
BIKAR Metals companies
Conductors for electronics and electrical engineering
Superconductor matrices
Moulds for continuous casting
Cold extrusion parts
Pressure vessels
Busbars, busbars and feeder bars
Parts where good brazing and welding properties are required, e.g.
| Aviation | No |
| Bi (from) | 0,0005 |
| Bi (to) | 0,0005 |
| Cu footnote reference | Einschließlich Silber bis max. 0,015 %. |
| Other | 0,03 |
| P (from) | 0,002 |
| P (to) | 0,007 |
| Pb (from) | 0,005 |
| Pb (to) | 0,005 |
| Rest | Cu |
| suitable according to DIN EN 602 | No |
| Material chemically EN 573-3 | SE-Cu (Cu-HCP) |
| Material no | CW021A |
| Coefficient of thermal expansion from 20 to 100°C | 16.9 K⁻¹10⁻⁶ |
| Coefficient of thermal expansion from 20 to 200°C | 17.3 K⁻¹10⁻⁶ |
| Coefficient of thermal expansion from 20 to 300°C | 17.6 K⁻¹10⁻⁶ |
| Density | 8.94 g/cm³ |
| Modulus of elasticity at 100°C | 119 GPa |
| Modulus of elasticity at 20°C | 115 GPa |
| Modulus of elasticity at 200°C | 91 GPa |
| Specific electrical conductivity at 100°C | 43.6 m/Ω*mm² |
| Specific electrical conductivity at 20°C | 57 m/Ω*mm² |
| Specific electrical conductivity at 200°C | 33.7 m/Ω*mm² |
| Specific electrical resistance at 100°C | 0.0229 Ω*mm²/m |
| Specific electrical resistance at 20°C | 0.0169 Ω*mm²/m |
| Specific electrical resistance at 200°C | 0.0297 Ω*mm²/m |
| Specific heat at 100°C | 0.393 J/(kg·K) |
| Specific heat at 20°C | 0.385 J/(kg·K) |
| Specific heat at 200°C | 0.403 J/(kg·K) |
| Thermal conductivity at 20°C | 385 W/m*K |
| Brazing | 1 |
| Soft soldering | 1 |
| Gas | 4 |
| Laser | 3 |
| MIG | 2 |
| Resistance spot welding | 5 |
| TIG | 2 |
| Aviation | No |
| Bi (from) | 0,0005 |
| Bi (to) | 0,0005 |
| Cu footnote reference | Einschließlich Silber bis max. 0,015 %. |
| Other | 0,03 |
| P (from) | 0,002 |
| P (to) | 0,007 |
| Pb (from) | 0,005 |
| Pb (to) | 0,005 |
| Rest | Cu |
| suitable according to DIN EN 602 | No |
| Material chemically EN 573-3 | SE-Cu (Cu-HCP) |
| Material no | CW021A |
| Coefficient of thermal expansion from 20 to 100°C | 16.9 K⁻¹10⁻⁶ |
| Coefficient of thermal expansion from 20 to 200°C | 17.3 K⁻¹10⁻⁶ |
| Coefficient of thermal expansion from 20 to 300°C | 17.6 K⁻¹10⁻⁶ |
| Density | 8.94 g/cm³ |
| Modulus of elasticity at 100°C | 119 GPa |
| Modulus of elasticity at 20°C | 115 GPa |
| Modulus of elasticity at 200°C | 91 GPa |
| Specific electrical conductivity at 100°C | 43.6 m/Ω*mm² |
| Specific electrical conductivity at 20°C | 57 m/Ω*mm² |
| Specific electrical conductivity at 200°C | 33.7 m/Ω*mm² |
| Specific electrical resistance at 100°C | 0.0229 Ω*mm²/m |
| Specific electrical resistance at 20°C | 0.0169 Ω*mm²/m |
| Specific electrical resistance at 200°C | 0.0297 Ω*mm²/m |
| Specific heat at 100°C | 0.393 J/(kg·K) |
| Specific heat at 20°C | 0.385 J/(kg·K) |
| Specific heat at 200°C | 0.403 J/(kg·K) |
| Thermal conductivity at 20°C | 385 W/m*K |
| Brazing | 1 |
| Soft soldering | 1 |
| Gas | 4 |
| Laser | 3 |
| MIG | 2 |
| Resistance spot welding | 5 |
| TIG | 2 |
| Aviation | No |
| Bi (from) | 0,0005 |
| Bi (to) | 0,0005 |
| Cu footnote reference | Einschließlich Silber bis max. 0,015 %. |
| Other | 0,03 |
| P (from) | 0,002 |
| P (to) | 0,007 |
| Pb (from) | 0,005 |
| Pb (to) | 0,005 |
| Rest | Cu |
| suitable according to DIN EN 602 | No |
| Material chemically EN 573-3 | SE-Cu (Cu-HCP) |
| Material no | CW021A |
| Coefficient of thermal expansion from 20 to 100°C | 16.9 K⁻¹10⁻⁶ |
| Coefficient of thermal expansion from 20 to 200°C | 17.3 K⁻¹10⁻⁶ |
| Coefficient of thermal expansion from 20 to 300°C | 17.6 K⁻¹10⁻⁶ |
| Density | 8.94 g/cm³ |
| Modulus of elasticity at 100°C | 119 GPa |
| Modulus of elasticity at 20°C | 115 GPa |
| Modulus of elasticity at 200°C | 91 GPa |
| Specific electrical conductivity at 100°C | 43.6 m/Ω*mm² |
| Specific electrical conductivity at 20°C | 57 m/Ω*mm² |
| Specific electrical conductivity at 200°C | 33.7 m/Ω*mm² |
| Specific electrical resistance at 100°C | 0.0229 Ω*mm²/m |
| Specific electrical resistance at 20°C | 0.0169 Ω*mm²/m |
| Specific electrical resistance at 200°C | 0.0297 Ω*mm²/m |
| Specific heat at 100°C | 0.393 J/(kg·K) |
| Specific heat at 20°C | 0.385 J/(kg·K) |
| Specific heat at 200°C | 0.403 J/(kg·K) |
| Thermal conductivity at 20°C | 385 W/m*K |
| Brazing | 1 |
| Soft soldering | 1 |
| Gas | 4 |
| Laser | 3 |
| MIG | 2 |
| Resistance spot welding | 5 |
| TIG | 2 |
| Aviation | No |
| Bi (from) | 0,0005 |
| Bi (to) | 0,0005 |
| Cu footnote reference | Einschließlich Silber bis max. 0,015 %. |
| Other | 0,03 |
| P (from) | 0,002 |
| P (to) | 0,007 |
| Pb (from) | 0,005 |
| Pb (to) | 0,005 |
| Rest | Cu |
| suitable according to DIN EN 602 | No |
| Material chemically EN 573-3 | SE-Cu (Cu-HCP) |
| Material no | CW021A |
| Coefficient of thermal expansion from 20 to 100°C | 16.9 K⁻¹10⁻⁶ |
| Coefficient of thermal expansion from 20 to 200°C | 17.3 K⁻¹10⁻⁶ |
| Coefficient of thermal expansion from 20 to 300°C | 17.6 K⁻¹10⁻⁶ |
| Density | 8.94 g/cm³ |
| Modulus of elasticity at 100°C | 119 GPa |
| Modulus of elasticity at 20°C | 115 GPa |
| Modulus of elasticity at 200°C | 91 GPa |
| Specific electrical conductivity at 100°C | 43.6 m/Ω*mm² |
| Specific electrical conductivity at 20°C | 57 m/Ω*mm² |
| Specific electrical conductivity at 200°C | 33.7 m/Ω*mm² |
| Specific electrical resistance at 100°C | 0.0229 Ω*mm²/m |
| Specific electrical resistance at 20°C | 0.0169 Ω*mm²/m |
| Specific electrical resistance at 200°C | 0.0297 Ω*mm²/m |
| Specific heat at 100°C | 0.393 J/(kg·K) |
| Specific heat at 20°C | 0.385 J/(kg·K) |
| Specific heat at 200°C | 0.403 J/(kg·K) |
| Thermal conductivity at 20°C | 385 W/m*K |
| Brazing | 1 |
| Soft soldering | 1 |
| Gas | 4 |
| Laser | 3 |
| MIG | 2 |
| Resistance spot welding | 5 |
| TIG | 2 |
| Aviation | No |
| Bi (from) | 0,0005 |
| Bi (to) | 0,0005 |
| Cu footnote reference | Einschließlich Silber bis max. 0,015 %. |
| Other | 0,03 |
| P (from) | 0,002 |
| P (to) | 0,007 |
| Pb (from) | 0,005 |
| Pb (to) | 0,005 |
| Rest | Cu |
| suitable according to DIN EN 602 | No |
| Material chemically EN 573-3 | SE-Cu (Cu-HCP) |
| Material no | CW021A |
| Coefficient of thermal expansion from 20 to 100°C | 16.9 K⁻¹10⁻⁶ |
| Coefficient of thermal expansion from 20 to 200°C | 17.3 K⁻¹10⁻⁶ |
| Coefficient of thermal expansion from 20 to 300°C | 17.6 K⁻¹10⁻⁶ |
| Density | 8.94 g/cm³ |
| Modulus of elasticity at 100°C | 119 GPa |
| Modulus of elasticity at 20°C | 115 GPa |
| Modulus of elasticity at 200°C | 91 GPa |
| Specific electrical conductivity at 100°C | 43.6 m/Ω*mm² |
| Specific electrical conductivity at 20°C | 57 m/Ω*mm² |
| Specific electrical conductivity at 200°C | 33.7 m/Ω*mm² |
| Specific electrical resistance at 100°C | 0.0229 Ω*mm²/m |
| Specific electrical resistance at 20°C | 0.0169 Ω*mm²/m |
| Specific electrical resistance at 200°C | 0.0297 Ω*mm²/m |
| Specific heat at 100°C | 0.393 J/(kg·K) |
| Specific heat at 20°C | 0.385 J/(kg·K) |
| Specific heat at 200°C | 0.403 J/(kg·K) |
| Thermal conductivity at 20°C | 385 W/m*K |
| Brazing | 1 |
| Soft soldering | 1 |
| Gas | 4 |
| Laser | 3 |
| MIG | 2 |
| Resistance spot welding | 5 |
| TIG | 2 |
| Aviation | No |
| Bi (from) | 0,0005 |
| Bi (to) | 0,0005 |
| Cu footnote reference | Einschließlich Silber bis max. 0,015 %. |
| Other | 0,03 |
| P (from) | 0,002 |
| P (to) | 0,007 |
| Pb (from) | 0,005 |
| Pb (to) | 0,005 |
| Rest | Cu |
| suitable according to DIN EN 602 | No |
| Material chemically EN 573-3 | SE-Cu (Cu-HCP) |
| Material no | CW021A |
| Coefficient of thermal expansion from 20 to 100°C | 16.9 K⁻¹10⁻⁶ |
| Coefficient of thermal expansion from 20 to 200°C | 17.3 K⁻¹10⁻⁶ |
| Coefficient of thermal expansion from 20 to 300°C | 17.6 K⁻¹10⁻⁶ |
| Density | 8.94 g/cm³ |
| Modulus of elasticity at 100°C | 119 GPa |
| Modulus of elasticity at 20°C | 115 GPa |
| Modulus of elasticity at 200°C | 91 GPa |
| Specific electrical conductivity at 100°C | 43.6 m/Ω*mm² |
| Specific electrical conductivity at 20°C | 57 m/Ω*mm² |
| Specific electrical conductivity at 200°C | 33.7 m/Ω*mm² |
| Specific electrical resistance at 100°C | 0.0229 Ω*mm²/m |
| Specific electrical resistance at 20°C | 0.0169 Ω*mm²/m |
| Specific electrical resistance at 200°C | 0.0297 Ω*mm²/m |
| Specific heat at 100°C | 0.393 J/(kg·K) |
| Specific heat at 20°C | 0.385 J/(kg·K) |
| Specific heat at 200°C | 0.403 J/(kg·K) |
| Thermal conductivity at 20°C | 385 W/m*K |
| Brazing | 1 |
| Soft soldering | 1 |
| Gas | 4 |
| Laser | 3 |
| MIG | 2 |
| Resistance spot welding | 5 |
| TIG | 2 |
| Aviation | No |
| Bi (from) | 0,0005 |
| Bi (to) | 0,0005 |
| Cu footnote reference | Einschließlich Silber bis max. 0,015 %. |
| Other | 0,03 |
| P (from) | 0,002 |
| P (to) | 0,007 |
| Pb (from) | 0,005 |
| Pb (to) | 0,005 |
| Rest | Cu |
| suitable according to DIN EN 602 | No |
| Material chemically EN 573-3 | SE-Cu (Cu-HCP) |
| Material no | CW021A |
| Coefficient of thermal expansion from 20 to 100°C | 16.9 K⁻¹10⁻⁶ |
| Coefficient of thermal expansion from 20 to 200°C | 17.3 K⁻¹10⁻⁶ |
| Coefficient of thermal expansion from 20 to 300°C | 17.6 K⁻¹10⁻⁶ |
| Density | 8.94 g/cm³ |
| Modulus of elasticity at 100°C | 119 GPa |
| Modulus of elasticity at 20°C | 115 GPa |
| Modulus of elasticity at 200°C | 91 GPa |
| Specific electrical conductivity at 100°C | 43.6 m/Ω*mm² |
| Specific electrical conductivity at 20°C | 57 m/Ω*mm² |
| Specific electrical conductivity at 200°C | 33.7 m/Ω*mm² |
| Specific electrical resistance at 100°C | 0.0229 Ω*mm²/m |
| Specific electrical resistance at 20°C | 0.0169 Ω*mm²/m |
| Specific electrical resistance at 200°C | 0.0297 Ω*mm²/m |
| Specific heat at 100°C | 0.393 J/(kg·K) |
| Specific heat at 20°C | 0.385 J/(kg·K) |
| Specific heat at 200°C | 0.403 J/(kg·K) |
| Thermal conductivity at 20°C | 385 W/m*K |
| Brazing | 1 |
| Soft soldering | 1 |
| Gas | 4 |
| Laser | 3 |
| MIG | 2 |
| Resistance spot welding | 5 |
| TIG | 2 |
| Aviation | No |
| Bi (from) | 0,0005 |
| Bi (to) | 0,0005 |
| Cu footnote reference | Einschließlich Silber bis max. 0,015 %. |
| Other | 0,03 |
| P (from) | 0,002 |
| P (to) | 0,007 |
| Pb (from) | 0,005 |
| Pb (to) | 0,005 |
| Rest | Cu |
| suitable according to DIN EN 602 | No |
| Material chemically EN 573-3 | SE-Cu (Cu-HCP) |
| Material no | CW021A |
| Coefficient of thermal expansion from 20 to 100°C | 16.9 K⁻¹10⁻⁶ |
| Coefficient of thermal expansion from 20 to 200°C | 17.3 K⁻¹10⁻⁶ |
| Coefficient of thermal expansion from 20 to 300°C | 17.6 K⁻¹10⁻⁶ |
| Density | 8.94 g/cm³ |
| Modulus of elasticity at 100°C | 119 GPa |
| Modulus of elasticity at 20°C | 115 GPa |
| Modulus of elasticity at 200°C | 91 GPa |
| Specific electrical conductivity at 100°C | 43.6 m/Ω*mm² |
| Specific electrical conductivity at 20°C | 57 m/Ω*mm² |
| Specific electrical conductivity at 200°C | 33.7 m/Ω*mm² |
| Specific electrical resistance at 100°C | 0.0229 Ω*mm²/m |
| Specific electrical resistance at 20°C | 0.0169 Ω*mm²/m |
| Specific electrical resistance at 200°C | 0.0297 Ω*mm²/m |
| Specific heat at 100°C | 0.393 J/(kg·K) |
| Specific heat at 20°C | 0.385 J/(kg·K) |
| Specific heat at 200°C | 0.403 J/(kg·K) |
| Thermal conductivity at 20°C | 385 W/m*K |
| Brazing | 1 |
| Soft soldering | 1 |
| Gas | 4 |
| Laser | 3 |
| MIG | 2 |
| Resistance spot welding | 5 |
| TIG | 2 |
| Aviation | No |
| Bi (from) | 0,0005 |
| Bi (to) | 0,0005 |
| Cu footnote reference | Einschließlich Silber bis max. 0,015 %. |
| Other | 0,03 |
| P (from) | 0,002 |
| P (to) | 0,007 |
| Pb (from) | 0,005 |
| Pb (to) | 0,005 |
| Rest | Cu |
| suitable according to DIN EN 602 | No |
| Material chemically EN 573-3 | SE-Cu (Cu-HCP) |
| Material no | CW021A |
| Coefficient of thermal expansion from 20 to 100°C | 16.9 K⁻¹10⁻⁶ |
| Coefficient of thermal expansion from 20 to 200°C | 17.3 K⁻¹10⁻⁶ |
| Coefficient of thermal expansion from 20 to 300°C | 17.6 K⁻¹10⁻⁶ |
| Density | 8.94 g/cm³ |
| Modulus of elasticity at 100°C | 119 GPa |
| Modulus of elasticity at 20°C | 115 GPa |
| Modulus of elasticity at 200°C | 91 GPa |
| Specific electrical conductivity at 100°C | 43.6 m/Ω*mm² |
| Specific electrical conductivity at 20°C | 57 m/Ω*mm² |
| Specific electrical conductivity at 200°C | 33.7 m/Ω*mm² |
| Specific electrical resistance at 100°C | 0.0229 Ω*mm²/m |
| Specific electrical resistance at 20°C | 0.0169 Ω*mm²/m |
| Specific electrical resistance at 200°C | 0.0297 Ω*mm²/m |
| Specific heat at 100°C | 0.393 J/(kg·K) |
| Specific heat at 20°C | 0.385 J/(kg·K) |
| Specific heat at 200°C | 0.403 J/(kg·K) |
| Thermal conductivity at 20°C | 385 W/m*K |
| Brazing | 1 |
| Soft soldering | 1 |
| Gas | 4 |
| Laser | 3 |
| MIG | 2 |
| Resistance spot welding | 5 |
| TIG | 2 |
| Aviation | No |
| Bi (from) | 0,0005 |
| Bi (to) | 0,0005 |
| Cu footnote reference | Einschließlich Silber bis max. 0,015 %. |
| Other | 0,03 |
| P (from) | 0,002 |
| P (to) | 0,007 |
| Pb (from) | 0,005 |
| Pb (to) | 0,005 |
| Rest | Cu |
| suitable according to DIN EN 602 | No |
| Material chemically EN 573-3 | SE-Cu (Cu-HCP) |
| Material no | CW021A |
| Coefficient of thermal expansion from 20 to 100°C | 16.9 K⁻¹10⁻⁶ |
| Coefficient of thermal expansion from 20 to 200°C | 17.3 K⁻¹10⁻⁶ |
| Coefficient of thermal expansion from 20 to 300°C | 17.6 K⁻¹10⁻⁶ |
| Density | 8.94 g/cm³ |
| Modulus of elasticity at 100°C | 119 GPa |
| Modulus of elasticity at 20°C | 115 GPa |
| Modulus of elasticity at 200°C | 91 GPa |
| Specific electrical conductivity at 100°C | 43.6 m/Ω*mm² |
| Specific electrical conductivity at 20°C | 57 m/Ω*mm² |
| Specific electrical conductivity at 200°C | 33.7 m/Ω*mm² |
| Specific electrical resistance at 100°C | 0.0229 Ω*mm²/m |
| Specific electrical resistance at 20°C | 0.0169 Ω*mm²/m |
| Specific electrical resistance at 200°C | 0.0297 Ω*mm²/m |
| Specific heat at 100°C | 0.393 J/(kg·K) |
| Specific heat at 20°C | 0.385 J/(kg·K) |
| Specific heat at 200°C | 0.403 J/(kg·K) |
| Thermal conductivity at 20°C | 385 W/m*K |
| Brazing | 1 |
| Soft soldering | 1 |
| Gas | 4 |
| Laser | 3 |
| MIG | 2 |
| Resistance spot welding | 5 |
| TIG | 2 |
| Aviation | No |
| Bi (from) | 0,0005 |
| Bi (to) | 0,0005 |
| Cu footnote reference | Einschließlich Silber bis max. 0,015 %. |
| Other | 0,03 |
| P (from) | 0,002 |
| P (to) | 0,007 |
| Pb (from) | 0,005 |
| Pb (to) | 0,005 |
| Rest | Cu |
| suitable according to DIN EN 602 | No |
| Material chemically EN 573-3 | SE-Cu (Cu-HCP) |
| Material no | CW021A |
| Coefficient of thermal expansion from 20 to 100°C | 16.9 K⁻¹10⁻⁶ |
| Coefficient of thermal expansion from 20 to 200°C | 17.3 K⁻¹10⁻⁶ |
| Coefficient of thermal expansion from 20 to 300°C | 17.6 K⁻¹10⁻⁶ |
| Density | 8.94 g/cm³ |
| Modulus of elasticity at 100°C | 119 GPa |
| Modulus of elasticity at 20°C | 115 GPa |
| Modulus of elasticity at 200°C | 91 GPa |
| Specific electrical conductivity at 100°C | 43.6 m/Ω*mm² |
| Specific electrical conductivity at 20°C | 57 m/Ω*mm² |
| Specific electrical conductivity at 200°C | 33.7 m/Ω*mm² |
| Specific electrical resistance at 100°C | 0.0229 Ω*mm²/m |
| Specific electrical resistance at 20°C | 0.0169 Ω*mm²/m |
| Specific electrical resistance at 200°C | 0.0297 Ω*mm²/m |
| Specific heat at 100°C | 0.393 J/(kg·K) |
| Specific heat at 20°C | 0.385 J/(kg·K) |
| Specific heat at 200°C | 0.403 J/(kg·K) |
| Thermal conductivity at 20°C | 385 W/m*K |
| Brazing | 1 |
| Soft soldering | 1 |
| Gas | 4 |
| Laser | 3 |
| MIG | 2 |
| Resistance spot welding | 5 |
| TIG | 2 |
| Aviation | No |
| Bi (from) | 0,0005 |
| Bi (to) | 0,0005 |
| Cu footnote reference | Einschließlich Silber bis max. 0,015 %. |
| Other | 0,03 |
| P (from) | 0,002 |
| P (to) | 0,007 |
| Pb (from) | 0,005 |
| Pb (to) | 0,005 |
| Rest | Cu |
| suitable according to DIN EN 602 | No |
| Material chemically EN 573-3 | SE-Cu (Cu-HCP) |
| Material no | CW021A |
| Coefficient of thermal expansion from 20 to 100°C | 16.9 K⁻¹10⁻⁶ |
| Coefficient of thermal expansion from 20 to 200°C | 17.3 K⁻¹10⁻⁶ |
| Coefficient of thermal expansion from 20 to 300°C | 17.6 K⁻¹10⁻⁶ |
| Density | 8.94 g/cm³ |
| Modulus of elasticity at 100°C | 119 GPa |
| Modulus of elasticity at 20°C | 115 GPa |
| Modulus of elasticity at 200°C | 91 GPa |
| Specific electrical conductivity at 100°C | 43.6 m/Ω*mm² |
| Specific electrical conductivity at 20°C | 57 m/Ω*mm² |
| Specific electrical conductivity at 200°C | 33.7 m/Ω*mm² |
| Specific electrical resistance at 100°C | 0.0229 Ω*mm²/m |
| Specific electrical resistance at 20°C | 0.0169 Ω*mm²/m |
| Specific electrical resistance at 200°C | 0.0297 Ω*mm²/m |
| Specific heat at 100°C | 0.393 J/(kg·K) |
| Specific heat at 20°C | 0.385 J/(kg·K) |
| Specific heat at 200°C | 0.403 J/(kg·K) |
| Thermal conductivity at 20°C | 385 W/m*K |
| Brazing | 1 |
| Soft soldering | 1 |
| Gas | 4 |
| Laser | 3 |
| MIG | 2 |
| Resistance spot welding | 5 |
| TIG | 2 |
| Aviation | No |
| Bi (from) | 0,0005 |
| Bi (to) | 0,0005 |
| Cu footnote reference | Einschließlich Silber bis max. 0,015 %. |
| Other | 0,03 |
| P (from) | 0,002 |
| P (to) | 0,007 |
| Pb (from) | 0,005 |
| Pb (to) | 0,005 |
| Rest | Cu |
| suitable according to DIN EN 602 | No |
| Material chemically EN 573-3 | SE-Cu (Cu-HCP) |
| Material no | CW021A |
| Coefficient of thermal expansion from 20 to 100°C | 16.9 K⁻¹10⁻⁶ |
| Coefficient of thermal expansion from 20 to 200°C | 17.3 K⁻¹10⁻⁶ |
| Coefficient of thermal expansion from 20 to 300°C | 17.6 K⁻¹10⁻⁶ |
| Density | 8.94 g/cm³ |
| Modulus of elasticity at 100°C | 119 GPa |
| Modulus of elasticity at 20°C | 115 GPa |
| Modulus of elasticity at 200°C | 91 GPa |
| Specific electrical conductivity at 100°C | 43.6 m/Ω*mm² |
| Specific electrical conductivity at 20°C | 57 m/Ω*mm² |
| Specific electrical conductivity at 200°C | 33.7 m/Ω*mm² |
| Specific electrical resistance at 100°C | 0.0229 Ω*mm²/m |
| Specific electrical resistance at 20°C | 0.0169 Ω*mm²/m |
| Specific electrical resistance at 200°C | 0.0297 Ω*mm²/m |
| Specific heat at 100°C | 0.393 J/(kg·K) |
| Specific heat at 20°C | 0.385 J/(kg·K) |
| Specific heat at 200°C | 0.403 J/(kg·K) |
| Thermal conductivity at 20°C | 385 W/m*K |
| Brazing | 1 |
| Soft soldering | 1 |
| Gas | 4 |
| Laser | 3 |
| MIG | 2 |
| Resistance spot welding | 5 |
| TIG | 2 |
1 very good
2 good
3 moderate
4 poor
5 unsuited
0 Not specified
