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CW021A

plate - forged

[103_025]
  • Form plate - forged
  • Material Copper
  • Material CW021A
  • Material chemically EN 573-3 SE-Cu (Cu-HCP)

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[103_025]
[103_025]

Areas of application

Conductors for electronics and electrical engineering

Superconductor matrices

Moulds for continuous casting

Areas of application

Cold extrusion parts

Pressure vessels

Busbars, busbars and feeder bars

Areas of application

Parts where good brazing and welding properties are required, e.g.

Features of this material

  • very good cold forming
  • good hot forming
  • good resistance in natural atmosphere (also sea air) and industrial atmosphere

Features of this material

  • practically insensitive to stress corrosion cracking

Information about the material

  • Aviation
    Aviation No
  • Chemical specifications
    Bi (from) 0.0005
    Bi (to) 0.0005
    Cu footnote reference Einschließlich Silber bis max. 0,015 %.
    Other 0.03
    P (from) 0.002
    P (to) 0.007
    Pb (from) 0.005
    Pb (to) 0.005
    Rest Cu
  • Food industry
    suitable according to DIN EN 602 No
  • Material
    Material chemically EN 573-3 SE-Cu (Cu-HCP)
    Material no CW021A
  • physical properties
    Coefficient of thermal expansion from 20 to 100°C 16.9 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 200°C 17.3 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 300°C 17.6 K⁻¹10⁻⁶
    Density 8.94 g/cm³
    Modulus of elasticity at 100°C 119 GPa
    Modulus of elasticity at 20°C 115 GPa
    Modulus of elasticity at 200°C 91 GPa
    Specific electrical conductivity at 100°C 43.6 m/Ω*mm²
    Specific electrical conductivity at 20°C 57 m/Ω*mm²
    Specific electrical conductivity at 200°C 33.7 m/Ω*mm²
    Specific electrical resistance at 100°C 0.0229 Ω*mm²/m
    Specific electrical resistance at 20°C 0.0169 Ω*mm²/m
    Specific electrical resistance at 200°C 0.0297 Ω*mm²/m
    Specific heat at 100°C 0.393 J/(kg·K)
    Specific heat at 20°C 0.385 J/(kg·K)
    Specific heat at 200°C 0.403 J/(kg·K)
    Thermal conductivity at 20°C 385 W/m*K
  • Soldering
    Brazing 1
    Soft soldering 1
  • Welding
    Gas 4
    Laser 3
    MIG 2
    Resistance spot welding 5
    TIG 2
  • Aviation
    Aviation No
  • Chemical specifications
    Bi (from) 0.0005
    Bi (to) 0.0005
    Cu footnote reference Einschließlich Silber bis max. 0,015 %.
    Other 0.03
    P (from) 0.002
    P (to) 0.007
    Pb (from) 0.005
    Pb (to) 0.005
    Rest Cu
  • Food industry
    suitable according to DIN EN 602 No
  • Material
    Material chemically EN 573-3 SE-Cu (Cu-HCP)
    Material no CW021A
  • physical properties
    Coefficient of thermal expansion from 20 to 100°C 16.9 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 200°C 17.3 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 300°C 17.6 K⁻¹10⁻⁶
    Density 8.94 g/cm³
    Modulus of elasticity at 100°C 119 GPa
    Modulus of elasticity at 20°C 115 GPa
    Modulus of elasticity at 200°C 91 GPa
    Specific electrical conductivity at 100°C 43.6 m/Ω*mm²
    Specific electrical conductivity at 20°C 57 m/Ω*mm²
    Specific electrical conductivity at 200°C 33.7 m/Ω*mm²
    Specific electrical resistance at 100°C 0.0229 Ω*mm²/m
    Specific electrical resistance at 20°C 0.0169 Ω*mm²/m
    Specific electrical resistance at 200°C 0.0297 Ω*mm²/m
    Specific heat at 100°C 0.393 J/(kg·K)
    Specific heat at 20°C 0.385 J/(kg·K)
    Specific heat at 200°C 0.403 J/(kg·K)
    Thermal conductivity at 20°C 385 W/m*K
  • Soldering
    Brazing 1
    Soft soldering 1
  • Welding
    Gas 4
    Laser 3
    MIG 2
    Resistance spot welding 5
    TIG 2
  • Aviation
    Aviation No
  • Chemical specifications
    Bi (from) 0.0005
    Bi (to) 0.0005
    Cu footnote reference Einschließlich Silber bis max. 0,015 %.
    Other 0.03
    P (from) 0.002
    P (to) 0.007
    Pb (from) 0.005
    Pb (to) 0.005
    Rest Cu
  • Food industry
    suitable according to DIN EN 602 No
  • Material
    Material chemically EN 573-3 SE-Cu (Cu-HCP)
    Material no CW021A
  • physical properties
    Coefficient of thermal expansion from 20 to 100°C 16.9 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 200°C 17.3 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 300°C 17.6 K⁻¹10⁻⁶
    Density 8.94 g/cm³
    Modulus of elasticity at 100°C 119 GPa
    Modulus of elasticity at 20°C 115 GPa
    Modulus of elasticity at 200°C 91 GPa
    Specific electrical conductivity at 100°C 43.6 m/Ω*mm²
    Specific electrical conductivity at 20°C 57 m/Ω*mm²
    Specific electrical conductivity at 200°C 33.7 m/Ω*mm²
    Specific electrical resistance at 100°C 0.0229 Ω*mm²/m
    Specific electrical resistance at 20°C 0.0169 Ω*mm²/m
    Specific electrical resistance at 200°C 0.0297 Ω*mm²/m
    Specific heat at 100°C 0.393 J/(kg·K)
    Specific heat at 20°C 0.385 J/(kg·K)
    Specific heat at 200°C 0.403 J/(kg·K)
    Thermal conductivity at 20°C 385 W/m*K
  • Soldering
    Brazing 1
    Soft soldering 1
  • Welding
    Gas 4
    Laser 3
    MIG 2
    Resistance spot welding 5
    TIG 2
  • Aviation
    Aviation No
  • Chemical specifications
    Bi (from) 0.0005
    Bi (to) 0.0005
    Cu footnote reference Einschließlich Silber bis max. 0,015 %.
    Other 0.03
    P (from) 0.002
    P (to) 0.007
    Pb (from) 0.005
    Pb (to) 0.005
    Rest Cu
  • Food industry
    suitable according to DIN EN 602 No
  • Material
    Material chemically EN 573-3 SE-Cu (Cu-HCP)
    Material no CW021A
  • physical properties
    Coefficient of thermal expansion from 20 to 100°C 16.9 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 200°C 17.3 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 300°C 17.6 K⁻¹10⁻⁶
    Density 8.94 g/cm³
    Modulus of elasticity at 100°C 119 GPa
    Modulus of elasticity at 20°C 115 GPa
    Modulus of elasticity at 200°C 91 GPa
    Specific electrical conductivity at 100°C 43.6 m/Ω*mm²
    Specific electrical conductivity at 20°C 57 m/Ω*mm²
    Specific electrical conductivity at 200°C 33.7 m/Ω*mm²
    Specific electrical resistance at 100°C 0.0229 Ω*mm²/m
    Specific electrical resistance at 20°C 0.0169 Ω*mm²/m
    Specific electrical resistance at 200°C 0.0297 Ω*mm²/m
    Specific heat at 100°C 0.393 J/(kg·K)
    Specific heat at 20°C 0.385 J/(kg·K)
    Specific heat at 200°C 0.403 J/(kg·K)
    Thermal conductivity at 20°C 385 W/m*K
  • Soldering
    Brazing 1
    Soft soldering 1
  • Welding
    Gas 4
    Laser 3
    MIG 2
    Resistance spot welding 5
    TIG 2
  • Aviation
    Aviation No
  • Chemical specifications
    Bi (from) 0.0005
    Bi (to) 0.0005
    Cu footnote reference Einschließlich Silber bis max. 0,015 %.
    Other 0.03
    P (from) 0.002
    P (to) 0.007
    Pb (from) 0.005
    Pb (to) 0.005
    Rest Cu
  • Food industry
    suitable according to DIN EN 602 No
  • Material
    Material chemically EN 573-3 SE-Cu (Cu-HCP)
    Material no CW021A
  • physical properties
    Coefficient of thermal expansion from 20 to 100°C 16.9 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 200°C 17.3 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 300°C 17.6 K⁻¹10⁻⁶
    Density 8.94 g/cm³
    Modulus of elasticity at 100°C 119 GPa
    Modulus of elasticity at 20°C 115 GPa
    Modulus of elasticity at 200°C 91 GPa
    Specific electrical conductivity at 100°C 43.6 m/Ω*mm²
    Specific electrical conductivity at 20°C 57 m/Ω*mm²
    Specific electrical conductivity at 200°C 33.7 m/Ω*mm²
    Specific electrical resistance at 100°C 0.0229 Ω*mm²/m
    Specific electrical resistance at 20°C 0.0169 Ω*mm²/m
    Specific electrical resistance at 200°C 0.0297 Ω*mm²/m
    Specific heat at 100°C 0.393 J/(kg·K)
    Specific heat at 20°C 0.385 J/(kg·K)
    Specific heat at 200°C 0.403 J/(kg·K)
    Thermal conductivity at 20°C 385 W/m*K
  • Soldering
    Brazing 1
    Soft soldering 1
  • Welding
    Gas 4
    Laser 3
    MIG 2
    Resistance spot welding 5
    TIG 2
  • Aviation
    Aviation No
  • Chemical specifications
    Bi (from) 0.0005
    Bi (to) 0.0005
    Cu footnote reference Einschließlich Silber bis max. 0,015 %.
    Other 0.03
    P (from) 0.002
    P (to) 0.007
    Pb (from) 0.005
    Pb (to) 0.005
    Rest Cu
  • Food industry
    suitable according to DIN EN 602 No
  • Material
    Material chemically EN 573-3 SE-Cu (Cu-HCP)
    Material no CW021A
  • physical properties
    Coefficient of thermal expansion from 20 to 100°C 16.9 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 200°C 17.3 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 300°C 17.6 K⁻¹10⁻⁶
    Density 8.94 g/cm³
    Modulus of elasticity at 100°C 119 GPa
    Modulus of elasticity at 20°C 115 GPa
    Modulus of elasticity at 200°C 91 GPa
    Specific electrical conductivity at 100°C 43.6 m/Ω*mm²
    Specific electrical conductivity at 20°C 57 m/Ω*mm²
    Specific electrical conductivity at 200°C 33.7 m/Ω*mm²
    Specific electrical resistance at 100°C 0.0229 Ω*mm²/m
    Specific electrical resistance at 20°C 0.0169 Ω*mm²/m
    Specific electrical resistance at 200°C 0.0297 Ω*mm²/m
    Specific heat at 100°C 0.393 J/(kg·K)
    Specific heat at 20°C 0.385 J/(kg·K)
    Specific heat at 200°C 0.403 J/(kg·K)
    Thermal conductivity at 20°C 385 W/m*K
  • Soldering
    Brazing 1
    Soft soldering 1
  • Welding
    Gas 4
    Laser 3
    MIG 2
    Resistance spot welding 5
    TIG 2
  • Aviation
    Aviation No
  • Chemical specifications
    Bi (from) 0.0005
    Bi (to) 0.0005
    Cu footnote reference Einschließlich Silber bis max. 0,015 %.
    Other 0.03
    P (from) 0.002
    P (to) 0.007
    Pb (from) 0.005
    Pb (to) 0.005
    Rest Cu
  • Food industry
    suitable according to DIN EN 602 No
  • Material
    Material chemically EN 573-3 SE-Cu (Cu-HCP)
    Material no CW021A
  • physical properties
    Coefficient of thermal expansion from 20 to 100°C 16.9 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 200°C 17.3 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 300°C 17.6 K⁻¹10⁻⁶
    Density 8.94 g/cm³
    Modulus of elasticity at 100°C 119 GPa
    Modulus of elasticity at 20°C 115 GPa
    Modulus of elasticity at 200°C 91 GPa
    Specific electrical conductivity at 100°C 43.6 m/Ω*mm²
    Specific electrical conductivity at 20°C 57 m/Ω*mm²
    Specific electrical conductivity at 200°C 33.7 m/Ω*mm²
    Specific electrical resistance at 100°C 0.0229 Ω*mm²/m
    Specific electrical resistance at 20°C 0.0169 Ω*mm²/m
    Specific electrical resistance at 200°C 0.0297 Ω*mm²/m
    Specific heat at 100°C 0.393 J/(kg·K)
    Specific heat at 20°C 0.385 J/(kg·K)
    Specific heat at 200°C 0.403 J/(kg·K)
    Thermal conductivity at 20°C 385 W/m*K
  • Soldering
    Brazing 1
    Soft soldering 1
  • Welding
    Gas 4
    Laser 3
    MIG 2
    Resistance spot welding 5
    TIG 2
  • Aviation
    Aviation No
  • Chemical specifications
    Bi (from) 0.0005
    Bi (to) 0.0005
    Cu footnote reference Einschließlich Silber bis max. 0,015 %.
    Other 0.03
    P (from) 0.002
    P (to) 0.007
    Pb (from) 0.005
    Pb (to) 0.005
    Rest Cu
  • Food industry
    suitable according to DIN EN 602 No
  • Material
    Material chemically EN 573-3 SE-Cu (Cu-HCP)
    Material no CW021A
  • physical properties
    Coefficient of thermal expansion from 20 to 100°C 16.9 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 200°C 17.3 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 300°C 17.6 K⁻¹10⁻⁶
    Density 8.94 g/cm³
    Modulus of elasticity at 100°C 119 GPa
    Modulus of elasticity at 20°C 115 GPa
    Modulus of elasticity at 200°C 91 GPa
    Specific electrical conductivity at 100°C 43.6 m/Ω*mm²
    Specific electrical conductivity at 20°C 57 m/Ω*mm²
    Specific electrical conductivity at 200°C 33.7 m/Ω*mm²
    Specific electrical resistance at 100°C 0.0229 Ω*mm²/m
    Specific electrical resistance at 20°C 0.0169 Ω*mm²/m
    Specific electrical resistance at 200°C 0.0297 Ω*mm²/m
    Specific heat at 100°C 0.393 J/(kg·K)
    Specific heat at 20°C 0.385 J/(kg·K)
    Specific heat at 200°C 0.403 J/(kg·K)
    Thermal conductivity at 20°C 385 W/m*K
  • Soldering
    Brazing 1
    Soft soldering 1
  • Welding
    Gas 4
    Laser 3
    MIG 2
    Resistance spot welding 5
    TIG 2
  • Aviation
    Aviation No
  • Chemical specifications
    Bi (from) 0.0005
    Bi (to) 0.0005
    Cu footnote reference Einschließlich Silber bis max. 0,015 %.
    Other 0.03
    P (from) 0.002
    P (to) 0.007
    Pb (from) 0.005
    Pb (to) 0.005
    Rest Cu
  • Food industry
    suitable according to DIN EN 602 No
  • Material
    Material chemically EN 573-3 SE-Cu (Cu-HCP)
    Material no CW021A
  • physical properties
    Coefficient of thermal expansion from 20 to 100°C 16.9 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 200°C 17.3 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 300°C 17.6 K⁻¹10⁻⁶
    Density 8.94 g/cm³
    Modulus of elasticity at 100°C 119 GPa
    Modulus of elasticity at 20°C 115 GPa
    Modulus of elasticity at 200°C 91 GPa
    Specific electrical conductivity at 100°C 43.6 m/Ω*mm²
    Specific electrical conductivity at 20°C 57 m/Ω*mm²
    Specific electrical conductivity at 200°C 33.7 m/Ω*mm²
    Specific electrical resistance at 100°C 0.0229 Ω*mm²/m
    Specific electrical resistance at 20°C 0.0169 Ω*mm²/m
    Specific electrical resistance at 200°C 0.0297 Ω*mm²/m
    Specific heat at 100°C 0.393 J/(kg·K)
    Specific heat at 20°C 0.385 J/(kg·K)
    Specific heat at 200°C 0.403 J/(kg·K)
    Thermal conductivity at 20°C 385 W/m*K
  • Soldering
    Brazing 1
    Soft soldering 1
  • Welding
    Gas 4
    Laser 3
    MIG 2
    Resistance spot welding 5
    TIG 2
  • Aviation
    Aviation No
  • Chemical specifications
    Bi (from) 0.0005
    Bi (to) 0.0005
    Cu footnote reference Einschließlich Silber bis max. 0,015 %.
    Other 0.03
    P (from) 0.002
    P (to) 0.007
    Pb (from) 0.005
    Pb (to) 0.005
    Rest Cu
  • Food industry
    suitable according to DIN EN 602 No
  • Material
    Material chemically EN 573-3 SE-Cu (Cu-HCP)
    Material no CW021A
  • physical properties
    Coefficient of thermal expansion from 20 to 100°C 16.9 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 200°C 17.3 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 300°C 17.6 K⁻¹10⁻⁶
    Density 8.94 g/cm³
    Modulus of elasticity at 100°C 119 GPa
    Modulus of elasticity at 20°C 115 GPa
    Modulus of elasticity at 200°C 91 GPa
    Specific electrical conductivity at 100°C 43.6 m/Ω*mm²
    Specific electrical conductivity at 20°C 57 m/Ω*mm²
    Specific electrical conductivity at 200°C 33.7 m/Ω*mm²
    Specific electrical resistance at 100°C 0.0229 Ω*mm²/m
    Specific electrical resistance at 20°C 0.0169 Ω*mm²/m
    Specific electrical resistance at 200°C 0.0297 Ω*mm²/m
    Specific heat at 100°C 0.393 J/(kg·K)
    Specific heat at 20°C 0.385 J/(kg·K)
    Specific heat at 200°C 0.403 J/(kg·K)
    Thermal conductivity at 20°C 385 W/m*K
  • Soldering
    Brazing 1
    Soft soldering 1
  • Welding
    Gas 4
    Laser 3
    MIG 2
    Resistance spot welding 5
    TIG 2
  • Aviation
    Aviation No
  • Chemical specifications
    Bi (from) 0.0005
    Bi (to) 0.0005
    Cu footnote reference Einschließlich Silber bis max. 0,015 %.
    Other 0.03
    P (from) 0.002
    P (to) 0.007
    Pb (from) 0.005
    Pb (to) 0.005
    Rest Cu
  • Food industry
    suitable according to DIN EN 602 No
  • Material
    Material chemically EN 573-3 SE-Cu (Cu-HCP)
    Material no CW021A
  • physical properties
    Coefficient of thermal expansion from 20 to 100°C 16.9 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 200°C 17.3 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 300°C 17.6 K⁻¹10⁻⁶
    Density 8.94 g/cm³
    Modulus of elasticity at 100°C 119 GPa
    Modulus of elasticity at 20°C 115 GPa
    Modulus of elasticity at 200°C 91 GPa
    Specific electrical conductivity at 100°C 43.6 m/Ω*mm²
    Specific electrical conductivity at 20°C 57 m/Ω*mm²
    Specific electrical conductivity at 200°C 33.7 m/Ω*mm²
    Specific electrical resistance at 100°C 0.0229 Ω*mm²/m
    Specific electrical resistance at 20°C 0.0169 Ω*mm²/m
    Specific electrical resistance at 200°C 0.0297 Ω*mm²/m
    Specific heat at 100°C 0.393 J/(kg·K)
    Specific heat at 20°C 0.385 J/(kg·K)
    Specific heat at 200°C 0.403 J/(kg·K)
    Thermal conductivity at 20°C 385 W/m*K
  • Soldering
    Brazing 1
    Soft soldering 1
  • Welding
    Gas 4
    Laser 3
    MIG 2
    Resistance spot welding 5
    TIG 2
  • Aviation
    Aviation No
  • Chemical specifications
    Bi (from) 0.0005
    Bi (to) 0.0005
    Cu footnote reference Einschließlich Silber bis max. 0,015 %.
    Other 0.03
    P (from) 0.002
    P (to) 0.007
    Pb (from) 0.005
    Pb (to) 0.005
    Rest Cu
  • Food industry
    suitable according to DIN EN 602 No
  • Material
    Material chemically EN 573-3 SE-Cu (Cu-HCP)
    Material no CW021A
  • physical properties
    Coefficient of thermal expansion from 20 to 100°C 16.9 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 200°C 17.3 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 300°C 17.6 K⁻¹10⁻⁶
    Density 8.94 g/cm³
    Modulus of elasticity at 100°C 119 GPa
    Modulus of elasticity at 20°C 115 GPa
    Modulus of elasticity at 200°C 91 GPa
    Specific electrical conductivity at 100°C 43.6 m/Ω*mm²
    Specific electrical conductivity at 20°C 57 m/Ω*mm²
    Specific electrical conductivity at 200°C 33.7 m/Ω*mm²
    Specific electrical resistance at 100°C 0.0229 Ω*mm²/m
    Specific electrical resistance at 20°C 0.0169 Ω*mm²/m
    Specific electrical resistance at 200°C 0.0297 Ω*mm²/m
    Specific heat at 100°C 0.393 J/(kg·K)
    Specific heat at 20°C 0.385 J/(kg·K)
    Specific heat at 200°C 0.403 J/(kg·K)
    Thermal conductivity at 20°C 385 W/m*K
  • Soldering
    Brazing 1
    Soft soldering 1
  • Welding
    Gas 4
    Laser 3
    MIG 2
    Resistance spot welding 5
    TIG 2

1 very good
2 good
3 moderate
4 poor
5 unsuited
0 Not specified

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