-
Aviation
-
Chemical specifications
Al (from)
|
0.01
|
Al (to)
|
0.01
|
Cu (from)
|
83.5
|
Cu (to)
|
87
|
Mn (from)
|
0.2
|
Mn (to)
|
0.2
|
Ni (to)
|
2
|
P (to)
|
0.4
|
Pb (from)
|
0.7
|
Pb (to)
|
2.5
|
S (from)
|
0.08
|
S (to)
|
0.08
|
Sb (from)
|
0.2
|
Sb (to)
|
0.2
|
Si (from)
|
0.01
|
Si (to)
|
0.01
|
Sn (from)
|
10
|
Sn (to)
|
12.5
|
Zn (to)
|
2
|
-
Food industry
suitable according to DIN EN 602
|
No
|
-
Material
Material chemically EN 573-3
|
Cu Sn 12 Pb
|
Material no
|
CC482K
|
-
physical properties
Coefficient of thermal expansion from 20 to 100°C
|
16.9 K⁻¹10⁻⁶
|
Coefficient of thermal expansion from 20 to 200°C
|
17.2 K⁻¹10⁻⁶
|
Coefficient of thermal expansion from 20 to 300°C
|
17.6 K⁻¹10⁻⁶
|
Coefficient of thermal expansion from 20 to 400°C
|
18 K⁻¹10⁻⁶
|
Density
|
8.75 g/cm³
|
Modulus of elasticity at 100°C
|
93 GPa
|
Modulus of elasticity at 20°C
|
95 GPa
|
Modulus of elasticity at 200°C
|
90 GPa
|
Modulus of elasticity at 300°C
|
87 GPa
|
Specific electrical conductivity at 20°C
|
6.1 m/Ω*mm²
|
Specific electrical conductivity at 200°C
|
5.2 m/Ω*mm²
|
Specific electrical resistance at 20°C
|
0.164 Ω*mm²/m
|
Specific electrical resistance at 200°C
|
0.192 Ω*mm²/m
|
Specific heat at 100°C
|
0.385 J/(kg·K)
|
Specific heat at 20°C
|
0.376 J/(kg·K)
|
Specific heat at 200°C
|
0.395 J/(kg·K)
|
Thermal conductivity at 100°C
|
58 W/m*K
|
Thermal conductivity at 20°C
|
51 W/m*K
|
Thermal conductivity at 200°C
|
66 W/m*K
|
-
Soldering
Brazing
|
3
|
Soft soldering
|
2
|
-
Welding
Gas
|
6
|
MIG
|
3
|
Resistance spot welding
|
3
|
TIG
|
3
|
-
Aviation
-
Chemical specifications
Al (from)
|
0.01
|
Al (to)
|
0.01
|
Cu (from)
|
83.5
|
Cu (to)
|
87
|
Mn (from)
|
0.2
|
Mn (to)
|
0.2
|
Ni (to)
|
2
|
P (to)
|
0.4
|
Pb (from)
|
0.7
|
Pb (to)
|
2.5
|
S (from)
|
0.08
|
S (to)
|
0.08
|
Sb (from)
|
0.2
|
Sb (to)
|
0.2
|
Si (from)
|
0.01
|
Si (to)
|
0.01
|
Sn (from)
|
10
|
Sn (to)
|
12.5
|
Zn (to)
|
2
|
-
Food industry
suitable according to DIN EN 602
|
No
|
-
Material
Material chemically EN 573-3
|
Cu Sn 12 Pb
|
Material no
|
CC482K
|
-
physical properties
Coefficient of thermal expansion from 20 to 100°C
|
16.9 K⁻¹10⁻⁶
|
Coefficient of thermal expansion from 20 to 200°C
|
17.2 K⁻¹10⁻⁶
|
Coefficient of thermal expansion from 20 to 300°C
|
17.6 K⁻¹10⁻⁶
|
Coefficient of thermal expansion from 20 to 400°C
|
18 K⁻¹10⁻⁶
|
Density
|
8.75 g/cm³
|
Modulus of elasticity at 100°C
|
93 GPa
|
Modulus of elasticity at 20°C
|
95 GPa
|
Modulus of elasticity at 200°C
|
90 GPa
|
Modulus of elasticity at 300°C
|
87 GPa
|
Specific electrical conductivity at 20°C
|
6.1 m/Ω*mm²
|
Specific electrical conductivity at 200°C
|
5.2 m/Ω*mm²
|
Specific electrical resistance at 20°C
|
0.164 Ω*mm²/m
|
Specific electrical resistance at 200°C
|
0.192 Ω*mm²/m
|
Specific heat at 100°C
|
0.385 J/(kg·K)
|
Specific heat at 20°C
|
0.376 J/(kg·K)
|
Specific heat at 200°C
|
0.395 J/(kg·K)
|
Thermal conductivity at 100°C
|
58 W/m*K
|
Thermal conductivity at 20°C
|
51 W/m*K
|
Thermal conductivity at 200°C
|
66 W/m*K
|
-
Soldering
Brazing
|
3
|
Soft soldering
|
2
|
-
Welding
Gas
|
6
|
MIG
|
3
|
Resistance spot welding
|
3
|
TIG
|
3
|
1 very good
2 good
3 moderate
4 poor
5 unsuited
0 Not specified