EN AW-6061
circular blank
![A technical illustration of the product with dimensions of the material EN AW-6061 from the material Aluminum in the shape circular blank](https://my.bikar.com/media/cache/sylius_shop_product_detail_pictogram_thumbnail/92/c8/6af823a0c47c1667653a8400f62c.jpg)
- Form circular blank
- Material Aluminum
- Material EN AW-6061
- Material chemically EN 573-3 Al Mg1 Si Cu
- DIN 3.3211
![An image of the material EN AW-6061 from the material Aluminum in the shape circular blank](https://my.bikar.com/media/cache/sylius_shop_product_detail_mainimage_thumbnail/33/bb/cd9a3b8f5cf3306762ee4d90422e.jpg)
![A technical illustration of the product of the material EN AW-6061 from the material Aluminum in the shape circular blank](https://my.bikar.com/media/cache/sylius_shop_product_detail_media_medium_thumbnail/77/fe/c9543d7654780baf57e9f58c3b2b.jpg)
BIKAR Metals companies
Shipbuilding
Railed vehicles
Boiler and container construction
Aerospace
Military technology
Aviation | No |
Cr (from) | 0.04 |
Cr (to) | 0.35 |
Cu (from) | 0.15 |
Cu (to) | 0.4 |
Fe (to) | 0.7 |
Mg (from) | 0.8 |
Mg (to) | 1.2 |
Mn (to) | 0.15 |
Other | 0,05 |
Rest | Aluminium |
Si (from) | 0.4 |
Si (to) | 0.8 |
Ti (to) | 0.15 |
Total | 0,15 |
Zn (to) | 0.25 |
(a) Includes all listed elements for which no limits are specified. (b) The sum of these "other impurities" whose mass fraction is individually 0,010 % or more is expressed with two decimal places before the summation.
Anodise - decorative | 3 |
Anodising - protective anodising | 1 |
Chromating | 2 |
Cleaning / degreasing | 2 |
Hard anodising | 2 |
Phosphating | 2 |
Pickling | 2 |
Shining | 3 |
Normal atmosphere | 2 |
Seawater atmosphere | 2 |
Laser cutting | 3 |
Plasma cutting | 2 |
Sawing | 2 |
Shear cutting | 2 |
Waterjet cutting | 1 |
suitable according to DIN EN 602 | Yes |
Bending | 3 |
Bending delivery conditions | T3 · T4 |
Deep drawing (conditional) | 2 |
Deep drawing conditions | O |
Drop forging | 2 |
Extruding | 2 |
Impact extrusion | 2 |
Impact extrusion conditions | O |
Open die forging | 2 |
Press | 2 |
Press conditions | O |
Upsetting (Conditional) | 2 |
Upsetting conditions | O |
Heating time max. | 2 h |
Heating time min. | 1 h |
Annealing temperature max. | 420 °C |
Annealing temperature min. | 380 °C |
Cooling conditions |
Cooling conditions 30°C/h to 250°C, below 250°C in air |
Cold ageing max. | 8 d |
Cold ageing min. | 5 d |
Heat ageing max. | 16 h |
Heat ageing min. | 4 h |
Heating temperature max. | 190 °C |
Heating temperature min. | 155 °C |
Quenching | water |
Solution annealing max. | 540 °C |
Solution annealing min. | 525 °C |
Eroding | 1 |
Etching | 2 |
hardened | 2 |
Photo etching | 2 |
soft annealed | 4 |
Material chemically EN 573-3 | Al Mg1 Si Cu |
DIN | 3.3211 |
DIN (old designation) | Al Mg1 Si Cu |
France AFNOR | A-GSUC |
Italy UNI | 9006/2 |
Norway | - |
Spain | L-3420 |
Sweden | - |
United Kingdom BS | H20 |
Blasting | 1 |
Brushing | 2 |
Dessinating | 1 |
Grinding | 2 |
Polishing | 1 |
Galvanising | 2 |
Nickel coating | 2 |
Thermal spraying | 4 |
Enamelling | 4 |
Laminating | 2 |
Painting / Coating | 2 |
Coefficient of thermal expansion from 20 to 100°C | 23 K⁻¹10⁻⁶ |
Density | 2.7 g/cm³ |
Electrical conductivity max. | 30 m/Ω*mm² |
Electrical conductivity min. | 22 m/Ω*mm² |
Modulus of elasticity | 70 GPa |
Shear modulus | 26.3 GPa |
Thermal conductivity max. | 200 W/m*K |
Thermal conductivity min. | 170 W/m*K |
Brazing | 4 |
Brazing with flux | 3 |
Friction soldering | 2 |
Soft soldering | 3 |
Soft soldering with flux | 3 |
Friction stir welding | 2 |
Friction welding | 2 |
Gas | 3 |
Laser | 2 |
MIG | 1 |
Plasma | 2 |
Resistance spot welding | 3 |
TIG | 2 |
welding additives |
|
Aviation | No |
Cr (from) | 0.04 |
Cr (to) | 0.35 |
Cu (from) | 0.15 |
Cu (to) | 0.4 |
Fe (to) | 0.7 |
Mg (from) | 0.8 |
Mg (to) | 1.2 |
Mn (to) | 0.15 |
Other | 0,05 |
Rest | Aluminium |
Si (from) | 0.4 |
Si (to) | 0.8 |
Ti (to) | 0.15 |
Total | 0,15 |
Zn (to) | 0.25 |
(a) Includes all listed elements for which no limits are specified. (b) The sum of these "other impurities" whose mass fraction is individually 0,010 % or more is expressed with two decimal places before the summation.
Anodise - decorative | 3 |
Anodising - protective anodising | 1 |
Chromating | 2 |
Cleaning / degreasing | 2 |
Hard anodising | 2 |
Phosphating | 2 |
Pickling | 2 |
Shining | 3 |
Normal atmosphere | 2 |
Seawater atmosphere | 2 |
Laser cutting | 3 |
Plasma cutting | 2 |
Sawing | 2 |
Shear cutting | 2 |
Waterjet cutting | 1 |
suitable according to DIN EN 602 | Yes |
Bending | 3 |
Bending delivery conditions | T3 · T4 |
Deep drawing (conditional) | 2 |
Deep drawing conditions | O |
Drop forging | 2 |
Extruding | 2 |
Impact extrusion | 2 |
Impact extrusion conditions | O |
Open die forging | 2 |
Press | 2 |
Press conditions | O |
Upsetting (Conditional) | 2 |
Upsetting conditions | O |
Heating time max. | 2 h |
Heating time min. | 1 h |
Annealing temperature max. | 420 °C |
Annealing temperature min. | 380 °C |
Cooling conditions |
Cooling conditions 30°C/h to 250°C, below 250°C in air |
Cold ageing max. | 8 d |
Cold ageing min. | 5 d |
Heat ageing max. | 16 h |
Heat ageing min. | 4 h |
Heating temperature max. | 190 °C |
Heating temperature min. | 155 °C |
Quenching | water |
Solution annealing max. | 540 °C |
Solution annealing min. | 525 °C |
Eroding | 1 |
Etching | 2 |
hardened | 2 |
Photo etching | 2 |
soft annealed | 4 |
Material chemically EN 573-3 | Al Mg1 Si Cu |
DIN | 3.3211 |
DIN (old designation) | Al Mg1 Si Cu |
France AFNOR | A-GSUC |
Italy UNI | 9006/2 |
Norway | - |
Spain | L-3420 |
Sweden | - |
United Kingdom BS | H20 |
Blasting | 1 |
Brushing | 2 |
Dessinating | 1 |
Grinding | 2 |
Polishing | 1 |
Galvanising | 2 |
Nickel coating | 2 |
Thermal spraying | 4 |
Enamelling | 4 |
Laminating | 2 |
Painting / Coating | 2 |
Coefficient of thermal expansion from 20 to 100°C | 23 K⁻¹10⁻⁶ |
Density | 2.7 g/cm³ |
Electrical conductivity max. | 30 m/Ω*mm² |
Electrical conductivity min. | 22 m/Ω*mm² |
Modulus of elasticity | 70 GPa |
Shear modulus | 26.3 GPa |
Thermal conductivity max. | 200 W/m*K |
Thermal conductivity min. | 170 W/m*K |
Brazing | 4 |
Brazing with flux | 3 |
Friction soldering | 2 |
Soft soldering | 3 |
Soft soldering with flux | 3 |
Friction stir welding | 2 |
Friction welding | 2 |
Gas | 3 |
Laser | 2 |
MIG | 1 |
Plasma | 2 |
Resistance spot welding | 3 |
TIG | 2 |
welding additives |
|
Aviation | No |
Cr (from) | 0.04 |
Cr (to) | 0.35 |
Cu (from) | 0.15 |
Cu (to) | 0.4 |
Fe (to) | 0.7 |
Mg (from) | 0.8 |
Mg (to) | 1.2 |
Mn (to) | 0.15 |
Other | 0,05 |
Rest | Aluminium |
Si (from) | 0.4 |
Si (to) | 0.8 |
Ti (to) | 0.15 |
Total | 0,15 |
Zn (to) | 0.25 |
(a) Includes all listed elements for which no limits are specified. (b) The sum of these "other impurities" whose mass fraction is individually 0,010 % or more is expressed with two decimal places before the summation.
Anodise - decorative | 3 |
Anodising - protective anodising | 1 |
Chromating | 2 |
Cleaning / degreasing | 2 |
Hard anodising | 2 |
Phosphating | 2 |
Pickling | 2 |
Shining | 3 |
Normal atmosphere | 2 |
Seawater atmosphere | 2 |
Laser cutting | 3 |
Plasma cutting | 2 |
Sawing | 2 |
Shear cutting | 2 |
Waterjet cutting | 1 |
suitable according to DIN EN 602 | Yes |
Bending | 3 |
Bending delivery conditions | T3 · T4 |
Deep drawing (conditional) | 2 |
Deep drawing conditions | O |
Drop forging | 2 |
Extruding | 2 |
Impact extrusion | 2 |
Impact extrusion conditions | O |
Open die forging | 2 |
Press | 2 |
Press conditions | O |
Upsetting (Conditional) | 2 |
Upsetting conditions | O |
Heating time max. | 2 h |
Heating time min. | 1 h |
Annealing temperature max. | 420 °C |
Annealing temperature min. | 380 °C |
Cooling conditions |
Cooling conditions 30°C/h to 250°C, below 250°C in air |
Cold ageing max. | 8 d |
Cold ageing min. | 5 d |
Heat ageing max. | 16 h |
Heat ageing min. | 4 h |
Heating temperature max. | 190 °C |
Heating temperature min. | 155 °C |
Quenching | water |
Solution annealing max. | 540 °C |
Solution annealing min. | 525 °C |
Eroding | 1 |
Etching | 2 |
hardened | 2 |
Photo etching | 2 |
soft annealed | 4 |
Material chemically EN 573-3 | Al Mg1 Si Cu |
DIN | 3.3211 |
DIN (old designation) | Al Mg1 Si Cu |
France AFNOR | A-GSUC |
Italy UNI | 9006/2 |
Norway | - |
Spain | L-3420 |
Sweden | - |
United Kingdom BS | H20 |
Blasting | 1 |
Brushing | 2 |
Dessinating | 1 |
Grinding | 2 |
Polishing | 1 |
Galvanising | 2 |
Nickel coating | 2 |
Thermal spraying | 4 |
Enamelling | 4 |
Laminating | 2 |
Painting / Coating | 2 |
Coefficient of thermal expansion from 20 to 100°C | 23 K⁻¹10⁻⁶ |
Density | 2.7 g/cm³ |
Electrical conductivity max. | 30 m/Ω*mm² |
Electrical conductivity min. | 22 m/Ω*mm² |
Modulus of elasticity | 70 GPa |
Shear modulus | 26.3 GPa |
Thermal conductivity max. | 200 W/m*K |
Thermal conductivity min. | 170 W/m*K |
Brazing | 4 |
Brazing with flux | 3 |
Friction soldering | 2 |
Soft soldering | 3 |
Soft soldering with flux | 3 |
Friction stir welding | 2 |
Friction welding | 2 |
Gas | 3 |
Laser | 2 |
MIG | 1 |
Plasma | 2 |
Resistance spot welding | 3 |
TIG | 2 |
welding additives |
|
Aviation | No |
Cr (from) | 0.04 |
Cr (to) | 0.35 |
Cu (from) | 0.15 |
Cu (to) | 0.4 |
Fe (to) | 0.7 |
Mg (from) | 0.8 |
Mg (to) | 1.2 |
Mn (to) | 0.15 |
Other | 0,05 |
Rest | Aluminium |
Si (from) | 0.4 |
Si (to) | 0.8 |
Ti (to) | 0.15 |
Total | 0,15 |
Zn (to) | 0.25 |
(a) Includes all listed elements for which no limits are specified. (b) The sum of these "other impurities" whose mass fraction is individually 0,010 % or more is expressed with two decimal places before the summation.
Anodise - decorative | 3 |
Anodising - protective anodising | 1 |
Chromating | 2 |
Cleaning / degreasing | 2 |
Hard anodising | 2 |
Phosphating | 2 |
Pickling | 2 |
Shining | 3 |
Normal atmosphere | 2 |
Seawater atmosphere | 2 |
Laser cutting | 3 |
Plasma cutting | 2 |
Sawing | 2 |
Shear cutting | 2 |
Waterjet cutting | 1 |
suitable according to DIN EN 602 | Yes |
Bending | 3 |
Bending delivery conditions | T3 · T4 |
Deep drawing (conditional) | 2 |
Deep drawing conditions | O |
Drop forging | 2 |
Extruding | 2 |
Impact extrusion | 2 |
Impact extrusion conditions | O |
Open die forging | 2 |
Press | 2 |
Press conditions | O |
Upsetting (Conditional) | 2 |
Upsetting conditions | O |
Heating time max. | 2 h |
Heating time min. | 1 h |
Annealing temperature max. | 420 °C |
Annealing temperature min. | 380 °C |
Cooling conditions |
Cooling conditions 30°C/h to 250°C, below 250°C in air |
Cold ageing max. | 8 d |
Cold ageing min. | 5 d |
Heat ageing max. | 16 h |
Heat ageing min. | 4 h |
Heating temperature max. | 190 °C |
Heating temperature min. | 155 °C |
Quenching | water |
Solution annealing max. | 540 °C |
Solution annealing min. | 525 °C |
Eroding | 1 |
Etching | 2 |
hardened | 2 |
Photo etching | 2 |
soft annealed | 4 |
Material chemically EN 573-3 | Al Mg1 Si Cu |
DIN | 3.3211 |
DIN (old designation) | Al Mg1 Si Cu |
France AFNOR | A-GSUC |
Italy UNI | 9006/2 |
Norway | - |
Spain | L-3420 |
Sweden | - |
United Kingdom BS | H20 |
Blasting | 1 |
Brushing | 2 |
Dessinating | 1 |
Grinding | 2 |
Polishing | 1 |
Galvanising | 2 |
Nickel coating | 2 |
Thermal spraying | 4 |
Enamelling | 4 |
Laminating | 2 |
Painting / Coating | 2 |
Coefficient of thermal expansion from 20 to 100°C | 23 K⁻¹10⁻⁶ |
Density | 2.7 g/cm³ |
Electrical conductivity max. | 30 m/Ω*mm² |
Electrical conductivity min. | 22 m/Ω*mm² |
Modulus of elasticity | 70 GPa |
Shear modulus | 26.3 GPa |
Thermal conductivity max. | 200 W/m*K |
Thermal conductivity min. | 170 W/m*K |
Brazing | 4 |
Brazing with flux | 3 |
Friction soldering | 2 |
Soft soldering | 3 |
Soft soldering with flux | 3 |
Friction stir welding | 2 |
Friction welding | 2 |
Gas | 3 |
Laser | 2 |
MIG | 1 |
Plasma | 2 |
Resistance spot welding | 3 |
TIG | 2 |
welding additives |
|
Aviation | No |
Cr (from) | 0.04 |
Cr (to) | 0.35 |
Cu (from) | 0.15 |
Cu (to) | 0.4 |
Fe (to) | 0.7 |
Mg (from) | 0.8 |
Mg (to) | 1.2 |
Mn (to) | 0.15 |
Other | 0,05 |
Rest | Aluminium |
Si (from) | 0.4 |
Si (to) | 0.8 |
Ti (to) | 0.15 |
Total | 0,15 |
Zn (to) | 0.25 |
(a) Includes all listed elements for which no limits are specified. (b) The sum of these "other impurities" whose mass fraction is individually 0,010 % or more is expressed with two decimal places before the summation.
Anodise - decorative | 3 |
Anodising - protective anodising | 1 |
Chromating | 2 |
Cleaning / degreasing | 2 |
Hard anodising | 2 |
Phosphating | 2 |
Pickling | 2 |
Shining | 3 |
Normal atmosphere | 2 |
Seawater atmosphere | 2 |
Laser cutting | 3 |
Plasma cutting | 2 |
Sawing | 2 |
Shear cutting | 2 |
Waterjet cutting | 1 |
suitable according to DIN EN 602 | Yes |
Bending | 3 |
Bending delivery conditions | T3 · T4 |
Deep drawing (conditional) | 2 |
Deep drawing conditions | O |
Drop forging | 2 |
Extruding | 2 |
Impact extrusion | 2 |
Impact extrusion conditions | O |
Open die forging | 2 |
Press | 2 |
Press conditions | O |
Upsetting (Conditional) | 2 |
Upsetting conditions | O |
Heating time max. | 2 h |
Heating time min. | 1 h |
Annealing temperature max. | 420 °C |
Annealing temperature min. | 380 °C |
Cooling conditions |
Cooling conditions 30°C/h to 250°C, below 250°C in air |
Cold ageing max. | 8 d |
Cold ageing min. | 5 d |
Heat ageing max. | 16 h |
Heat ageing min. | 4 h |
Heating temperature max. | 190 °C |
Heating temperature min. | 155 °C |
Quenching | water |
Solution annealing max. | 540 °C |
Solution annealing min. | 525 °C |
Eroding | 1 |
Etching | 2 |
hardened | 2 |
Photo etching | 2 |
soft annealed | 4 |
Material chemically EN 573-3 | Al Mg1 Si Cu |
DIN | 3.3211 |
DIN (old designation) | Al Mg1 Si Cu |
France AFNOR | A-GSUC |
Italy UNI | 9006/2 |
Norway | - |
Spain | L-3420 |
Sweden | - |
United Kingdom BS | H20 |
Blasting | 1 |
Brushing | 2 |
Dessinating | 1 |
Grinding | 2 |
Polishing | 1 |
Galvanising | 2 |
Nickel coating | 2 |
Thermal spraying | 4 |
Enamelling | 4 |
Laminating | 2 |
Painting / Coating | 2 |
Coefficient of thermal expansion from 20 to 100°C | 23 K⁻¹10⁻⁶ |
Density | 2.7 g/cm³ |
Electrical conductivity max. | 30 m/Ω*mm² |
Electrical conductivity min. | 22 m/Ω*mm² |
Modulus of elasticity | 70 GPa |
Shear modulus | 26.3 GPa |
Thermal conductivity max. | 200 W/m*K |
Thermal conductivity min. | 170 W/m*K |
Brazing | 4 |
Brazing with flux | 3 |
Friction soldering | 2 |
Soft soldering | 3 |
Soft soldering with flux | 3 |
Friction stir welding | 2 |
Friction welding | 2 |
Gas | 3 |
Laser | 2 |
MIG | 1 |
Plasma | 2 |
Resistance spot welding | 3 |
TIG | 2 |
welding additives |
|
Aviation | No |
Cr (from) | 0.04 |
Cr (to) | 0.35 |
Cu (from) | 0.15 |
Cu (to) | 0.4 |
Fe (to) | 0.7 |
Mg (from) | 0.8 |
Mg (to) | 1.2 |
Mn (to) | 0.15 |
Other | 0,05 |
Rest | Aluminium |
Si (from) | 0.4 |
Si (to) | 0.8 |
Ti (to) | 0.15 |
Total | 0,15 |
Zn (to) | 0.25 |
(a) Includes all listed elements for which no limits are specified. (b) The sum of these "other impurities" whose mass fraction is individually 0,010 % or more is expressed with two decimal places before the summation.
Anodise - decorative | 3 |
Anodising - protective anodising | 1 |
Chromating | 2 |
Cleaning / degreasing | 2 |
Hard anodising | 2 |
Phosphating | 2 |
Pickling | 2 |
Shining | 3 |
Normal atmosphere | 2 |
Seawater atmosphere | 2 |
Laser cutting | 3 |
Plasma cutting | 2 |
Sawing | 2 |
Shear cutting | 2 |
Waterjet cutting | 1 |
suitable according to DIN EN 602 | Yes |
Bending | 3 |
Bending delivery conditions | T3 · T4 |
Deep drawing (conditional) | 2 |
Deep drawing conditions | O |
Drop forging | 2 |
Extruding | 2 |
Impact extrusion | 2 |
Impact extrusion conditions | O |
Open die forging | 2 |
Press | 2 |
Press conditions | O |
Upsetting (Conditional) | 2 |
Upsetting conditions | O |
Heating time max. | 2 h |
Heating time min. | 1 h |
Annealing temperature max. | 420 °C |
Annealing temperature min. | 380 °C |
Cooling conditions |
Cooling conditions 30°C/h to 250°C, below 250°C in air |
Cold ageing max. | 8 d |
Cold ageing min. | 5 d |
Heat ageing max. | 16 h |
Heat ageing min. | 4 h |
Heating temperature max. | 190 °C |
Heating temperature min. | 155 °C |
Quenching | water |
Solution annealing max. | 540 °C |
Solution annealing min. | 525 °C |
Eroding | 1 |
Etching | 2 |
hardened | 2 |
Photo etching | 2 |
soft annealed | 4 |
Material chemically EN 573-3 | Al Mg1 Si Cu |
DIN | 3.3211 |
DIN (old designation) | Al Mg1 Si Cu |
France AFNOR | A-GSUC |
Italy UNI | 9006/2 |
Norway | - |
Spain | L-3420 |
Sweden | - |
United Kingdom BS | H20 |
Blasting | 1 |
Brushing | 2 |
Dessinating | 1 |
Grinding | 2 |
Polishing | 1 |
Galvanising | 2 |
Nickel coating | 2 |
Thermal spraying | 4 |
Enamelling | 4 |
Laminating | 2 |
Painting / Coating | 2 |
Coefficient of thermal expansion from 20 to 100°C | 23 K⁻¹10⁻⁶ |
Density | 2.7 g/cm³ |
Electrical conductivity max. | 30 m/Ω*mm² |
Electrical conductivity min. | 22 m/Ω*mm² |
Modulus of elasticity | 70 GPa |
Shear modulus | 26.3 GPa |
Thermal conductivity max. | 200 W/m*K |
Thermal conductivity min. | 170 W/m*K |
Brazing | 4 |
Brazing with flux | 3 |
Friction soldering | 2 |
Soft soldering | 3 |
Soft soldering with flux | 3 |
Friction stir welding | 2 |
Friction welding | 2 |
Gas | 3 |
Laser | 2 |
MIG | 1 |
Plasma | 2 |
Resistance spot welding | 3 |
TIG | 2 |
welding additives |
|
Aviation | No |
Cr (from) | 0.04 |
Cr (to) | 0.35 |
Cu (from) | 0.15 |
Cu (to) | 0.4 |
Fe (to) | 0.7 |
Mg (from) | 0.8 |
Mg (to) | 1.2 |
Mn (to) | 0.15 |
Other | 0,05 |
Rest | Aluminium |
Si (from) | 0.4 |
Si (to) | 0.8 |
Ti (to) | 0.15 |
Total | 0,15 |
Zn (to) | 0.25 |
(a) Includes all listed elements for which no limits are specified. (b) The sum of these "other impurities" whose mass fraction is individually 0,010 % or more is expressed with two decimal places before the summation.
Anodise - decorative | 3 |
Anodising - protective anodising | 1 |
Chromating | 2 |
Cleaning / degreasing | 2 |
Hard anodising | 2 |
Phosphating | 2 |
Pickling | 2 |
Shining | 3 |
Normal atmosphere | 2 |
Seawater atmosphere | 2 |
Laser cutting | 3 |
Plasma cutting | 2 |
Sawing | 2 |
Shear cutting | 2 |
Waterjet cutting | 1 |
suitable according to DIN EN 602 | Yes |
Bending | 3 |
Bending delivery conditions | T3 · T4 |
Deep drawing (conditional) | 2 |
Deep drawing conditions | O |
Drop forging | 2 |
Extruding | 2 |
Impact extrusion | 2 |
Impact extrusion conditions | O |
Open die forging | 2 |
Press | 2 |
Press conditions | O |
Upsetting (Conditional) | 2 |
Upsetting conditions | O |
Heating time max. | 2 h |
Heating time min. | 1 h |
Annealing temperature max. | 420 °C |
Annealing temperature min. | 380 °C |
Cooling conditions |
Cooling conditions 30°C/h to 250°C, below 250°C in air |
Cold ageing max. | 8 d |
Cold ageing min. | 5 d |
Heat ageing max. | 16 h |
Heat ageing min. | 4 h |
Heating temperature max. | 190 °C |
Heating temperature min. | 155 °C |
Quenching | water |
Solution annealing max. | 540 °C |
Solution annealing min. | 525 °C |
Eroding | 1 |
Etching | 2 |
hardened | 2 |
Photo etching | 2 |
soft annealed | 4 |
Material chemically EN 573-3 | Al Mg1 Si Cu |
DIN | 3.3211 |
DIN (old designation) | Al Mg1 Si Cu |
France AFNOR | A-GSUC |
Italy UNI | 9006/2 |
Norway | - |
Spain | L-3420 |
Sweden | - |
United Kingdom BS | H20 |
Blasting | 1 |
Brushing | 2 |
Dessinating | 1 |
Grinding | 2 |
Polishing | 1 |
Galvanising | 2 |
Nickel coating | 2 |
Thermal spraying | 4 |
Enamelling | 4 |
Laminating | 2 |
Painting / Coating | 2 |
Coefficient of thermal expansion from 20 to 100°C | 23 K⁻¹10⁻⁶ |
Density | 2.7 g/cm³ |
Electrical conductivity max. | 30 m/Ω*mm² |
Electrical conductivity min. | 22 m/Ω*mm² |
Modulus of elasticity | 70 GPa |
Shear modulus | 26.3 GPa |
Thermal conductivity max. | 200 W/m*K |
Thermal conductivity min. | 170 W/m*K |
Brazing | 4 |
Brazing with flux | 3 |
Friction soldering | 2 |
Soft soldering | 3 |
Soft soldering with flux | 3 |
Friction stir welding | 2 |
Friction welding | 2 |
Gas | 3 |
Laser | 2 |
MIG | 1 |
Plasma | 2 |
Resistance spot welding | 3 |
TIG | 2 |
welding additives |
|
Aviation | No |
Cr (from) | 0.04 |
Cr (to) | 0.35 |
Cu (from) | 0.15 |
Cu (to) | 0.4 |
Fe (to) | 0.7 |
Mg (from) | 0.8 |
Mg (to) | 1.2 |
Mn (to) | 0.15 |
Other | 0,05 |
Rest | Aluminium |
Si (from) | 0.4 |
Si (to) | 0.8 |
Ti (to) | 0.15 |
Total | 0,15 |
Zn (to) | 0.25 |
(a) Includes all listed elements for which no limits are specified. (b) The sum of these "other impurities" whose mass fraction is individually 0,010 % or more is expressed with two decimal places before the summation.
Anodise - decorative | 3 |
Anodising - protective anodising | 1 |
Chromating | 2 |
Cleaning / degreasing | 2 |
Hard anodising | 2 |
Phosphating | 2 |
Pickling | 2 |
Shining | 3 |
Normal atmosphere | 2 |
Seawater atmosphere | 2 |
Laser cutting | 3 |
Plasma cutting | 2 |
Sawing | 2 |
Shear cutting | 2 |
Waterjet cutting | 1 |
suitable according to DIN EN 602 | Yes |
Bending | 3 |
Bending delivery conditions | T3 · T4 |
Deep drawing (conditional) | 2 |
Deep drawing conditions | O |
Drop forging | 2 |
Extruding | 2 |
Impact extrusion | 2 |
Impact extrusion conditions | O |
Open die forging | 2 |
Press | 2 |
Press conditions | O |
Upsetting (Conditional) | 2 |
Upsetting conditions | O |
Heating time max. | 2 h |
Heating time min. | 1 h |
Annealing temperature max. | 420 °C |
Annealing temperature min. | 380 °C |
Cooling conditions |
Cooling conditions 30°C/h to 250°C, below 250°C in air |
Cold ageing max. | 8 d |
Cold ageing min. | 5 d |
Heat ageing max. | 16 h |
Heat ageing min. | 4 h |
Heating temperature max. | 190 °C |
Heating temperature min. | 155 °C |
Quenching | water |
Solution annealing max. | 540 °C |
Solution annealing min. | 525 °C |
Eroding | 1 |
Etching | 2 |
hardened | 2 |
Photo etching | 2 |
soft annealed | 4 |
Material chemically EN 573-3 | Al Mg1 Si Cu |
DIN | 3.3211 |
DIN (old designation) | Al Mg1 Si Cu |
France AFNOR | A-GSUC |
Italy UNI | 9006/2 |
Norway | - |
Spain | L-3420 |
Sweden | - |
United Kingdom BS | H20 |
Blasting | 1 |
Brushing | 2 |
Dessinating | 1 |
Grinding | 2 |
Polishing | 1 |
Galvanising | 2 |
Nickel coating | 2 |
Thermal spraying | 4 |
Enamelling | 4 |
Laminating | 2 |
Painting / Coating | 2 |
Coefficient of thermal expansion from 20 to 100°C | 23 K⁻¹10⁻⁶ |
Density | 2.7 g/cm³ |
Electrical conductivity max. | 30 m/Ω*mm² |
Electrical conductivity min. | 22 m/Ω*mm² |
Modulus of elasticity | 70 GPa |
Shear modulus | 26.3 GPa |
Thermal conductivity max. | 200 W/m*K |
Thermal conductivity min. | 170 W/m*K |
Brazing | 4 |
Brazing with flux | 3 |
Friction soldering | 2 |
Soft soldering | 3 |
Soft soldering with flux | 3 |
Friction stir welding | 2 |
Friction welding | 2 |
Gas | 3 |
Laser | 2 |
MIG | 1 |
Plasma | 2 |
Resistance spot welding | 3 |
TIG | 2 |
welding additives |
|
Aviation | No |
Cr (from) | 0.04 |
Cr (to) | 0.35 |
Cu (from) | 0.15 |
Cu (to) | 0.4 |
Fe (to) | 0.7 |
Mg (from) | 0.8 |
Mg (to) | 1.2 |
Mn (to) | 0.15 |
Other | 0,05 |
Rest | Aluminium |
Si (from) | 0.4 |
Si (to) | 0.8 |
Ti (to) | 0.15 |
Total | 0,15 |
Zn (to) | 0.25 |
(a) Includes all listed elements for which no limits are specified. (b) The sum of these "other impurities" whose mass fraction is individually 0,010 % or more is expressed with two decimal places before the summation.
Anodise - decorative | 3 |
Anodising - protective anodising | 1 |
Chromating | 2 |
Cleaning / degreasing | 2 |
Hard anodising | 2 |
Phosphating | 2 |
Pickling | 2 |
Shining | 3 |
Normal atmosphere | 2 |
Seawater atmosphere | 2 |
Laser cutting | 3 |
Plasma cutting | 2 |
Sawing | 2 |
Shear cutting | 2 |
Waterjet cutting | 1 |
suitable according to DIN EN 602 | Yes |
Bending | 3 |
Bending delivery conditions | T3 · T4 |
Deep drawing (conditional) | 2 |
Deep drawing conditions | O |
Drop forging | 2 |
Extruding | 2 |
Impact extrusion | 2 |
Impact extrusion conditions | O |
Open die forging | 2 |
Press | 2 |
Press conditions | O |
Upsetting (Conditional) | 2 |
Upsetting conditions | O |
Heating time max. | 2 h |
Heating time min. | 1 h |
Annealing temperature max. | 420 °C |
Annealing temperature min. | 380 °C |
Cooling conditions |
Cooling conditions 30°C/h to 250°C, below 250°C in air |
Cold ageing max. | 8 d |
Cold ageing min. | 5 d |
Heat ageing max. | 16 h |
Heat ageing min. | 4 h |
Heating temperature max. | 190 °C |
Heating temperature min. | 155 °C |
Quenching | water |
Solution annealing max. | 540 °C |
Solution annealing min. | 525 °C |
Eroding | 1 |
Etching | 2 |
hardened | 2 |
Photo etching | 2 |
soft annealed | 4 |
Material chemically EN 573-3 | Al Mg1 Si Cu |
DIN | 3.3211 |
DIN (old designation) | Al Mg1 Si Cu |
France AFNOR | A-GSUC |
Italy UNI | 9006/2 |
Norway | - |
Spain | L-3420 |
Sweden | - |
United Kingdom BS | H20 |
Blasting | 1 |
Brushing | 2 |
Dessinating | 1 |
Grinding | 2 |
Polishing | 1 |
Galvanising | 2 |
Nickel coating | 2 |
Thermal spraying | 4 |
Enamelling | 4 |
Laminating | 2 |
Painting / Coating | 2 |
Coefficient of thermal expansion from 20 to 100°C | 23 K⁻¹10⁻⁶ |
Density | 2.7 g/cm³ |
Electrical conductivity max. | 30 m/Ω*mm² |
Electrical conductivity min. | 22 m/Ω*mm² |
Modulus of elasticity | 70 GPa |
Shear modulus | 26.3 GPa |
Thermal conductivity max. | 200 W/m*K |
Thermal conductivity min. | 170 W/m*K |
Brazing | 4 |
Brazing with flux | 3 |
Friction soldering | 2 |
Soft soldering | 3 |
Soft soldering with flux | 3 |
Friction stir welding | 2 |
Friction welding | 2 |
Gas | 3 |
Laser | 2 |
MIG | 1 |
Plasma | 2 |
Resistance spot welding | 3 |
TIG | 2 |
welding additives |
|
Aviation | No |
Cr (from) | 0.04 |
Cr (to) | 0.35 |
Cu (from) | 0.15 |
Cu (to) | 0.4 |
Fe (to) | 0.7 |
Mg (from) | 0.8 |
Mg (to) | 1.2 |
Mn (to) | 0.15 |
Other | 0,05 |
Rest | Aluminium |
Si (from) | 0.4 |
Si (to) | 0.8 |
Ti (to) | 0.15 |
Total | 0,15 |
Zn (to) | 0.25 |
(a) Includes all listed elements for which no limits are specified. (b) The sum of these "other impurities" whose mass fraction is individually 0,010 % or more is expressed with two decimal places before the summation.
Anodise - decorative | 3 |
Anodising - protective anodising | 1 |
Chromating | 2 |
Cleaning / degreasing | 2 |
Hard anodising | 2 |
Phosphating | 2 |
Pickling | 2 |
Shining | 3 |
Normal atmosphere | 2 |
Seawater atmosphere | 2 |
Laser cutting | 3 |
Plasma cutting | 2 |
Sawing | 2 |
Shear cutting | 2 |
Waterjet cutting | 1 |
suitable according to DIN EN 602 | Yes |
Bending | 3 |
Bending delivery conditions | T3 · T4 |
Deep drawing (conditional) | 2 |
Deep drawing conditions | O |
Drop forging | 2 |
Extruding | 2 |
Impact extrusion | 2 |
Impact extrusion conditions | O |
Open die forging | 2 |
Press | 2 |
Press conditions | O |
Upsetting (Conditional) | 2 |
Upsetting conditions | O |
Heating time max. | 2 h |
Heating time min. | 1 h |
Annealing temperature max. | 420 °C |
Annealing temperature min. | 380 °C |
Cooling conditions |
Cooling conditions 30°C/h to 250°C, below 250°C in air |
Cold ageing max. | 8 d |
Cold ageing min. | 5 d |
Heat ageing max. | 16 h |
Heat ageing min. | 4 h |
Heating temperature max. | 190 °C |
Heating temperature min. | 155 °C |
Quenching | water |
Solution annealing max. | 540 °C |
Solution annealing min. | 525 °C |
Eroding | 1 |
Etching | 2 |
hardened | 2 |
Photo etching | 2 |
soft annealed | 4 |
Material chemically EN 573-3 | Al Mg1 Si Cu |
DIN | 3.3211 |
DIN (old designation) | Al Mg1 Si Cu |
France AFNOR | A-GSUC |
Italy UNI | 9006/2 |
Norway | - |
Spain | L-3420 |
Sweden | - |
United Kingdom BS | H20 |
Blasting | 1 |
Brushing | 2 |
Dessinating | 1 |
Grinding | 2 |
Polishing | 1 |
Galvanising | 2 |
Nickel coating | 2 |
Thermal spraying | 4 |
Enamelling | 4 |
Laminating | 2 |
Painting / Coating | 2 |
Coefficient of thermal expansion from 20 to 100°C | 23 K⁻¹10⁻⁶ |
Density | 2.7 g/cm³ |
Electrical conductivity max. | 30 m/Ω*mm² |
Electrical conductivity min. | 22 m/Ω*mm² |
Modulus of elasticity | 70 GPa |
Shear modulus | 26.3 GPa |
Thermal conductivity max. | 200 W/m*K |
Thermal conductivity min. | 170 W/m*K |
Brazing | 4 |
Brazing with flux | 3 |
Friction soldering | 2 |
Soft soldering | 3 |
Soft soldering with flux | 3 |
Friction stir welding | 2 |
Friction welding | 2 |
Gas | 3 |
Laser | 2 |
MIG | 1 |
Plasma | 2 |
Resistance spot welding | 3 |
TIG | 2 |
welding additives |
|
Aviation | No |
Cr (from) | 0.04 |
Cr (to) | 0.35 |
Cu (from) | 0.15 |
Cu (to) | 0.4 |
Fe (to) | 0.7 |
Mg (from) | 0.8 |
Mg (to) | 1.2 |
Mn (to) | 0.15 |
Other | 0,05 |
Rest | Aluminium |
Si (from) | 0.4 |
Si (to) | 0.8 |
Ti (to) | 0.15 |
Total | 0,15 |
Zn (to) | 0.25 |
(a) Includes all listed elements for which no limits are specified. (b) The sum of these "other impurities" whose mass fraction is individually 0,010 % or more is expressed with two decimal places before the summation.
Anodise - decorative | 3 |
Anodising - protective anodising | 1 |
Chromating | 2 |
Cleaning / degreasing | 2 |
Hard anodising | 2 |
Phosphating | 2 |
Pickling | 2 |
Shining | 3 |
Normal atmosphere | 2 |
Seawater atmosphere | 2 |
Laser cutting | 3 |
Plasma cutting | 2 |
Sawing | 2 |
Shear cutting | 2 |
Waterjet cutting | 1 |
suitable according to DIN EN 602 | Yes |
Bending | 3 |
Bending delivery conditions | T3 · T4 |
Deep drawing (conditional) | 2 |
Deep drawing conditions | O |
Drop forging | 2 |
Extruding | 2 |
Impact extrusion | 2 |
Impact extrusion conditions | O |
Open die forging | 2 |
Press | 2 |
Press conditions | O |
Upsetting (Conditional) | 2 |
Upsetting conditions | O |
Heating time max. | 2 h |
Heating time min. | 1 h |
Annealing temperature max. | 420 °C |
Annealing temperature min. | 380 °C |
Cooling conditions |
Cooling conditions 30°C/h to 250°C, below 250°C in air |
Cold ageing max. | 8 d |
Cold ageing min. | 5 d |
Heat ageing max. | 16 h |
Heat ageing min. | 4 h |
Heating temperature max. | 190 °C |
Heating temperature min. | 155 °C |
Quenching | water |
Solution annealing max. | 540 °C |
Solution annealing min. | 525 °C |
Eroding | 1 |
Etching | 2 |
hardened | 2 |
Photo etching | 2 |
soft annealed | 4 |
Material chemically EN 573-3 | Al Mg1 Si Cu |
DIN | 3.3211 |
DIN (old designation) | Al Mg1 Si Cu |
France AFNOR | A-GSUC |
Italy UNI | 9006/2 |
Norway | - |
Spain | L-3420 |
Sweden | - |
United Kingdom BS | H20 |
Blasting | 1 |
Brushing | 2 |
Dessinating | 1 |
Grinding | 2 |
Polishing | 1 |
Galvanising | 2 |
Nickel coating | 2 |
Thermal spraying | 4 |
Enamelling | 4 |
Laminating | 2 |
Painting / Coating | 2 |
Coefficient of thermal expansion from 20 to 100°C | 23 K⁻¹10⁻⁶ |
Density | 2.7 g/cm³ |
Electrical conductivity max. | 30 m/Ω*mm² |
Electrical conductivity min. | 22 m/Ω*mm² |
Modulus of elasticity | 70 GPa |
Shear modulus | 26.3 GPa |
Thermal conductivity max. | 200 W/m*K |
Thermal conductivity min. | 170 W/m*K |
Brazing | 4 |
Brazing with flux | 3 |
Friction soldering | 2 |
Soft soldering | 3 |
Soft soldering with flux | 3 |
Friction stir welding | 2 |
Friction welding | 2 |
Gas | 3 |
Laser | 2 |
MIG | 1 |
Plasma | 2 |
Resistance spot welding | 3 |
TIG | 2 |
welding additives |
|
Aviation | No |
Cr (from) | 0.04 |
Cr (to) | 0.35 |
Cu (from) | 0.15 |
Cu (to) | 0.4 |
Fe (to) | 0.7 |
Mg (from) | 0.8 |
Mg (to) | 1.2 |
Mn (to) | 0.15 |
Other | 0,05 |
Rest | Aluminium |
Si (from) | 0.4 |
Si (to) | 0.8 |
Ti (to) | 0.15 |
Total | 0,15 |
Zn (to) | 0.25 |
(a) Includes all listed elements for which no limits are specified. (b) The sum of these "other impurities" whose mass fraction is individually 0,010 % or more is expressed with two decimal places before the summation.
Anodise - decorative | 3 |
Anodising - protective anodising | 1 |
Chromating | 2 |
Cleaning / degreasing | 2 |
Hard anodising | 2 |
Phosphating | 2 |
Pickling | 2 |
Shining | 3 |
Normal atmosphere | 2 |
Seawater atmosphere | 2 |
Laser cutting | 3 |
Plasma cutting | 2 |
Sawing | 2 |
Shear cutting | 2 |
Waterjet cutting | 1 |
suitable according to DIN EN 602 | Yes |
Bending | 3 |
Bending delivery conditions | T3 · T4 |
Deep drawing (conditional) | 2 |
Deep drawing conditions | O |
Drop forging | 2 |
Extruding | 2 |
Impact extrusion | 2 |
Impact extrusion conditions | O |
Open die forging | 2 |
Press | 2 |
Press conditions | O |
Upsetting (Conditional) | 2 |
Upsetting conditions | O |
Heating time max. | 2 h |
Heating time min. | 1 h |
Annealing temperature max. | 420 °C |
Annealing temperature min. | 380 °C |
Cooling conditions |
Cooling conditions 30°C/h to 250°C, below 250°C in air |
Cold ageing max. | 8 d |
Cold ageing min. | 5 d |
Heat ageing max. | 16 h |
Heat ageing min. | 4 h |
Heating temperature max. | 190 °C |
Heating temperature min. | 155 °C |
Quenching | water |
Solution annealing max. | 540 °C |
Solution annealing min. | 525 °C |
Eroding | 1 |
Etching | 2 |
hardened | 2 |
Photo etching | 2 |
soft annealed | 4 |
Material chemically EN 573-3 | Al Mg1 Si Cu |
DIN | 3.3211 |
DIN (old designation) | Al Mg1 Si Cu |
France AFNOR | A-GSUC |
Italy UNI | 9006/2 |
Norway | - |
Spain | L-3420 |
Sweden | - |
United Kingdom BS | H20 |
Blasting | 1 |
Brushing | 2 |
Dessinating | 1 |
Grinding | 2 |
Polishing | 1 |
Galvanising | 2 |
Nickel coating | 2 |
Thermal spraying | 4 |
Enamelling | 4 |
Laminating | 2 |
Painting / Coating | 2 |
Coefficient of thermal expansion from 20 to 100°C | 23 K⁻¹10⁻⁶ |
Density | 2.7 g/cm³ |
Electrical conductivity max. | 30 m/Ω*mm² |
Electrical conductivity min. | 22 m/Ω*mm² |
Modulus of elasticity | 70 GPa |
Shear modulus | 26.3 GPa |
Thermal conductivity max. | 200 W/m*K |
Thermal conductivity min. | 170 W/m*K |
Brazing | 4 |
Brazing with flux | 3 |
Friction soldering | 2 |
Soft soldering | 3 |
Soft soldering with flux | 3 |
Friction stir welding | 2 |
Friction welding | 2 |
Gas | 3 |
Laser | 2 |
MIG | 1 |
Plasma | 2 |
Resistance spot welding | 3 |
TIG | 2 |
welding additives |
|
1 very good
2 good
3 moderate
4 poor
5 unsuited
0 Not specified