CW008A
circular blank
![A technical illustration of the product with dimensions of the material CW008A from the material Copper in the shape circular blank](https://my.bikar.com/media/cache/sylius_shop_product_detail_pictogram_thumbnail/70/6f/01219384338baefb8395076be940.jpg)
- Form circular blank
- Material Copper
- Material CW008A
- Material chemically EN 573-3 OF-Cu 99.95 %
![An image of the material CW008A from the material Copper in the shape circular blank](https://my.bikar.com/media/cache/sylius_shop_product_detail_mainimage_thumbnail/dc/3e/231e85435f9c6370ff3666c4e37d.png)
BIKAR Metals companies
Aviation | No |
Bi (to) | 0.0005 |
O (to) | 0.001 |
Pb (to) | 0.005 |
Rest | Cu |
suitable according to DIN EN 602 | No |
Material chemically EN 573-3 | OF-Cu 99.95 % |
Material no | 2.004 |
Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ |
Density | 8.94 g/cm³ |
Brazing | 1 |
Soft soldering | 1 |
Gas | 2 |
Aviation | No |
Bi (to) | 0.0005 |
O (to) | 0.001 |
Pb (to) | 0.005 |
Rest | Cu |
suitable according to DIN EN 602 | No |
Material chemically EN 573-3 | OF-Cu 99.95 % |
Material no | 2.004 |
Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ |
Density | 8.94 g/cm³ |
Brazing | 1 |
Soft soldering | 1 |
Gas | 2 |
Aviation | No |
Bi (to) | 0.0005 |
O (to) | 0.001 |
Pb (to) | 0.005 |
Rest | Cu |
suitable according to DIN EN 602 | No |
Material chemically EN 573-3 | OF-Cu 99.95 % |
Material no | 2.004 |
Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ |
Density | 8.94 g/cm³ |
Brazing | 1 |
Soft soldering | 1 |
Gas | 2 |
Aviation | No |
Bi (to) | 0.0005 |
O (to) | 0.001 |
Pb (to) | 0.005 |
Rest | Cu |
suitable according to DIN EN 602 | No |
Material chemically EN 573-3 | OF-Cu 99.95 % |
Material no | 2.004 |
Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ |
Density | 8.94 g/cm³ |
Brazing | 1 |
Soft soldering | 1 |
Gas | 2 |
Aviation | No |
Bi (to) | 0.0005 |
O (to) | 0.001 |
Pb (to) | 0.005 |
Rest | Cu |
suitable according to DIN EN 602 | No |
Material chemically EN 573-3 | OF-Cu 99.95 % |
Material no | 2.004 |
Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ |
Density | 8.94 g/cm³ |
Brazing | 1 |
Soft soldering | 1 |
Gas | 2 |
Aviation | No |
Bi (to) | 0.0005 |
O (to) | 0.001 |
Pb (to) | 0.005 |
Rest | Cu |
suitable according to DIN EN 602 | No |
Material chemically EN 573-3 | OF-Cu 99.95 % |
Material no | 2.004 |
Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ |
Density | 8.94 g/cm³ |
Brazing | 1 |
Soft soldering | 1 |
Gas | 2 |
Aviation | No |
Bi (to) | 0.0005 |
O (to) | 0.001 |
Pb (to) | 0.005 |
Rest | Cu |
suitable according to DIN EN 602 | No |
Material chemically EN 573-3 | OF-Cu 99.95 % |
Material no | 2.004 |
Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ |
Density | 8.94 g/cm³ |
Brazing | 1 |
Soft soldering | 1 |
Gas | 2 |
Aviation | No |
Bi (to) | 0.0005 |
O (to) | 0.001 |
Pb (to) | 0.005 |
Rest | Cu |
suitable according to DIN EN 602 | No |
Material chemically EN 573-3 | OF-Cu 99.95 % |
Material no | 2.004 |
Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ |
Density | 8.94 g/cm³ |
Brazing | 1 |
Soft soldering | 1 |
Gas | 2 |
Aviation | No |
Bi (to) | 0.0005 |
O (to) | 0.001 |
Pb (to) | 0.005 |
Rest | Cu |
suitable according to DIN EN 602 | No |
Material chemically EN 573-3 | OF-Cu 99.95 % |
Material no | 2.004 |
Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ |
Density | 8.94 g/cm³ |
Brazing | 1 |
Soft soldering | 1 |
Gas | 2 |
Aviation | No |
Bi (to) | 0.0005 |
O (to) | 0.001 |
Pb (to) | 0.005 |
Rest | Cu |
suitable according to DIN EN 602 | No |
Material chemically EN 573-3 | OF-Cu 99.95 % |
Material no | 2.004 |
Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ |
Density | 8.94 g/cm³ |
Brazing | 1 |
Soft soldering | 1 |
Gas | 2 |
Aviation | No |
Bi (to) | 0.0005 |
O (to) | 0.001 |
Pb (to) | 0.005 |
Rest | Cu |
suitable according to DIN EN 602 | No |
Material chemically EN 573-3 | OF-Cu 99.95 % |
Material no | 2.004 |
Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ |
Density | 8.94 g/cm³ |
Brazing | 1 |
Soft soldering | 1 |
Gas | 2 |
Aviation | No |
Bi (to) | 0.0005 |
O (to) | 0.001 |
Pb (to) | 0.005 |
Rest | Cu |
suitable according to DIN EN 602 | No |
Material chemically EN 573-3 | OF-Cu 99.95 % |
Material no | 2.004 |
Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ |
Density | 8.94 g/cm³ |
Brazing | 1 |
Soft soldering | 1 |
Gas | 2 |
1 very good
2 good
3 moderate
4 poor
5 unsuited
0 Not specified