-
Aviation
-
Chemical specifications
Bi (to)
|
0.0005
|
Bi (to)
|
0.0005
|
O (to)
|
0.001
|
O (to)
|
0.001
|
Pb (to)
|
0.005
|
Pb (to)
|
0.005
|
Rest
|
Cu
|
Rest
|
Cu
|
-
Food industry
suitable according to DIN EN 602
|
No
|
suitable according to DIN EN 602
|
No
|
-
Material
Material chemically EN 573-3
|
OF-Cu 99.95 %
|
Material chemically EN 573-3
|
OF-Cu 99.95 %
|
Material no
|
2.004
|
Material no
|
2.004
|
-
physical properties
Coefficient of thermal expansion from 20 to 300°C
|
17.7 K⁻¹10⁻⁶
|
Coefficient of thermal expansion from 20 to 300°C
|
17.7 K⁻¹10⁻⁶
|
Density
|
8.94 g/cm³
|
Density
|
8.94 g/cm³
|
-
Soldering
Brazing
|
1
|
Brazing
|
1
|
Soft soldering
|
1
|
Soft soldering
|
1
|
-
Welding
-
Aviation
-
Chemical specifications
Bi (to)
|
0.0005
|
Bi (to)
|
0.0005
|
O (to)
|
0.001
|
O (to)
|
0.001
|
Pb (to)
|
0.005
|
Pb (to)
|
0.005
|
Rest
|
Cu
|
Rest
|
Cu
|
-
Food industry
suitable according to DIN EN 602
|
No
|
suitable according to DIN EN 602
|
No
|
-
Material
Material chemically EN 573-3
|
OF-Cu 99.95 %
|
Material chemically EN 573-3
|
OF-Cu 99.95 %
|
Material no
|
2.004
|
Material no
|
2.004
|
-
physical properties
Coefficient of thermal expansion from 20 to 300°C
|
17.7 K⁻¹10⁻⁶
|
Coefficient of thermal expansion from 20 to 300°C
|
17.7 K⁻¹10⁻⁶
|
Density
|
8.94 g/cm³
|
Density
|
8.94 g/cm³
|
-
Soldering
Brazing
|
1
|
Brazing
|
1
|
Soft soldering
|
1
|
Soft soldering
|
1
|
-
Welding
-
Aviation
-
Chemical specifications
Bi (to)
|
0.0005
|
Bi (to)
|
0.0005
|
O (to)
|
0.001
|
O (to)
|
0.001
|
Pb (to)
|
0.005
|
Pb (to)
|
0.005
|
Rest
|
Cu
|
Rest
|
Cu
|
-
Food industry
suitable according to DIN EN 602
|
No
|
suitable according to DIN EN 602
|
No
|
-
Material
Material chemically EN 573-3
|
OF-Cu 99.95 %
|
Material chemically EN 573-3
|
OF-Cu 99.95 %
|
Material no
|
2.004
|
Material no
|
2.004
|
-
physical properties
Coefficient of thermal expansion from 20 to 300°C
|
17.7 K⁻¹10⁻⁶
|
Coefficient of thermal expansion from 20 to 300°C
|
17.7 K⁻¹10⁻⁶
|
Density
|
8.94 g/cm³
|
Density
|
8.94 g/cm³
|
-
Soldering
Brazing
|
1
|
Brazing
|
1
|
Soft soldering
|
1
|
Soft soldering
|
1
|
-
Welding
-
Aviation
-
Chemical specifications
Bi (to)
|
0.0005
|
Bi (to)
|
0.0005
|
O (to)
|
0.001
|
O (to)
|
0.001
|
Pb (to)
|
0.005
|
Pb (to)
|
0.005
|
Rest
|
Cu
|
Rest
|
Cu
|
-
Food industry
suitable according to DIN EN 602
|
No
|
suitable according to DIN EN 602
|
No
|
-
Material
Material chemically EN 573-3
|
OF-Cu 99.95 %
|
Material chemically EN 573-3
|
OF-Cu 99.95 %
|
Material no
|
2.004
|
Material no
|
2.004
|
-
physical properties
Coefficient of thermal expansion from 20 to 300°C
|
17.7 K⁻¹10⁻⁶
|
Coefficient of thermal expansion from 20 to 300°C
|
17.7 K⁻¹10⁻⁶
|
Density
|
8.94 g/cm³
|
Density
|
8.94 g/cm³
|
-
Soldering
Brazing
|
1
|
Brazing
|
1
|
Soft soldering
|
1
|
Soft soldering
|
1
|
-
Welding
-
Aviation
-
Chemical specifications
Bi (to)
|
0.0005
|
Bi (to)
|
0.0005
|
O (to)
|
0.001
|
O (to)
|
0.001
|
Pb (to)
|
0.005
|
Pb (to)
|
0.005
|
Rest
|
Cu
|
Rest
|
Cu
|
-
Food industry
suitable according to DIN EN 602
|
No
|
suitable according to DIN EN 602
|
No
|
-
Material
Material chemically EN 573-3
|
OF-Cu 99.95 %
|
Material chemically EN 573-3
|
OF-Cu 99.95 %
|
Material no
|
2.004
|
Material no
|
2.004
|
-
physical properties
Coefficient of thermal expansion from 20 to 300°C
|
17.7 K⁻¹10⁻⁶
|
Coefficient of thermal expansion from 20 to 300°C
|
17.7 K⁻¹10⁻⁶
|
Density
|
8.94 g/cm³
|
Density
|
8.94 g/cm³
|
-
Soldering
Brazing
|
1
|
Brazing
|
1
|
Soft soldering
|
1
|
Soft soldering
|
1
|
-
Welding
-
Aviation
-
Chemical specifications
Bi (to)
|
0.0005
|
Bi (to)
|
0.0005
|
O (to)
|
0.001
|
O (to)
|
0.001
|
Pb (to)
|
0.005
|
Pb (to)
|
0.005
|
Rest
|
Cu
|
Rest
|
Cu
|
-
Food industry
suitable according to DIN EN 602
|
No
|
suitable according to DIN EN 602
|
No
|
-
Material
Material chemically EN 573-3
|
OF-Cu 99.95 %
|
Material chemically EN 573-3
|
OF-Cu 99.95 %
|
Material no
|
2.004
|
Material no
|
2.004
|
-
physical properties
Coefficient of thermal expansion from 20 to 300°C
|
17.7 K⁻¹10⁻⁶
|
Coefficient of thermal expansion from 20 to 300°C
|
17.7 K⁻¹10⁻⁶
|
Density
|
8.94 g/cm³
|
Density
|
8.94 g/cm³
|
-
Soldering
Brazing
|
1
|
Brazing
|
1
|
Soft soldering
|
1
|
Soft soldering
|
1
|
-
Welding
-
Aviation
-
Chemical specifications
Bi (to)
|
0.0005
|
Bi (to)
|
0.0005
|
O (to)
|
0.001
|
O (to)
|
0.001
|
Pb (to)
|
0.005
|
Pb (to)
|
0.005
|
Rest
|
Cu
|
Rest
|
Cu
|
-
Food industry
suitable according to DIN EN 602
|
No
|
suitable according to DIN EN 602
|
No
|
-
Material
Material chemically EN 573-3
|
OF-Cu 99.95 %
|
Material chemically EN 573-3
|
OF-Cu 99.95 %
|
Material no
|
2.004
|
Material no
|
2.004
|
-
physical properties
Coefficient of thermal expansion from 20 to 300°C
|
17.7 K⁻¹10⁻⁶
|
Coefficient of thermal expansion from 20 to 300°C
|
17.7 K⁻¹10⁻⁶
|
Density
|
8.94 g/cm³
|
Density
|
8.94 g/cm³
|
-
Soldering
Brazing
|
1
|
Brazing
|
1
|
Soft soldering
|
1
|
Soft soldering
|
1
|
-
Welding
-
Aviation
-
Chemical specifications
Bi (to)
|
0.0005
|
Bi (to)
|
0.0005
|
O (to)
|
0.001
|
O (to)
|
0.001
|
Pb (to)
|
0.005
|
Pb (to)
|
0.005
|
Rest
|
Cu
|
Rest
|
Cu
|
-
Food industry
suitable according to DIN EN 602
|
No
|
suitable according to DIN EN 602
|
No
|
-
Material
Material chemically EN 573-3
|
OF-Cu 99.95 %
|
Material chemically EN 573-3
|
OF-Cu 99.95 %
|
Material no
|
2.004
|
Material no
|
2.004
|
-
physical properties
Coefficient of thermal expansion from 20 to 300°C
|
17.7 K⁻¹10⁻⁶
|
Coefficient of thermal expansion from 20 to 300°C
|
17.7 K⁻¹10⁻⁶
|
Density
|
8.94 g/cm³
|
Density
|
8.94 g/cm³
|
-
Soldering
Brazing
|
1
|
Brazing
|
1
|
Soft soldering
|
1
|
Soft soldering
|
1
|
-
Welding
-
Aviation
-
Chemical specifications
Bi (to)
|
0.0005
|
Bi (to)
|
0.0005
|
O (to)
|
0.001
|
O (to)
|
0.001
|
Pb (to)
|
0.005
|
Pb (to)
|
0.005
|
Rest
|
Cu
|
Rest
|
Cu
|
-
Food industry
suitable according to DIN EN 602
|
No
|
suitable according to DIN EN 602
|
No
|
-
Material
Material chemically EN 573-3
|
OF-Cu 99.95 %
|
Material chemically EN 573-3
|
OF-Cu 99.95 %
|
Material no
|
2.004
|
Material no
|
2.004
|
-
physical properties
Coefficient of thermal expansion from 20 to 300°C
|
17.7 K⁻¹10⁻⁶
|
Coefficient of thermal expansion from 20 to 300°C
|
17.7 K⁻¹10⁻⁶
|
Density
|
8.94 g/cm³
|
Density
|
8.94 g/cm³
|
-
Soldering
Brazing
|
1
|
Brazing
|
1
|
Soft soldering
|
1
|
Soft soldering
|
1
|
-
Welding
-
Aviation
-
Chemical specifications
Bi (to)
|
0.0005
|
Bi (to)
|
0.0005
|
O (to)
|
0.001
|
O (to)
|
0.001
|
Pb (to)
|
0.005
|
Pb (to)
|
0.005
|
Rest
|
Cu
|
Rest
|
Cu
|
-
Food industry
suitable according to DIN EN 602
|
No
|
suitable according to DIN EN 602
|
No
|
-
Material
Material chemically EN 573-3
|
OF-Cu 99.95 %
|
Material chemically EN 573-3
|
OF-Cu 99.95 %
|
Material no
|
2.004
|
Material no
|
2.004
|
-
physical properties
Coefficient of thermal expansion from 20 to 300°C
|
17.7 K⁻¹10⁻⁶
|
Coefficient of thermal expansion from 20 to 300°C
|
17.7 K⁻¹10⁻⁶
|
Density
|
8.94 g/cm³
|
Density
|
8.94 g/cm³
|
-
Soldering
Brazing
|
1
|
Brazing
|
1
|
Soft soldering
|
1
|
Soft soldering
|
1
|
-
Welding
-
Aviation
-
Chemical specifications
Bi (to)
|
0.0005
|
Bi (to)
|
0.0005
|
O (to)
|
0.001
|
O (to)
|
0.001
|
Pb (to)
|
0.005
|
Pb (to)
|
0.005
|
Rest
|
Cu
|
Rest
|
Cu
|
-
Food industry
suitable according to DIN EN 602
|
No
|
suitable according to DIN EN 602
|
No
|
-
Material
Material chemically EN 573-3
|
OF-Cu 99.95 %
|
Material chemically EN 573-3
|
OF-Cu 99.95 %
|
Material no
|
2.004
|
Material no
|
2.004
|
-
physical properties
Coefficient of thermal expansion from 20 to 300°C
|
17.7 K⁻¹10⁻⁶
|
Coefficient of thermal expansion from 20 to 300°C
|
17.7 K⁻¹10⁻⁶
|
Density
|
8.94 g/cm³
|
Density
|
8.94 g/cm³
|
-
Soldering
Brazing
|
1
|
Brazing
|
1
|
Soft soldering
|
1
|
Soft soldering
|
1
|
-
Welding
1 very good
2 good
3 moderate
4 poor
5 unsuited
0 Not specified