CW008A
plate rolled
- Form plate rolled
- Material Copper
- Material CW008A
- Material chemically EN 573-3 Cu-OF
BIKAR Metals companies
| Aviation | No |
| Bi (to) | 0,0005 |
| O (to) | 0,001 |
| Pb (to) | 0,005 |
| Rest | Cu |
| suitable according to DIN EN 602 | No |
| Material chemically EN 573-3 | Cu-OF |
| Material no | 2,004 |
| Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ |
| Density | 8.94 g/cm³ |
| Brazing | 1 |
| Soft soldering | 1 |
| Gas | 2 |
| Aviation | No |
| Bi (to) | 0,0005 |
| O (to) | 0,001 |
| Pb (to) | 0,005 |
| Rest | Cu |
| suitable according to DIN EN 602 | No |
| Material chemically EN 573-3 | Cu-OF |
| Material no | 2,004 |
| Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ |
| Density | 8.94 g/cm³ |
| Brazing | 1 |
| Soft soldering | 1 |
| Gas | 2 |
| Aviation | No |
| Bi (to) | 0,0005 |
| O (to) | 0,001 |
| Pb (to) | 0,005 |
| Rest | Cu |
| suitable according to DIN EN 602 | No |
| Material chemically EN 573-3 | Cu-OF |
| Material no | 2,004 |
| Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ |
| Density | 8.94 g/cm³ |
| Brazing | 1 |
| Soft soldering | 1 |
| Gas | 2 |
| Aviation | No |
| Bi (to) | 0,0005 |
| O (to) | 0,001 |
| Pb (to) | 0,005 |
| Rest | Cu |
| suitable according to DIN EN 602 | No |
| Material chemically EN 573-3 | Cu-OF |
| Material no | 2,004 |
| Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ |
| Density | 8.94 g/cm³ |
| Brazing | 1 |
| Soft soldering | 1 |
| Gas | 2 |
| Aviation | No |
| Bi (to) | 0,0005 |
| O (to) | 0,001 |
| Pb (to) | 0,005 |
| Rest | Cu |
| suitable according to DIN EN 602 | No |
| Material chemically EN 573-3 | Cu-OF |
| Material no | 2,004 |
| Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ |
| Density | 8.94 g/cm³ |
| Brazing | 1 |
| Soft soldering | 1 |
| Gas | 2 |
| Aviation | No |
| Bi (to) | 0,0005 |
| O (to) | 0,001 |
| Pb (to) | 0,005 |
| Rest | Cu |
| suitable according to DIN EN 602 | No |
| Material chemically EN 573-3 | Cu-OF |
| Material no | 2,004 |
| Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ |
| Density | 8.94 g/cm³ |
| Brazing | 1 |
| Soft soldering | 1 |
| Gas | 2 |
| Aviation | No |
| Bi (to) | 0,0005 |
| O (to) | 0,001 |
| Pb (to) | 0,005 |
| Rest | Cu |
| suitable according to DIN EN 602 | No |
| Material chemically EN 573-3 | Cu-OF |
| Material no | 2,004 |
| Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ |
| Density | 8.94 g/cm³ |
| Brazing | 1 |
| Soft soldering | 1 |
| Gas | 2 |
| Aviation | No |
| Bi (to) | 0,0005 |
| O (to) | 0,001 |
| Pb (to) | 0,005 |
| Rest | Cu |
| suitable according to DIN EN 602 | No |
| Material chemically EN 573-3 | Cu-OF |
| Material no | 2,004 |
| Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ |
| Density | 8.94 g/cm³ |
| Brazing | 1 |
| Soft soldering | 1 |
| Gas | 2 |
| Aviation | No |
| Bi (to) | 0,0005 |
| O (to) | 0,001 |
| Pb (to) | 0,005 |
| Rest | Cu |
| suitable according to DIN EN 602 | No |
| Material chemically EN 573-3 | Cu-OF |
| Material no | 2,004 |
| Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ |
| Density | 8.94 g/cm³ |
| Brazing | 1 |
| Soft soldering | 1 |
| Gas | 2 |
| Aviation | No |
| Bi (to) | 0,0005 |
| O (to) | 0,001 |
| Pb (to) | 0,005 |
| Rest | Cu |
| suitable according to DIN EN 602 | No |
| Material chemically EN 573-3 | Cu-OF |
| Material no | 2,004 |
| Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ |
| Density | 8.94 g/cm³ |
| Brazing | 1 |
| Soft soldering | 1 |
| Gas | 2 |
| Aviation | No |
| Bi (to) | 0,0005 |
| O (to) | 0,001 |
| Pb (to) | 0,005 |
| Rest | Cu |
| suitable according to DIN EN 602 | No |
| Material chemically EN 573-3 | Cu-OF |
| Material no | 2,004 |
| Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ |
| Density | 8.94 g/cm³ |
| Brazing | 1 |
| Soft soldering | 1 |
| Gas | 2 |
| Aviation | No |
| Bi (to) | 0,0005 |
| O (to) | 0,001 |
| Pb (to) | 0,005 |
| Rest | Cu |
| suitable according to DIN EN 602 | No |
| Material chemically EN 573-3 | Cu-OF |
| Material no | 2,004 |
| Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ |
| Density | 8.94 g/cm³ |
| Brazing | 1 |
| Soft soldering | 1 |
| Gas | 2 |
| Aviation | No |
| Bi (to) | 0,0005 |
| O (to) | 0,001 |
| Pb (to) | 0,005 |
| Rest | Cu |
| suitable according to DIN EN 602 | No |
| Material chemically EN 573-3 | Cu-OF |
| Material no | 2,004 |
| Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ |
| Density | 8.94 g/cm³ |
| Brazing | 1 |
| Soft soldering | 1 |
| Gas | 2 |
1 very good
2 good
3 moderate
4 poor
5 unsuited
0 Not specified