CW008A
plate rolled
![A technical illustration of the product with dimensions of the material CW008A from the material Copper in the shape plate rolled](https://my.bikar.com/media/cache/sylius_shop_product_detail_pictogram_thumbnail/e7/5c/65f6036692fe6b14b6afc49562cd.jpg)
- Form plate rolled
- Material Copper
- Material CW008A
- Material chemically EN 573-3 OF-Cu 99.95 %
![An image of the material CW008A from the material Copper in the shape plate rolled](https://my.bikar.com/media/cache/sylius_shop_product_detail_mainimage_thumbnail/6a/7f/9a010dc4209aed2a6c54d444d436.jpg)
![A technical illustration of the product of the material CW008A from the material Copper in the shape plate rolled](https://my.bikar.com/media/cache/sylius_shop_product_detail_media_medium_thumbnail/bc/9d/507b319646ea95744f7e7d06f85d.jpg)
BIKAR Metals companies
Aviation | No |
Bi (to) | 0.0005 |
O (to) | 0.001 |
Pb (to) | 0.005 |
Rest | Cu |
suitable according to DIN EN 602 | No |
Material chemically EN 573-3 | OF-Cu 99.95 % |
Material no | 2.004 |
Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ |
Density | 8.94 g/cm³ |
Brazing | 1 |
Soft soldering | 1 |
Gas | 2 |
Aviation | No |
Bi (to) | 0.0005 |
O (to) | 0.001 |
Pb (to) | 0.005 |
Rest | Cu |
suitable according to DIN EN 602 | No |
Material chemically EN 573-3 | OF-Cu 99.95 % |
Material no | 2.004 |
Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ |
Density | 8.94 g/cm³ |
Brazing | 1 |
Soft soldering | 1 |
Gas | 2 |
Aviation | No |
Bi (to) | 0.0005 |
O (to) | 0.001 |
Pb (to) | 0.005 |
Rest | Cu |
suitable according to DIN EN 602 | No |
Material chemically EN 573-3 | OF-Cu 99.95 % |
Material no | 2.004 |
Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ |
Density | 8.94 g/cm³ |
Brazing | 1 |
Soft soldering | 1 |
Gas | 2 |
Aviation | No |
Bi (to) | 0.0005 |
O (to) | 0.001 |
Pb (to) | 0.005 |
Rest | Cu |
suitable according to DIN EN 602 | No |
Material chemically EN 573-3 | OF-Cu 99.95 % |
Material no | 2.004 |
Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ |
Density | 8.94 g/cm³ |
Brazing | 1 |
Soft soldering | 1 |
Gas | 2 |
Aviation | No |
Bi (to) | 0.0005 |
O (to) | 0.001 |
Pb (to) | 0.005 |
Rest | Cu |
suitable according to DIN EN 602 | No |
Material chemically EN 573-3 | OF-Cu 99.95 % |
Material no | 2.004 |
Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ |
Density | 8.94 g/cm³ |
Brazing | 1 |
Soft soldering | 1 |
Gas | 2 |
Aviation | No |
Bi (to) | 0.0005 |
O (to) | 0.001 |
Pb (to) | 0.005 |
Rest | Cu |
suitable according to DIN EN 602 | No |
Material chemically EN 573-3 | OF-Cu 99.95 % |
Material no | 2.004 |
Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ |
Density | 8.94 g/cm³ |
Brazing | 1 |
Soft soldering | 1 |
Gas | 2 |
Aviation | No |
Bi (to) | 0.0005 |
O (to) | 0.001 |
Pb (to) | 0.005 |
Rest | Cu |
suitable according to DIN EN 602 | No |
Material chemically EN 573-3 | OF-Cu 99.95 % |
Material no | 2.004 |
Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ |
Density | 8.94 g/cm³ |
Brazing | 1 |
Soft soldering | 1 |
Gas | 2 |
Aviation | No |
Bi (to) | 0.0005 |
O (to) | 0.001 |
Pb (to) | 0.005 |
Rest | Cu |
suitable according to DIN EN 602 | No |
Material chemically EN 573-3 | OF-Cu 99.95 % |
Material no | 2.004 |
Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ |
Density | 8.94 g/cm³ |
Brazing | 1 |
Soft soldering | 1 |
Gas | 2 |
Aviation | No |
Bi (to) | 0.0005 |
O (to) | 0.001 |
Pb (to) | 0.005 |
Rest | Cu |
suitable according to DIN EN 602 | No |
Material chemically EN 573-3 | OF-Cu 99.95 % |
Material no | 2.004 |
Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ |
Density | 8.94 g/cm³ |
Brazing | 1 |
Soft soldering | 1 |
Gas | 2 |
Aviation | No |
Bi (to) | 0.0005 |
O (to) | 0.001 |
Pb (to) | 0.005 |
Rest | Cu |
suitable according to DIN EN 602 | No |
Material chemically EN 573-3 | OF-Cu 99.95 % |
Material no | 2.004 |
Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ |
Density | 8.94 g/cm³ |
Brazing | 1 |
Soft soldering | 1 |
Gas | 2 |
Aviation | No |
Bi (to) | 0.0005 |
O (to) | 0.001 |
Pb (to) | 0.005 |
Rest | Cu |
suitable according to DIN EN 602 | No |
Material chemically EN 573-3 | OF-Cu 99.95 % |
Material no | 2.004 |
Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ |
Density | 8.94 g/cm³ |
Brazing | 1 |
Soft soldering | 1 |
Gas | 2 |
Aviation | No |
Bi (to) | 0.0005 |
O (to) | 0.001 |
Pb (to) | 0.005 |
Rest | Cu |
suitable according to DIN EN 602 | No |
Material chemically EN 573-3 | OF-Cu 99.95 % |
Material no | 2.004 |
Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ |
Density | 8.94 g/cm³ |
Brazing | 1 |
Soft soldering | 1 |
Gas | 2 |
1 very good
2 good
3 moderate
4 poor
5 unsuited
0 Not specified