CW024A
plate rolled
- Form plate rolled
- Material Copper
- Material CW024A
- Material chemically EN 573-3 SF-Cu
Aviation | No |
P (from) | 0.015 |
P (to) | 0.04 |
Rest | Cu |
1) Die Prüfung der Wasserstoffbeständigkeit erfolgt gemäß den Festlegungen in den technischen Lieferbedingungen. Wenn diese Prüfbedingungen den Anforderungen nicht genügen, so sind andere bei
Bestellung zu vereinbaren.
suitable according to DIN EN 602 | No |
Material chemically EN 573-3 | SF-Cu |
Material no | CW024A (former: 2.0090) |
Coefficient of thermal expansion from 20 to 100°C | 16.8 K⁻¹10⁻⁶ |
Coefficient of thermal expansion from 20 to 200°C | 17.3 K⁻¹10⁻⁶ |
Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ |
Density | 8.94 g/cm³ |
Modulus of elasticity at 100°C | 128 GPa |
Modulus of elasticity at 20°C | 132 GPa |
Modulus of elasticity at 200°C | 122 GPa |
Modulus of elasticity at 300°C | 118 GPa |
Specific electrical conductivity at 100°C | 37 m/Ω*mm² |
Specific electrical conductivity at 20°C | 43 m/Ω*mm² |
Specific electrical conductivity at 200°C | 30 m/Ω*mm² |
Specific electrical resistance at 100°C | 0.027 Ω*mm²/m |
Specific electrical resistance at 20°C | 0.022 Ω*mm²/m |
Specific electrical resistance at 200°C | 0.033 Ω*mm²/m |
Specific heat at 100°C | 0.393 J/(kg·K) |
Specific heat at 20°C | 0.386 J/(kg·K) |
Specific heat at 200°C | 0.403 J/(kg·K) |
Thermal conductivity at 100°C | 318 W/m*K |
Thermal conductivity at 20°C | 305 W/m*K |
Thermal conductivity at 200°C | 334 W/m*K |
Brazing | 1 |
Soft soldering | 1 |
Gas | 1 |
MIG | 1 |
Resistance spot welding | 3 |
TIG | 1 |
1 very good
2 good
3 moderate
4 poor
5 unsuited
0 Not specified