CW024A
Round bar
 
                                    - Form Round bar
- Material Copper
- Material CW024A
- Material chemically EN 573-3 Cu-DHP
 
             
            BIKAR Metals companies
 
                                     
             
            Pipes for technical and medical gases
Condensers and heat exchangers
Finned tubes for engine radiators
Refrigeration and air-conditioning systems
Pipes and apparatus parts for the food,
Beverage and paper industries
Chemical industry
Tubes for all non-corrosive liquids
External or internal cladding
Sealing in the building industry
Electrical and electromagnetic shielding
Anodes for electroplating and galvanoplastics
Pressure vessels
Storage tanks and cylinders
Pressure rollers
Clad sheets
| Aviation | No | 
| P (from) | 0,015 | 
| P (to) | 0,04 | 
| Rest | Cu | 
| suitable according to DIN EN 602 | No | 
| Material chemically EN 573-3 | Cu-DHP | 
| Material no | CW024A (former: 2.0090) | 
| Coefficient of thermal expansion from 20 to 100°C | 16.8 K⁻¹10⁻⁶ | 
| Coefficient of thermal expansion from 20 to 200°C | 17.3 K⁻¹10⁻⁶ | 
| Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ | 
| Density | 8.94 g/cm³ | 
| Modulus of elasticity at 100°C | 128 GPa | 
| Modulus of elasticity at 20°C | 132 GPa | 
| Modulus of elasticity at 200°C | 122 GPa | 
| Modulus of elasticity at 300°C | 118 GPa | 
| Specific electrical conductivity at 100°C | 37 m/Ω*mm² | 
| Specific electrical conductivity at 20°C | 43 m/Ω*mm² | 
| Specific electrical conductivity at 200°C | 30 m/Ω*mm² | 
| Specific electrical resistance at 100°C | 0.027 Ω*mm²/m | 
| Specific electrical resistance at 20°C | 0.022 Ω*mm²/m | 
| Specific electrical resistance at 200°C | 0.033 Ω*mm²/m | 
| Specific heat at 100°C | 0.393 J/(kg·K) | 
| Specific heat at 20°C | 0.386 J/(kg·K) | 
| Specific heat at 200°C | 0.403 J/(kg·K) | 
| Thermal conductivity at 100°C | 318 W/m*K | 
| Thermal conductivity at 20°C | 305 W/m*K | 
| Thermal conductivity at 200°C | 334 W/m*K | 
| Brazing | 1 | 
| Soft soldering | 1 | 
| Gas | 1 | 
| MIG | 1 | 
| Resistance spot welding | 3 | 
| TIG | 1 | 
| Aviation | No | 
| P (from) | 0,015 | 
| P (to) | 0,04 | 
| Rest | Cu | 
| suitable according to DIN EN 602 | No | 
| Material chemically EN 573-3 | Cu-DHP | 
| Material no | CW024A (former: 2.0090) | 
| Coefficient of thermal expansion from 20 to 100°C | 16.8 K⁻¹10⁻⁶ | 
| Coefficient of thermal expansion from 20 to 200°C | 17.3 K⁻¹10⁻⁶ | 
| Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ | 
| Density | 8.94 g/cm³ | 
| Modulus of elasticity at 100°C | 128 GPa | 
| Modulus of elasticity at 20°C | 132 GPa | 
| Modulus of elasticity at 200°C | 122 GPa | 
| Modulus of elasticity at 300°C | 118 GPa | 
| Specific electrical conductivity at 100°C | 37 m/Ω*mm² | 
| Specific electrical conductivity at 20°C | 43 m/Ω*mm² | 
| Specific electrical conductivity at 200°C | 30 m/Ω*mm² | 
| Specific electrical resistance at 100°C | 0.027 Ω*mm²/m | 
| Specific electrical resistance at 20°C | 0.022 Ω*mm²/m | 
| Specific electrical resistance at 200°C | 0.033 Ω*mm²/m | 
| Specific heat at 100°C | 0.393 J/(kg·K) | 
| Specific heat at 20°C | 0.386 J/(kg·K) | 
| Specific heat at 200°C | 0.403 J/(kg·K) | 
| Thermal conductivity at 100°C | 318 W/m*K | 
| Thermal conductivity at 20°C | 305 W/m*K | 
| Thermal conductivity at 200°C | 334 W/m*K | 
| Brazing | 1 | 
| Soft soldering | 1 | 
| Gas | 1 | 
| MIG | 1 | 
| Resistance spot welding | 3 | 
| TIG | 1 | 
| Aviation | No | 
| P (from) | 0,015 | 
| P (to) | 0,04 | 
| Rest | Cu | 
| suitable according to DIN EN 602 | No | 
| Material chemically EN 573-3 | Cu-DHP | 
| Material no | CW024A (former: 2.0090) | 
| Coefficient of thermal expansion from 20 to 100°C | 16.8 K⁻¹10⁻⁶ | 
| Coefficient of thermal expansion from 20 to 200°C | 17.3 K⁻¹10⁻⁶ | 
| Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ | 
| Density | 8.94 g/cm³ | 
| Modulus of elasticity at 100°C | 128 GPa | 
| Modulus of elasticity at 20°C | 132 GPa | 
| Modulus of elasticity at 200°C | 122 GPa | 
| Modulus of elasticity at 300°C | 118 GPa | 
| Specific electrical conductivity at 100°C | 37 m/Ω*mm² | 
| Specific electrical conductivity at 20°C | 43 m/Ω*mm² | 
| Specific electrical conductivity at 200°C | 30 m/Ω*mm² | 
| Specific electrical resistance at 100°C | 0.027 Ω*mm²/m | 
| Specific electrical resistance at 20°C | 0.022 Ω*mm²/m | 
| Specific electrical resistance at 200°C | 0.033 Ω*mm²/m | 
| Specific heat at 100°C | 0.393 J/(kg·K) | 
| Specific heat at 20°C | 0.386 J/(kg·K) | 
| Specific heat at 200°C | 0.403 J/(kg·K) | 
| Thermal conductivity at 100°C | 318 W/m*K | 
| Thermal conductivity at 20°C | 305 W/m*K | 
| Thermal conductivity at 200°C | 334 W/m*K | 
| Brazing | 1 | 
| Soft soldering | 1 | 
| Gas | 1 | 
| MIG | 1 | 
| Resistance spot welding | 3 | 
| TIG | 1 | 
| Aviation | No | 
| P (from) | 0,015 | 
| P (to) | 0,04 | 
| Rest | Cu | 
| suitable according to DIN EN 602 | No | 
| Material chemically EN 573-3 | Cu-DHP | 
| Material no | CW024A (former: 2.0090) | 
| Coefficient of thermal expansion from 20 to 100°C | 16.8 K⁻¹10⁻⁶ | 
| Coefficient of thermal expansion from 20 to 200°C | 17.3 K⁻¹10⁻⁶ | 
| Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ | 
| Density | 8.94 g/cm³ | 
| Modulus of elasticity at 100°C | 128 GPa | 
| Modulus of elasticity at 20°C | 132 GPa | 
| Modulus of elasticity at 200°C | 122 GPa | 
| Modulus of elasticity at 300°C | 118 GPa | 
| Specific electrical conductivity at 100°C | 37 m/Ω*mm² | 
| Specific electrical conductivity at 20°C | 43 m/Ω*mm² | 
| Specific electrical conductivity at 200°C | 30 m/Ω*mm² | 
| Specific electrical resistance at 100°C | 0.027 Ω*mm²/m | 
| Specific electrical resistance at 20°C | 0.022 Ω*mm²/m | 
| Specific electrical resistance at 200°C | 0.033 Ω*mm²/m | 
| Specific heat at 100°C | 0.393 J/(kg·K) | 
| Specific heat at 20°C | 0.386 J/(kg·K) | 
| Specific heat at 200°C | 0.403 J/(kg·K) | 
| Thermal conductivity at 100°C | 318 W/m*K | 
| Thermal conductivity at 20°C | 305 W/m*K | 
| Thermal conductivity at 200°C | 334 W/m*K | 
| Brazing | 1 | 
| Soft soldering | 1 | 
| Gas | 1 | 
| MIG | 1 | 
| Resistance spot welding | 3 | 
| TIG | 1 | 
| Aviation | No | 
| P (from) | 0,015 | 
| P (to) | 0,04 | 
| Rest | Cu | 
| suitable according to DIN EN 602 | No | 
| Material chemically EN 573-3 | Cu-DHP | 
| Material no | CW024A (former: 2.0090) | 
| Coefficient of thermal expansion from 20 to 100°C | 16.8 K⁻¹10⁻⁶ | 
| Coefficient of thermal expansion from 20 to 200°C | 17.3 K⁻¹10⁻⁶ | 
| Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ | 
| Density | 8.94 g/cm³ | 
| Modulus of elasticity at 100°C | 128 GPa | 
| Modulus of elasticity at 20°C | 132 GPa | 
| Modulus of elasticity at 200°C | 122 GPa | 
| Modulus of elasticity at 300°C | 118 GPa | 
| Specific electrical conductivity at 100°C | 37 m/Ω*mm² | 
| Specific electrical conductivity at 20°C | 43 m/Ω*mm² | 
| Specific electrical conductivity at 200°C | 30 m/Ω*mm² | 
| Specific electrical resistance at 100°C | 0.027 Ω*mm²/m | 
| Specific electrical resistance at 20°C | 0.022 Ω*mm²/m | 
| Specific electrical resistance at 200°C | 0.033 Ω*mm²/m | 
| Specific heat at 100°C | 0.393 J/(kg·K) | 
| Specific heat at 20°C | 0.386 J/(kg·K) | 
| Specific heat at 200°C | 0.403 J/(kg·K) | 
| Thermal conductivity at 100°C | 318 W/m*K | 
| Thermal conductivity at 20°C | 305 W/m*K | 
| Thermal conductivity at 200°C | 334 W/m*K | 
| Brazing | 1 | 
| Soft soldering | 1 | 
| Gas | 1 | 
| MIG | 1 | 
| Resistance spot welding | 3 | 
| TIG | 1 | 
| Aviation | No | 
| P (from) | 0,015 | 
| P (to) | 0,04 | 
| Rest | Cu | 
| suitable according to DIN EN 602 | No | 
| Material chemically EN 573-3 | Cu-DHP | 
| Material no | CW024A (former: 2.0090) | 
| Coefficient of thermal expansion from 20 to 100°C | 16.8 K⁻¹10⁻⁶ | 
| Coefficient of thermal expansion from 20 to 200°C | 17.3 K⁻¹10⁻⁶ | 
| Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ | 
| Density | 8.94 g/cm³ | 
| Modulus of elasticity at 100°C | 128 GPa | 
| Modulus of elasticity at 20°C | 132 GPa | 
| Modulus of elasticity at 200°C | 122 GPa | 
| Modulus of elasticity at 300°C | 118 GPa | 
| Specific electrical conductivity at 100°C | 37 m/Ω*mm² | 
| Specific electrical conductivity at 20°C | 43 m/Ω*mm² | 
| Specific electrical conductivity at 200°C | 30 m/Ω*mm² | 
| Specific electrical resistance at 100°C | 0.027 Ω*mm²/m | 
| Specific electrical resistance at 20°C | 0.022 Ω*mm²/m | 
| Specific electrical resistance at 200°C | 0.033 Ω*mm²/m | 
| Specific heat at 100°C | 0.393 J/(kg·K) | 
| Specific heat at 20°C | 0.386 J/(kg·K) | 
| Specific heat at 200°C | 0.403 J/(kg·K) | 
| Thermal conductivity at 100°C | 318 W/m*K | 
| Thermal conductivity at 20°C | 305 W/m*K | 
| Thermal conductivity at 200°C | 334 W/m*K | 
| Brazing | 1 | 
| Soft soldering | 1 | 
| Gas | 1 | 
| MIG | 1 | 
| Resistance spot welding | 3 | 
| TIG | 1 | 
| Aviation | No | 
| P (from) | 0,015 | 
| P (to) | 0,04 | 
| Rest | Cu | 
| suitable according to DIN EN 602 | No | 
| Material chemically EN 573-3 | Cu-DHP | 
| Material no | CW024A (former: 2.0090) | 
| Coefficient of thermal expansion from 20 to 100°C | 16.8 K⁻¹10⁻⁶ | 
| Coefficient of thermal expansion from 20 to 200°C | 17.3 K⁻¹10⁻⁶ | 
| Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ | 
| Density | 8.94 g/cm³ | 
| Modulus of elasticity at 100°C | 128 GPa | 
| Modulus of elasticity at 20°C | 132 GPa | 
| Modulus of elasticity at 200°C | 122 GPa | 
| Modulus of elasticity at 300°C | 118 GPa | 
| Specific electrical conductivity at 100°C | 37 m/Ω*mm² | 
| Specific electrical conductivity at 20°C | 43 m/Ω*mm² | 
| Specific electrical conductivity at 200°C | 30 m/Ω*mm² | 
| Specific electrical resistance at 100°C | 0.027 Ω*mm²/m | 
| Specific electrical resistance at 20°C | 0.022 Ω*mm²/m | 
| Specific electrical resistance at 200°C | 0.033 Ω*mm²/m | 
| Specific heat at 100°C | 0.393 J/(kg·K) | 
| Specific heat at 20°C | 0.386 J/(kg·K) | 
| Specific heat at 200°C | 0.403 J/(kg·K) | 
| Thermal conductivity at 100°C | 318 W/m*K | 
| Thermal conductivity at 20°C | 305 W/m*K | 
| Thermal conductivity at 200°C | 334 W/m*K | 
| Brazing | 1 | 
| Soft soldering | 1 | 
| Gas | 1 | 
| MIG | 1 | 
| Resistance spot welding | 3 | 
| TIG | 1 | 
| Aviation | No | 
| P (from) | 0,015 | 
| P (to) | 0,04 | 
| Rest | Cu | 
| suitable according to DIN EN 602 | No | 
| Material chemically EN 573-3 | Cu-DHP | 
| Material no | CW024A (former: 2.0090) | 
| Coefficient of thermal expansion from 20 to 100°C | 16.8 K⁻¹10⁻⁶ | 
| Coefficient of thermal expansion from 20 to 200°C | 17.3 K⁻¹10⁻⁶ | 
| Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ | 
| Density | 8.94 g/cm³ | 
| Modulus of elasticity at 100°C | 128 GPa | 
| Modulus of elasticity at 20°C | 132 GPa | 
| Modulus of elasticity at 200°C | 122 GPa | 
| Modulus of elasticity at 300°C | 118 GPa | 
| Specific electrical conductivity at 100°C | 37 m/Ω*mm² | 
| Specific electrical conductivity at 20°C | 43 m/Ω*mm² | 
| Specific electrical conductivity at 200°C | 30 m/Ω*mm² | 
| Specific electrical resistance at 100°C | 0.027 Ω*mm²/m | 
| Specific electrical resistance at 20°C | 0.022 Ω*mm²/m | 
| Specific electrical resistance at 200°C | 0.033 Ω*mm²/m | 
| Specific heat at 100°C | 0.393 J/(kg·K) | 
| Specific heat at 20°C | 0.386 J/(kg·K) | 
| Specific heat at 200°C | 0.403 J/(kg·K) | 
| Thermal conductivity at 100°C | 318 W/m*K | 
| Thermal conductivity at 20°C | 305 W/m*K | 
| Thermal conductivity at 200°C | 334 W/m*K | 
| Brazing | 1 | 
| Soft soldering | 1 | 
| Gas | 1 | 
| MIG | 1 | 
| Resistance spot welding | 3 | 
| TIG | 1 | 
| Aviation | No | 
| P (from) | 0,015 | 
| P (to) | 0,04 | 
| Rest | Cu | 
| suitable according to DIN EN 602 | No | 
| Material chemically EN 573-3 | Cu-DHP | 
| Material no | CW024A (former: 2.0090) | 
| Coefficient of thermal expansion from 20 to 100°C | 16.8 K⁻¹10⁻⁶ | 
| Coefficient of thermal expansion from 20 to 200°C | 17.3 K⁻¹10⁻⁶ | 
| Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ | 
| Density | 8.94 g/cm³ | 
| Modulus of elasticity at 100°C | 128 GPa | 
| Modulus of elasticity at 20°C | 132 GPa | 
| Modulus of elasticity at 200°C | 122 GPa | 
| Modulus of elasticity at 300°C | 118 GPa | 
| Specific electrical conductivity at 100°C | 37 m/Ω*mm² | 
| Specific electrical conductivity at 20°C | 43 m/Ω*mm² | 
| Specific electrical conductivity at 200°C | 30 m/Ω*mm² | 
| Specific electrical resistance at 100°C | 0.027 Ω*mm²/m | 
| Specific electrical resistance at 20°C | 0.022 Ω*mm²/m | 
| Specific electrical resistance at 200°C | 0.033 Ω*mm²/m | 
| Specific heat at 100°C | 0.393 J/(kg·K) | 
| Specific heat at 20°C | 0.386 J/(kg·K) | 
| Specific heat at 200°C | 0.403 J/(kg·K) | 
| Thermal conductivity at 100°C | 318 W/m*K | 
| Thermal conductivity at 20°C | 305 W/m*K | 
| Thermal conductivity at 200°C | 334 W/m*K | 
| Brazing | 1 | 
| Soft soldering | 1 | 
| Gas | 1 | 
| MIG | 1 | 
| Resistance spot welding | 3 | 
| TIG | 1 | 
| Aviation | No | 
| P (from) | 0,015 | 
| P (to) | 0,04 | 
| Rest | Cu | 
| suitable according to DIN EN 602 | No | 
| Material chemically EN 573-3 | Cu-DHP | 
| Material no | CW024A (former: 2.0090) | 
| Coefficient of thermal expansion from 20 to 100°C | 16.8 K⁻¹10⁻⁶ | 
| Coefficient of thermal expansion from 20 to 200°C | 17.3 K⁻¹10⁻⁶ | 
| Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ | 
| Density | 8.94 g/cm³ | 
| Modulus of elasticity at 100°C | 128 GPa | 
| Modulus of elasticity at 20°C | 132 GPa | 
| Modulus of elasticity at 200°C | 122 GPa | 
| Modulus of elasticity at 300°C | 118 GPa | 
| Specific electrical conductivity at 100°C | 37 m/Ω*mm² | 
| Specific electrical conductivity at 20°C | 43 m/Ω*mm² | 
| Specific electrical conductivity at 200°C | 30 m/Ω*mm² | 
| Specific electrical resistance at 100°C | 0.027 Ω*mm²/m | 
| Specific electrical resistance at 20°C | 0.022 Ω*mm²/m | 
| Specific electrical resistance at 200°C | 0.033 Ω*mm²/m | 
| Specific heat at 100°C | 0.393 J/(kg·K) | 
| Specific heat at 20°C | 0.386 J/(kg·K) | 
| Specific heat at 200°C | 0.403 J/(kg·K) | 
| Thermal conductivity at 100°C | 318 W/m*K | 
| Thermal conductivity at 20°C | 305 W/m*K | 
| Thermal conductivity at 200°C | 334 W/m*K | 
| Brazing | 1 | 
| Soft soldering | 1 | 
| Gas | 1 | 
| MIG | 1 | 
| Resistance spot welding | 3 | 
| TIG | 1 | 
| Aviation | No | 
| P (from) | 0,015 | 
| P (to) | 0,04 | 
| Rest | Cu | 
| suitable according to DIN EN 602 | No | 
| Material chemically EN 573-3 | Cu-DHP | 
| Material no | CW024A (former: 2.0090) | 
| Coefficient of thermal expansion from 20 to 100°C | 16.8 K⁻¹10⁻⁶ | 
| Coefficient of thermal expansion from 20 to 200°C | 17.3 K⁻¹10⁻⁶ | 
| Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ | 
| Density | 8.94 g/cm³ | 
| Modulus of elasticity at 100°C | 128 GPa | 
| Modulus of elasticity at 20°C | 132 GPa | 
| Modulus of elasticity at 200°C | 122 GPa | 
| Modulus of elasticity at 300°C | 118 GPa | 
| Specific electrical conductivity at 100°C | 37 m/Ω*mm² | 
| Specific electrical conductivity at 20°C | 43 m/Ω*mm² | 
| Specific electrical conductivity at 200°C | 30 m/Ω*mm² | 
| Specific electrical resistance at 100°C | 0.027 Ω*mm²/m | 
| Specific electrical resistance at 20°C | 0.022 Ω*mm²/m | 
| Specific electrical resistance at 200°C | 0.033 Ω*mm²/m | 
| Specific heat at 100°C | 0.393 J/(kg·K) | 
| Specific heat at 20°C | 0.386 J/(kg·K) | 
| Specific heat at 200°C | 0.403 J/(kg·K) | 
| Thermal conductivity at 100°C | 318 W/m*K | 
| Thermal conductivity at 20°C | 305 W/m*K | 
| Thermal conductivity at 200°C | 334 W/m*K | 
| Brazing | 1 | 
| Soft soldering | 1 | 
| Gas | 1 | 
| MIG | 1 | 
| Resistance spot welding | 3 | 
| TIG | 1 | 
| Aviation | No | 
| P (from) | 0,015 | 
| P (to) | 0,04 | 
| Rest | Cu | 
| suitable according to DIN EN 602 | No | 
| Material chemically EN 573-3 | Cu-DHP | 
| Material no | CW024A (former: 2.0090) | 
| Coefficient of thermal expansion from 20 to 100°C | 16.8 K⁻¹10⁻⁶ | 
| Coefficient of thermal expansion from 20 to 200°C | 17.3 K⁻¹10⁻⁶ | 
| Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ | 
| Density | 8.94 g/cm³ | 
| Modulus of elasticity at 100°C | 128 GPa | 
| Modulus of elasticity at 20°C | 132 GPa | 
| Modulus of elasticity at 200°C | 122 GPa | 
| Modulus of elasticity at 300°C | 118 GPa | 
| Specific electrical conductivity at 100°C | 37 m/Ω*mm² | 
| Specific electrical conductivity at 20°C | 43 m/Ω*mm² | 
| Specific electrical conductivity at 200°C | 30 m/Ω*mm² | 
| Specific electrical resistance at 100°C | 0.027 Ω*mm²/m | 
| Specific electrical resistance at 20°C | 0.022 Ω*mm²/m | 
| Specific electrical resistance at 200°C | 0.033 Ω*mm²/m | 
| Specific heat at 100°C | 0.393 J/(kg·K) | 
| Specific heat at 20°C | 0.386 J/(kg·K) | 
| Specific heat at 200°C | 0.403 J/(kg·K) | 
| Thermal conductivity at 100°C | 318 W/m*K | 
| Thermal conductivity at 20°C | 305 W/m*K | 
| Thermal conductivity at 200°C | 334 W/m*K | 
| Brazing | 1 | 
| Soft soldering | 1 | 
| Gas | 1 | 
| MIG | 1 | 
| Resistance spot welding | 3 | 
| TIG | 1 | 
| Aviation | No | 
| P (from) | 0,015 | 
| P (to) | 0,04 | 
| Rest | Cu | 
| suitable according to DIN EN 602 | No | 
| Material chemically EN 573-3 | Cu-DHP | 
| Material no | CW024A (former: 2.0090) | 
| Coefficient of thermal expansion from 20 to 100°C | 16.8 K⁻¹10⁻⁶ | 
| Coefficient of thermal expansion from 20 to 200°C | 17.3 K⁻¹10⁻⁶ | 
| Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ | 
| Density | 8.94 g/cm³ | 
| Modulus of elasticity at 100°C | 128 GPa | 
| Modulus of elasticity at 20°C | 132 GPa | 
| Modulus of elasticity at 200°C | 122 GPa | 
| Modulus of elasticity at 300°C | 118 GPa | 
| Specific electrical conductivity at 100°C | 37 m/Ω*mm² | 
| Specific electrical conductivity at 20°C | 43 m/Ω*mm² | 
| Specific electrical conductivity at 200°C | 30 m/Ω*mm² | 
| Specific electrical resistance at 100°C | 0.027 Ω*mm²/m | 
| Specific electrical resistance at 20°C | 0.022 Ω*mm²/m | 
| Specific electrical resistance at 200°C | 0.033 Ω*mm²/m | 
| Specific heat at 100°C | 0.393 J/(kg·K) | 
| Specific heat at 20°C | 0.386 J/(kg·K) | 
| Specific heat at 200°C | 0.403 J/(kg·K) | 
| Thermal conductivity at 100°C | 318 W/m*K | 
| Thermal conductivity at 20°C | 305 W/m*K | 
| Thermal conductivity at 200°C | 334 W/m*K | 
| Brazing | 1 | 
| Soft soldering | 1 | 
| Gas | 1 | 
| MIG | 1 | 
| Resistance spot welding | 3 | 
| TIG | 1 | 
| Aviation | No | 
| P (from) | 0,015 | 
| P (to) | 0,04 | 
| Rest | Cu | 
| suitable according to DIN EN 602 | No | 
| Material chemically EN 573-3 | Cu-DHP | 
| Material no | CW024A (former: 2.0090) | 
| Coefficient of thermal expansion from 20 to 100°C | 16.8 K⁻¹10⁻⁶ | 
| Coefficient of thermal expansion from 20 to 200°C | 17.3 K⁻¹10⁻⁶ | 
| Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ | 
| Density | 8.94 g/cm³ | 
| Modulus of elasticity at 100°C | 128 GPa | 
| Modulus of elasticity at 20°C | 132 GPa | 
| Modulus of elasticity at 200°C | 122 GPa | 
| Modulus of elasticity at 300°C | 118 GPa | 
| Specific electrical conductivity at 100°C | 37 m/Ω*mm² | 
| Specific electrical conductivity at 20°C | 43 m/Ω*mm² | 
| Specific electrical conductivity at 200°C | 30 m/Ω*mm² | 
| Specific electrical resistance at 100°C | 0.027 Ω*mm²/m | 
| Specific electrical resistance at 20°C | 0.022 Ω*mm²/m | 
| Specific electrical resistance at 200°C | 0.033 Ω*mm²/m | 
| Specific heat at 100°C | 0.393 J/(kg·K) | 
| Specific heat at 20°C | 0.386 J/(kg·K) | 
| Specific heat at 200°C | 0.403 J/(kg·K) | 
| Thermal conductivity at 100°C | 318 W/m*K | 
| Thermal conductivity at 20°C | 305 W/m*K | 
| Thermal conductivity at 200°C | 334 W/m*K | 
| Brazing | 1 | 
| Soft soldering | 1 | 
| Gas | 1 | 
| MIG | 1 | 
| Resistance spot welding | 3 | 
| TIG | 1 | 
| Aviation | No | 
| P (from) | 0,015 | 
| P (to) | 0,04 | 
| Rest | Cu | 
| suitable according to DIN EN 602 | No | 
| Material chemically EN 573-3 | Cu-DHP | 
| Material no | CW024A (former: 2.0090) | 
| Coefficient of thermal expansion from 20 to 100°C | 16.8 K⁻¹10⁻⁶ | 
| Coefficient of thermal expansion from 20 to 200°C | 17.3 K⁻¹10⁻⁶ | 
| Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ | 
| Density | 8.94 g/cm³ | 
| Modulus of elasticity at 100°C | 128 GPa | 
| Modulus of elasticity at 20°C | 132 GPa | 
| Modulus of elasticity at 200°C | 122 GPa | 
| Modulus of elasticity at 300°C | 118 GPa | 
| Specific electrical conductivity at 100°C | 37 m/Ω*mm² | 
| Specific electrical conductivity at 20°C | 43 m/Ω*mm² | 
| Specific electrical conductivity at 200°C | 30 m/Ω*mm² | 
| Specific electrical resistance at 100°C | 0.027 Ω*mm²/m | 
| Specific electrical resistance at 20°C | 0.022 Ω*mm²/m | 
| Specific electrical resistance at 200°C | 0.033 Ω*mm²/m | 
| Specific heat at 100°C | 0.393 J/(kg·K) | 
| Specific heat at 20°C | 0.386 J/(kg·K) | 
| Specific heat at 200°C | 0.403 J/(kg·K) | 
| Thermal conductivity at 100°C | 318 W/m*K | 
| Thermal conductivity at 20°C | 305 W/m*K | 
| Thermal conductivity at 200°C | 334 W/m*K | 
| Brazing | 1 | 
| Soft soldering | 1 | 
| Gas | 1 | 
| MIG | 1 | 
| Resistance spot welding | 3 | 
| TIG | 1 | 
| Aviation | No | 
| P (from) | 0,015 | 
| P (to) | 0,04 | 
| Rest | Cu | 
| suitable according to DIN EN 602 | No | 
| Material chemically EN 573-3 | Cu-DHP | 
| Material no | CW024A (former: 2.0090) | 
| Coefficient of thermal expansion from 20 to 100°C | 16.8 K⁻¹10⁻⁶ | 
| Coefficient of thermal expansion from 20 to 200°C | 17.3 K⁻¹10⁻⁶ | 
| Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ | 
| Density | 8.94 g/cm³ | 
| Modulus of elasticity at 100°C | 128 GPa | 
| Modulus of elasticity at 20°C | 132 GPa | 
| Modulus of elasticity at 200°C | 122 GPa | 
| Modulus of elasticity at 300°C | 118 GPa | 
| Specific electrical conductivity at 100°C | 37 m/Ω*mm² | 
| Specific electrical conductivity at 20°C | 43 m/Ω*mm² | 
| Specific electrical conductivity at 200°C | 30 m/Ω*mm² | 
| Specific electrical resistance at 100°C | 0.027 Ω*mm²/m | 
| Specific electrical resistance at 20°C | 0.022 Ω*mm²/m | 
| Specific electrical resistance at 200°C | 0.033 Ω*mm²/m | 
| Specific heat at 100°C | 0.393 J/(kg·K) | 
| Specific heat at 20°C | 0.386 J/(kg·K) | 
| Specific heat at 200°C | 0.403 J/(kg·K) | 
| Thermal conductivity at 100°C | 318 W/m*K | 
| Thermal conductivity at 20°C | 305 W/m*K | 
| Thermal conductivity at 200°C | 334 W/m*K | 
| Brazing | 1 | 
| Soft soldering | 1 | 
| Gas | 1 | 
| MIG | 1 | 
| Resistance spot welding | 3 | 
| TIG | 1 | 
                            1 very good
                            2 good
                            3 moderate
                            4 poor
                            5 unsuited
                            0 Not specified