CW021A
tube round in rings
- Form tube round in rings
- Material Copper
- Material CW021A
- Material chemically EN 573-3 SE-Cu (Cu-HCP)
Aviation | No |
Bi (from) | 0.0005 |
Bi (to) | 0.0005 |
Cu footnote reference | Einschließlich Silber bis max. 0,015 %. |
Other | 0.03 |
P (from) | 0.002 |
P (to) | 0.007 |
Pb (from) | 0.005 |
Pb (to) | 0.005 |
Rest | Cu |
suitable according to DIN EN 602 | No |
Material chemically EN 573-3 | SE-Cu (Cu-HCP) |
Material no | CW021A |
Coefficient of thermal expansion from 20 to 100°C | 16.9 K⁻¹10⁻⁶ |
Coefficient of thermal expansion from 20 to 200°C | 17.3 K⁻¹10⁻⁶ |
Coefficient of thermal expansion from 20 to 300°C | 17.6 K⁻¹10⁻⁶ |
Density | 8.94 g/cm³ |
Modulus of elasticity at 100°C | 119 GPa |
Modulus of elasticity at 20°C | 115 GPa |
Modulus of elasticity at 200°C | 91 GPa |
Specific electrical conductivity at 100°C | 43.6 m/Ω*mm² |
Specific electrical conductivity at 20°C | 57 m/Ω*mm² |
Specific electrical conductivity at 200°C | 33.7 m/Ω*mm² |
Specific electrical resistance at 100°C | 0.0229 Ω*mm²/m |
Specific electrical resistance at 20°C | 0.0169 Ω*mm²/m |
Specific electrical resistance at 200°C | 0.0297 Ω*mm²/m |
Specific heat at 100°C | 0.393 J/(kg·K) |
Specific heat at 20°C | 0.385 J/(kg·K) |
Specific heat at 200°C | 0.403 J/(kg·K) |
Thermal conductivity at 20°C | 385 W/m*K |
Brazing | 1 |
Soft soldering | 1 |
Gas | 4 |
Laser | 3 |
MIG | 2 |
Resistance spot welding | 5 |
TIG | 2 |
1 very good
2 good
3 moderate
4 poor
5 unsuited
0 Not specified