-
Aviation
-
Chemical specifications
Bi (from)
|
0.0005
|
Bi (to)
|
0.0005
|
Cu footnote reference
|
Einschließlich Silber bis max. 0,015 %
|
Other
|
0.03
|
Pb (from)
|
0.005
|
Pb (to)
|
0.005
|
Rest
|
Cu
|
-
Food industry
suitable according to DIN EN 602
|
No
|
-
Material
Material chemically EN 573-3
|
E-Cu 58 (Cu-ETP)
|
Material no
|
CW004A (former 2.0065, 2.0060)
|
-
physical properties
Coefficient of thermal expansion from 20 to 100°C
|
16.8 K⁻¹10⁻⁶
|
Coefficient of thermal expansion from 20 to 200°C
|
17.3 K⁻¹10⁻⁶
|
Coefficient of thermal expansion from 20 to 300°C
|
17.7 K⁻¹10⁻⁶
|
Density
|
8.93 g/cm³
|
Modulus of elasticity at 100°C
|
126 GPa
|
Modulus of elasticity at 20°C
|
130 GPa
|
Modulus of elasticity at 200°C
|
122 GPa
|
Modulus of elasticity at 300°C
|
116 GPa
|
Specific electrical conductivity at 100°C
|
43 m/Ω*mm²
|
Specific electrical conductivity at 20°C
|
57 m/Ω*mm²
|
Specific electrical conductivity at 200°C
|
33 m/Ω*mm²
|
Specific electrical conductivity at -100°C
|
110 m/Ω*mm²
|
Specific electrical conductivity at -200°C
|
460 m/Ω*mm²
|
Specific electrical resistance at 100°C
|
0.023 Ω*mm²/m
|
Specific electrical resistance at 20°C
|
0.018 Ω*mm²/m
|
Specific electrical resistance at 200°C
|
0.03 Ω*mm²/m
|
Specific electrical resistance at -100°C
|
0.009 Ω*mm²/m
|
Specific electrical resistance at -200°C
|
0.002 Ω*mm²/m
|
Specific heat at 100°C
|
0.393 J/(kg·K)
|
Specific heat at 20°C
|
0.386 J/(kg·K)
|
Specific heat at 200°C
|
0.403 J/(kg·K)
|
Thermal conductivity at 100°C
|
385 W/m*K
|
Thermal conductivity at 20°C
|
394 W/m*K
|
Thermal conductivity at 200°C
|
381 W/m*K
|
Thermal conductivity at -100°C
|
435 W/m*K
|
Thermal conductivity at -200°C
|
574 W/m*K
|
-
Soldering
Brazing
|
2
|
Soft soldering
|
1
|
-
Welding
Gas
|
5
|
MIG
|
5
|
Resistance spot welding
|
5
|
TIG
|
5
|
1 very good
2 good
3 moderate
4 poor
5 unsuited
0 Not specified