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CW004A

ring

A technical illustration of the product with dimensions of the material CW004A from the material Copper in the shape ring
  • Form ring
  • Material Copper
  • Material CW004A
  • Material chemically EN 573-3 E-Cu 58 (Cu-ETP)

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An image of the material CW004A from the material Copper in the shape ring

Information about the material

  • Aviation
    Aviation No
  • Chemical specifications
    Bi (from) 0.0005
    Bi (to) 0.0005
    Cu footnote reference Einschließlich Silber bis max. 0,015 %
    Other 0.03
    Pb (from) 0.005
    Pb (to) 0.005
    Rest Cu
  • Food industry
    suitable according to DIN EN 602 No
  • Material
    Material chemically EN 573-3 E-Cu 58 (Cu-ETP)
    Material no CW004A (former 2.0065, 2.0060)
  • physical properties
    Coefficient of thermal expansion from 20 to 100°C 16.8 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 200°C 17.3 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 300°C 17.7 K⁻¹10⁻⁶
    Density 8.93 g/cm³
    Modulus of elasticity at 100°C 126 GPa
    Modulus of elasticity at 20°C 130 GPa
    Modulus of elasticity at 200°C 122 GPa
    Modulus of elasticity at 300°C 116 GPa
    Specific electrical conductivity at 100°C 43 m/Ω*mm²
    Specific electrical conductivity at 20°C 57 m/Ω*mm²
    Specific electrical conductivity at 200°C 33 m/Ω*mm²
    Specific electrical conductivity at -100°C 110 m/Ω*mm²
    Specific electrical conductivity at -200°C 460 m/Ω*mm²
    Specific electrical resistance at 100°C 0.023 Ω*mm²/m
    Specific electrical resistance at 20°C 0.018 Ω*mm²/m
    Specific electrical resistance at 200°C 0.03 Ω*mm²/m
    Specific electrical resistance at -100°C 0.009 Ω*mm²/m
    Specific electrical resistance at -200°C 0.002 Ω*mm²/m
    Specific heat at 100°C 0.393 J/(kg·K)
    Specific heat at 20°C 0.386 J/(kg·K)
    Specific heat at 200°C 0.403 J/(kg·K)
    Thermal conductivity at 100°C 385 W/m*K
    Thermal conductivity at 20°C 394 W/m*K
    Thermal conductivity at 200°C 381 W/m*K
    Thermal conductivity at -100°C 435 W/m*K
    Thermal conductivity at -200°C 574 W/m*K
  • Soldering
    Brazing 2
    Soft soldering 1
  • Welding
    Gas 5
    MIG 5
    Resistance spot welding 5
    TIG 5
  • Aviation
    Aviation No
  • Chemical specifications
    Bi (from) 0.0005
    Bi (to) 0.0005
    Cu footnote reference Einschließlich Silber bis max. 0,015 %
    Other 0.03
    Pb (from) 0.005
    Pb (to) 0.005
    Rest Cu
  • Food industry
    suitable according to DIN EN 602 No
  • Material
    Material chemically EN 573-3 E-Cu 58 (Cu-ETP)
    Material no CW004A (former 2.0065, 2.0060)
  • physical properties
    Coefficient of thermal expansion from 20 to 100°C 16.8 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 200°C 17.3 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 300°C 17.7 K⁻¹10⁻⁶
    Density 8.93 g/cm³
    Modulus of elasticity at 100°C 126 GPa
    Modulus of elasticity at 20°C 130 GPa
    Modulus of elasticity at 200°C 122 GPa
    Modulus of elasticity at 300°C 116 GPa
    Specific electrical conductivity at 100°C 43 m/Ω*mm²
    Specific electrical conductivity at 20°C 57 m/Ω*mm²
    Specific electrical conductivity at 200°C 33 m/Ω*mm²
    Specific electrical conductivity at -100°C 110 m/Ω*mm²
    Specific electrical conductivity at -200°C 460 m/Ω*mm²
    Specific electrical resistance at 100°C 0.023 Ω*mm²/m
    Specific electrical resistance at 20°C 0.018 Ω*mm²/m
    Specific electrical resistance at 200°C 0.03 Ω*mm²/m
    Specific electrical resistance at -100°C 0.009 Ω*mm²/m
    Specific electrical resistance at -200°C 0.002 Ω*mm²/m
    Specific heat at 100°C 0.393 J/(kg·K)
    Specific heat at 20°C 0.386 J/(kg·K)
    Specific heat at 200°C 0.403 J/(kg·K)
    Thermal conductivity at 100°C 385 W/m*K
    Thermal conductivity at 20°C 394 W/m*K
    Thermal conductivity at 200°C 381 W/m*K
    Thermal conductivity at -100°C 435 W/m*K
    Thermal conductivity at -200°C 574 W/m*K
  • Soldering
    Brazing 2
    Soft soldering 1
  • Welding
    Gas 5
    MIG 5
    Resistance spot welding 5
    TIG 5
  • Aviation
    Aviation No
  • Chemical specifications
    Bi (from) 0.0005
    Bi (to) 0.0005
    Cu footnote reference Einschließlich Silber bis max. 0,015 %
    Other 0.03
    Pb (from) 0.005
    Pb (to) 0.005
    Rest Cu
  • Food industry
    suitable according to DIN EN 602 No
  • Material
    Material chemically EN 573-3 E-Cu 58 (Cu-ETP)
    Material no CW004A (former 2.0065, 2.0060)
  • physical properties
    Coefficient of thermal expansion from 20 to 100°C 16.8 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 200°C 17.3 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 300°C 17.7 K⁻¹10⁻⁶
    Density 8.93 g/cm³
    Modulus of elasticity at 100°C 126 GPa
    Modulus of elasticity at 20°C 130 GPa
    Modulus of elasticity at 200°C 122 GPa
    Modulus of elasticity at 300°C 116 GPa
    Specific electrical conductivity at 100°C 43 m/Ω*mm²
    Specific electrical conductivity at 20°C 57 m/Ω*mm²
    Specific electrical conductivity at 200°C 33 m/Ω*mm²
    Specific electrical conductivity at -100°C 110 m/Ω*mm²
    Specific electrical conductivity at -200°C 460 m/Ω*mm²
    Specific electrical resistance at 100°C 0.023 Ω*mm²/m
    Specific electrical resistance at 20°C 0.018 Ω*mm²/m
    Specific electrical resistance at 200°C 0.03 Ω*mm²/m
    Specific electrical resistance at -100°C 0.009 Ω*mm²/m
    Specific electrical resistance at -200°C 0.002 Ω*mm²/m
    Specific heat at 100°C 0.393 J/(kg·K)
    Specific heat at 20°C 0.386 J/(kg·K)
    Specific heat at 200°C 0.403 J/(kg·K)
    Thermal conductivity at 100°C 385 W/m*K
    Thermal conductivity at 20°C 394 W/m*K
    Thermal conductivity at 200°C 381 W/m*K
    Thermal conductivity at -100°C 435 W/m*K
    Thermal conductivity at -200°C 574 W/m*K
  • Soldering
    Brazing 2
    Soft soldering 1
  • Welding
    Gas 5
    MIG 5
    Resistance spot welding 5
    TIG 5
  • Aviation
    Aviation No
  • Chemical specifications
    Bi (from) 0.0005
    Bi (to) 0.0005
    Cu footnote reference Einschließlich Silber bis max. 0,015 %
    Other 0.03
    Pb (from) 0.005
    Pb (to) 0.005
    Rest Cu
  • Food industry
    suitable according to DIN EN 602 No
  • Material
    Material chemically EN 573-3 E-Cu 58 (Cu-ETP)
    Material no CW004A (former 2.0065, 2.0060)
  • physical properties
    Coefficient of thermal expansion from 20 to 100°C 16.8 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 200°C 17.3 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 300°C 17.7 K⁻¹10⁻⁶
    Density 8.93 g/cm³
    Modulus of elasticity at 100°C 126 GPa
    Modulus of elasticity at 20°C 130 GPa
    Modulus of elasticity at 200°C 122 GPa
    Modulus of elasticity at 300°C 116 GPa
    Specific electrical conductivity at 100°C 43 m/Ω*mm²
    Specific electrical conductivity at 20°C 57 m/Ω*mm²
    Specific electrical conductivity at 200°C 33 m/Ω*mm²
    Specific electrical conductivity at -100°C 110 m/Ω*mm²
    Specific electrical conductivity at -200°C 460 m/Ω*mm²
    Specific electrical resistance at 100°C 0.023 Ω*mm²/m
    Specific electrical resistance at 20°C 0.018 Ω*mm²/m
    Specific electrical resistance at 200°C 0.03 Ω*mm²/m
    Specific electrical resistance at -100°C 0.009 Ω*mm²/m
    Specific electrical resistance at -200°C 0.002 Ω*mm²/m
    Specific heat at 100°C 0.393 J/(kg·K)
    Specific heat at 20°C 0.386 J/(kg·K)
    Specific heat at 200°C 0.403 J/(kg·K)
    Thermal conductivity at 100°C 385 W/m*K
    Thermal conductivity at 20°C 394 W/m*K
    Thermal conductivity at 200°C 381 W/m*K
    Thermal conductivity at -100°C 435 W/m*K
    Thermal conductivity at -200°C 574 W/m*K
  • Soldering
    Brazing 2
    Soft soldering 1
  • Welding
    Gas 5
    MIG 5
    Resistance spot welding 5
    TIG 5
  • Aviation
    Aviation No
  • Chemical specifications
    Bi (from) 0.0005
    Bi (to) 0.0005
    Cu footnote reference Einschließlich Silber bis max. 0,015 %
    Other 0.03
    Pb (from) 0.005
    Pb (to) 0.005
    Rest Cu
  • Food industry
    suitable according to DIN EN 602 No
  • Material
    Material chemically EN 573-3 E-Cu 58 (Cu-ETP)
    Material no CW004A (former 2.0065, 2.0060)
  • physical properties
    Coefficient of thermal expansion from 20 to 100°C 16.8 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 200°C 17.3 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 300°C 17.7 K⁻¹10⁻⁶
    Density 8.93 g/cm³
    Modulus of elasticity at 100°C 126 GPa
    Modulus of elasticity at 20°C 130 GPa
    Modulus of elasticity at 200°C 122 GPa
    Modulus of elasticity at 300°C 116 GPa
    Specific electrical conductivity at 100°C 43 m/Ω*mm²
    Specific electrical conductivity at 20°C 57 m/Ω*mm²
    Specific electrical conductivity at 200°C 33 m/Ω*mm²
    Specific electrical conductivity at -100°C 110 m/Ω*mm²
    Specific electrical conductivity at -200°C 460 m/Ω*mm²
    Specific electrical resistance at 100°C 0.023 Ω*mm²/m
    Specific electrical resistance at 20°C 0.018 Ω*mm²/m
    Specific electrical resistance at 200°C 0.03 Ω*mm²/m
    Specific electrical resistance at -100°C 0.009 Ω*mm²/m
    Specific electrical resistance at -200°C 0.002 Ω*mm²/m
    Specific heat at 100°C 0.393 J/(kg·K)
    Specific heat at 20°C 0.386 J/(kg·K)
    Specific heat at 200°C 0.403 J/(kg·K)
    Thermal conductivity at 100°C 385 W/m*K
    Thermal conductivity at 20°C 394 W/m*K
    Thermal conductivity at 200°C 381 W/m*K
    Thermal conductivity at -100°C 435 W/m*K
    Thermal conductivity at -200°C 574 W/m*K
  • Soldering
    Brazing 2
    Soft soldering 1
  • Welding
    Gas 5
    MIG 5
    Resistance spot welding 5
    TIG 5
  • Aviation
    Aviation No
  • Chemical specifications
    Bi (from) 0.0005
    Bi (to) 0.0005
    Cu footnote reference Einschließlich Silber bis max. 0,015 %
    Other 0.03
    Pb (from) 0.005
    Pb (to) 0.005
    Rest Cu
  • Food industry
    suitable according to DIN EN 602 No
  • Material
    Material chemically EN 573-3 E-Cu 58 (Cu-ETP)
    Material no CW004A (former 2.0065, 2.0060)
  • physical properties
    Coefficient of thermal expansion from 20 to 100°C 16.8 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 200°C 17.3 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 300°C 17.7 K⁻¹10⁻⁶
    Density 8.93 g/cm³
    Modulus of elasticity at 100°C 126 GPa
    Modulus of elasticity at 20°C 130 GPa
    Modulus of elasticity at 200°C 122 GPa
    Modulus of elasticity at 300°C 116 GPa
    Specific electrical conductivity at 100°C 43 m/Ω*mm²
    Specific electrical conductivity at 20°C 57 m/Ω*mm²
    Specific electrical conductivity at 200°C 33 m/Ω*mm²
    Specific electrical conductivity at -100°C 110 m/Ω*mm²
    Specific electrical conductivity at -200°C 460 m/Ω*mm²
    Specific electrical resistance at 100°C 0.023 Ω*mm²/m
    Specific electrical resistance at 20°C 0.018 Ω*mm²/m
    Specific electrical resistance at 200°C 0.03 Ω*mm²/m
    Specific electrical resistance at -100°C 0.009 Ω*mm²/m
    Specific electrical resistance at -200°C 0.002 Ω*mm²/m
    Specific heat at 100°C 0.393 J/(kg·K)
    Specific heat at 20°C 0.386 J/(kg·K)
    Specific heat at 200°C 0.403 J/(kg·K)
    Thermal conductivity at 100°C 385 W/m*K
    Thermal conductivity at 20°C 394 W/m*K
    Thermal conductivity at 200°C 381 W/m*K
    Thermal conductivity at -100°C 435 W/m*K
    Thermal conductivity at -200°C 574 W/m*K
  • Soldering
    Brazing 2
    Soft soldering 1
  • Welding
    Gas 5
    MIG 5
    Resistance spot welding 5
    TIG 5
  • Aviation
    Aviation No
  • Chemical specifications
    Bi (from) 0.0005
    Bi (to) 0.0005
    Cu footnote reference Einschließlich Silber bis max. 0,015 %
    Other 0.03
    Pb (from) 0.005
    Pb (to) 0.005
    Rest Cu
  • Food industry
    suitable according to DIN EN 602 No
  • Material
    Material chemically EN 573-3 E-Cu 58 (Cu-ETP)
    Material no CW004A (former 2.0065, 2.0060)
  • physical properties
    Coefficient of thermal expansion from 20 to 100°C 16.8 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 200°C 17.3 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 300°C 17.7 K⁻¹10⁻⁶
    Density 8.93 g/cm³
    Modulus of elasticity at 100°C 126 GPa
    Modulus of elasticity at 20°C 130 GPa
    Modulus of elasticity at 200°C 122 GPa
    Modulus of elasticity at 300°C 116 GPa
    Specific electrical conductivity at 100°C 43 m/Ω*mm²
    Specific electrical conductivity at 20°C 57 m/Ω*mm²
    Specific electrical conductivity at 200°C 33 m/Ω*mm²
    Specific electrical conductivity at -100°C 110 m/Ω*mm²
    Specific electrical conductivity at -200°C 460 m/Ω*mm²
    Specific electrical resistance at 100°C 0.023 Ω*mm²/m
    Specific electrical resistance at 20°C 0.018 Ω*mm²/m
    Specific electrical resistance at 200°C 0.03 Ω*mm²/m
    Specific electrical resistance at -100°C 0.009 Ω*mm²/m
    Specific electrical resistance at -200°C 0.002 Ω*mm²/m
    Specific heat at 100°C 0.393 J/(kg·K)
    Specific heat at 20°C 0.386 J/(kg·K)
    Specific heat at 200°C 0.403 J/(kg·K)
    Thermal conductivity at 100°C 385 W/m*K
    Thermal conductivity at 20°C 394 W/m*K
    Thermal conductivity at 200°C 381 W/m*K
    Thermal conductivity at -100°C 435 W/m*K
    Thermal conductivity at -200°C 574 W/m*K
  • Soldering
    Brazing 2
    Soft soldering 1
  • Welding
    Gas 5
    MIG 5
    Resistance spot welding 5
    TIG 5
  • Aviation
    Aviation No
  • Chemical specifications
    Bi (from) 0.0005
    Bi (to) 0.0005
    Cu footnote reference Einschließlich Silber bis max. 0,015 %
    Other 0.03
    Pb (from) 0.005
    Pb (to) 0.005
    Rest Cu
  • Food industry
    suitable according to DIN EN 602 No
  • Material
    Material chemically EN 573-3 E-Cu 58 (Cu-ETP)
    Material no CW004A (former 2.0065, 2.0060)
  • physical properties
    Coefficient of thermal expansion from 20 to 100°C 16.8 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 200°C 17.3 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 300°C 17.7 K⁻¹10⁻⁶
    Density 8.93 g/cm³
    Modulus of elasticity at 100°C 126 GPa
    Modulus of elasticity at 20°C 130 GPa
    Modulus of elasticity at 200°C 122 GPa
    Modulus of elasticity at 300°C 116 GPa
    Specific electrical conductivity at 100°C 43 m/Ω*mm²
    Specific electrical conductivity at 20°C 57 m/Ω*mm²
    Specific electrical conductivity at 200°C 33 m/Ω*mm²
    Specific electrical conductivity at -100°C 110 m/Ω*mm²
    Specific electrical conductivity at -200°C 460 m/Ω*mm²
    Specific electrical resistance at 100°C 0.023 Ω*mm²/m
    Specific electrical resistance at 20°C 0.018 Ω*mm²/m
    Specific electrical resistance at 200°C 0.03 Ω*mm²/m
    Specific electrical resistance at -100°C 0.009 Ω*mm²/m
    Specific electrical resistance at -200°C 0.002 Ω*mm²/m
    Specific heat at 100°C 0.393 J/(kg·K)
    Specific heat at 20°C 0.386 J/(kg·K)
    Specific heat at 200°C 0.403 J/(kg·K)
    Thermal conductivity at 100°C 385 W/m*K
    Thermal conductivity at 20°C 394 W/m*K
    Thermal conductivity at 200°C 381 W/m*K
    Thermal conductivity at -100°C 435 W/m*K
    Thermal conductivity at -200°C 574 W/m*K
  • Soldering
    Brazing 2
    Soft soldering 1
  • Welding
    Gas 5
    MIG 5
    Resistance spot welding 5
    TIG 5
  • Aviation
    Aviation No
  • Chemical specifications
    Bi (from) 0.0005
    Bi (to) 0.0005
    Cu footnote reference Einschließlich Silber bis max. 0,015 %
    Other 0.03
    Pb (from) 0.005
    Pb (to) 0.005
    Rest Cu
  • Food industry
    suitable according to DIN EN 602 No
  • Material
    Material chemically EN 573-3 E-Cu 58 (Cu-ETP)
    Material no CW004A (former 2.0065, 2.0060)
  • physical properties
    Coefficient of thermal expansion from 20 to 100°C 16.8 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 200°C 17.3 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 300°C 17.7 K⁻¹10⁻⁶
    Density 8.93 g/cm³
    Modulus of elasticity at 100°C 126 GPa
    Modulus of elasticity at 20°C 130 GPa
    Modulus of elasticity at 200°C 122 GPa
    Modulus of elasticity at 300°C 116 GPa
    Specific electrical conductivity at 100°C 43 m/Ω*mm²
    Specific electrical conductivity at 20°C 57 m/Ω*mm²
    Specific electrical conductivity at 200°C 33 m/Ω*mm²
    Specific electrical conductivity at -100°C 110 m/Ω*mm²
    Specific electrical conductivity at -200°C 460 m/Ω*mm²
    Specific electrical resistance at 100°C 0.023 Ω*mm²/m
    Specific electrical resistance at 20°C 0.018 Ω*mm²/m
    Specific electrical resistance at 200°C 0.03 Ω*mm²/m
    Specific electrical resistance at -100°C 0.009 Ω*mm²/m
    Specific electrical resistance at -200°C 0.002 Ω*mm²/m
    Specific heat at 100°C 0.393 J/(kg·K)
    Specific heat at 20°C 0.386 J/(kg·K)
    Specific heat at 200°C 0.403 J/(kg·K)
    Thermal conductivity at 100°C 385 W/m*K
    Thermal conductivity at 20°C 394 W/m*K
    Thermal conductivity at 200°C 381 W/m*K
    Thermal conductivity at -100°C 435 W/m*K
    Thermal conductivity at -200°C 574 W/m*K
  • Soldering
    Brazing 2
    Soft soldering 1
  • Welding
    Gas 5
    MIG 5
    Resistance spot welding 5
    TIG 5
  • Aviation
    Aviation No
  • Chemical specifications
    Bi (from) 0.0005
    Bi (to) 0.0005
    Cu footnote reference Einschließlich Silber bis max. 0,015 %
    Other 0.03
    Pb (from) 0.005
    Pb (to) 0.005
    Rest Cu
  • Food industry
    suitable according to DIN EN 602 No
  • Material
    Material chemically EN 573-3 E-Cu 58 (Cu-ETP)
    Material no CW004A (former 2.0065, 2.0060)
  • physical properties
    Coefficient of thermal expansion from 20 to 100°C 16.8 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 200°C 17.3 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 300°C 17.7 K⁻¹10⁻⁶
    Density 8.93 g/cm³
    Modulus of elasticity at 100°C 126 GPa
    Modulus of elasticity at 20°C 130 GPa
    Modulus of elasticity at 200°C 122 GPa
    Modulus of elasticity at 300°C 116 GPa
    Specific electrical conductivity at 100°C 43 m/Ω*mm²
    Specific electrical conductivity at 20°C 57 m/Ω*mm²
    Specific electrical conductivity at 200°C 33 m/Ω*mm²
    Specific electrical conductivity at -100°C 110 m/Ω*mm²
    Specific electrical conductivity at -200°C 460 m/Ω*mm²
    Specific electrical resistance at 100°C 0.023 Ω*mm²/m
    Specific electrical resistance at 20°C 0.018 Ω*mm²/m
    Specific electrical resistance at 200°C 0.03 Ω*mm²/m
    Specific electrical resistance at -100°C 0.009 Ω*mm²/m
    Specific electrical resistance at -200°C 0.002 Ω*mm²/m
    Specific heat at 100°C 0.393 J/(kg·K)
    Specific heat at 20°C 0.386 J/(kg·K)
    Specific heat at 200°C 0.403 J/(kg·K)
    Thermal conductivity at 100°C 385 W/m*K
    Thermal conductivity at 20°C 394 W/m*K
    Thermal conductivity at 200°C 381 W/m*K
    Thermal conductivity at -100°C 435 W/m*K
    Thermal conductivity at -200°C 574 W/m*K
  • Soldering
    Brazing 2
    Soft soldering 1
  • Welding
    Gas 5
    MIG 5
    Resistance spot welding 5
    TIG 5
  • Aviation
    Aviation No
  • Chemical specifications
    Bi (from) 0.0005
    Bi (to) 0.0005
    Cu footnote reference Einschließlich Silber bis max. 0,015 %
    Other 0.03
    Pb (from) 0.005
    Pb (to) 0.005
    Rest Cu
  • Food industry
    suitable according to DIN EN 602 No
  • Material
    Material chemically EN 573-3 E-Cu 58 (Cu-ETP)
    Material no CW004A (former 2.0065, 2.0060)
  • physical properties
    Coefficient of thermal expansion from 20 to 100°C 16.8 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 200°C 17.3 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 300°C 17.7 K⁻¹10⁻⁶
    Density 8.93 g/cm³
    Modulus of elasticity at 100°C 126 GPa
    Modulus of elasticity at 20°C 130 GPa
    Modulus of elasticity at 200°C 122 GPa
    Modulus of elasticity at 300°C 116 GPa
    Specific electrical conductivity at 100°C 43 m/Ω*mm²
    Specific electrical conductivity at 20°C 57 m/Ω*mm²
    Specific electrical conductivity at 200°C 33 m/Ω*mm²
    Specific electrical conductivity at -100°C 110 m/Ω*mm²
    Specific electrical conductivity at -200°C 460 m/Ω*mm²
    Specific electrical resistance at 100°C 0.023 Ω*mm²/m
    Specific electrical resistance at 20°C 0.018 Ω*mm²/m
    Specific electrical resistance at 200°C 0.03 Ω*mm²/m
    Specific electrical resistance at -100°C 0.009 Ω*mm²/m
    Specific electrical resistance at -200°C 0.002 Ω*mm²/m
    Specific heat at 100°C 0.393 J/(kg·K)
    Specific heat at 20°C 0.386 J/(kg·K)
    Specific heat at 200°C 0.403 J/(kg·K)
    Thermal conductivity at 100°C 385 W/m*K
    Thermal conductivity at 20°C 394 W/m*K
    Thermal conductivity at 200°C 381 W/m*K
    Thermal conductivity at -100°C 435 W/m*K
    Thermal conductivity at -200°C 574 W/m*K
  • Soldering
    Brazing 2
    Soft soldering 1
  • Welding
    Gas 5
    MIG 5
    Resistance spot welding 5
    TIG 5
  • Aviation
    Aviation No
  • Chemical specifications
    Bi (from) 0.0005
    Bi (to) 0.0005
    Cu footnote reference Einschließlich Silber bis max. 0,015 %
    Other 0.03
    Pb (from) 0.005
    Pb (to) 0.005
    Rest Cu
  • Food industry
    suitable according to DIN EN 602 No
  • Material
    Material chemically EN 573-3 E-Cu 58 (Cu-ETP)
    Material no CW004A (former 2.0065, 2.0060)
  • physical properties
    Coefficient of thermal expansion from 20 to 100°C 16.8 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 200°C 17.3 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 300°C 17.7 K⁻¹10⁻⁶
    Density 8.93 g/cm³
    Modulus of elasticity at 100°C 126 GPa
    Modulus of elasticity at 20°C 130 GPa
    Modulus of elasticity at 200°C 122 GPa
    Modulus of elasticity at 300°C 116 GPa
    Specific electrical conductivity at 100°C 43 m/Ω*mm²
    Specific electrical conductivity at 20°C 57 m/Ω*mm²
    Specific electrical conductivity at 200°C 33 m/Ω*mm²
    Specific electrical conductivity at -100°C 110 m/Ω*mm²
    Specific electrical conductivity at -200°C 460 m/Ω*mm²
    Specific electrical resistance at 100°C 0.023 Ω*mm²/m
    Specific electrical resistance at 20°C 0.018 Ω*mm²/m
    Specific electrical resistance at 200°C 0.03 Ω*mm²/m
    Specific electrical resistance at -100°C 0.009 Ω*mm²/m
    Specific electrical resistance at -200°C 0.002 Ω*mm²/m
    Specific heat at 100°C 0.393 J/(kg·K)
    Specific heat at 20°C 0.386 J/(kg·K)
    Specific heat at 200°C 0.403 J/(kg·K)
    Thermal conductivity at 100°C 385 W/m*K
    Thermal conductivity at 20°C 394 W/m*K
    Thermal conductivity at 200°C 381 W/m*K
    Thermal conductivity at -100°C 435 W/m*K
    Thermal conductivity at -200°C 574 W/m*K
  • Soldering
    Brazing 2
    Soft soldering 1
  • Welding
    Gas 5
    MIG 5
    Resistance spot welding 5
    TIG 5
  • Aviation
    Aviation No
  • Chemical specifications
    Bi (from) 0.0005
    Bi (to) 0.0005
    Cu footnote reference Einschließlich Silber bis max. 0,015 %
    Other 0.03
    Pb (from) 0.005
    Pb (to) 0.005
    Rest Cu
  • Food industry
    suitable according to DIN EN 602 No
  • Material
    Material chemically EN 573-3 E-Cu 58 (Cu-ETP)
    Material no CW004A (former 2.0065, 2.0060)
  • physical properties
    Coefficient of thermal expansion from 20 to 100°C 16.8 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 200°C 17.3 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 300°C 17.7 K⁻¹10⁻⁶
    Density 8.93 g/cm³
    Modulus of elasticity at 100°C 126 GPa
    Modulus of elasticity at 20°C 130 GPa
    Modulus of elasticity at 200°C 122 GPa
    Modulus of elasticity at 300°C 116 GPa
    Specific electrical conductivity at 100°C 43 m/Ω*mm²
    Specific electrical conductivity at 20°C 57 m/Ω*mm²
    Specific electrical conductivity at 200°C 33 m/Ω*mm²
    Specific electrical conductivity at -100°C 110 m/Ω*mm²
    Specific electrical conductivity at -200°C 460 m/Ω*mm²
    Specific electrical resistance at 100°C 0.023 Ω*mm²/m
    Specific electrical resistance at 20°C 0.018 Ω*mm²/m
    Specific electrical resistance at 200°C 0.03 Ω*mm²/m
    Specific electrical resistance at -100°C 0.009 Ω*mm²/m
    Specific electrical resistance at -200°C 0.002 Ω*mm²/m
    Specific heat at 100°C 0.393 J/(kg·K)
    Specific heat at 20°C 0.386 J/(kg·K)
    Specific heat at 200°C 0.403 J/(kg·K)
    Thermal conductivity at 100°C 385 W/m*K
    Thermal conductivity at 20°C 394 W/m*K
    Thermal conductivity at 200°C 381 W/m*K
    Thermal conductivity at -100°C 435 W/m*K
    Thermal conductivity at -200°C 574 W/m*K
  • Soldering
    Brazing 2
    Soft soldering 1
  • Welding
    Gas 5
    MIG 5
    Resistance spot welding 5
    TIG 5

1 very good
2 good
3 moderate
4 poor
5 unsuited
0 Not specified

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