CW004A
tube round in rings
- Form tube round in rings
- Material Copper
- Material CW004A
- Material chemically EN 573-3 Cu-ETP
 
            BIKAR Metals companies
 
            windings for electrical machines and apparatus
cables and wires
contact and chain wire
busbar connectors, feeder cables and switching circuits
busbars, contacts, switches
terminals, collector lamellas
| Aviation | No | 
| Bi (from) | 0,0005 | 
| Bi (to) | 0,0005 | 
| Cu footnote reference | 1 | 
| Other | 0,03 | 
| Pb (from) | 0,005 | 
| Pb (to) | 0,005 | 
| Rest | Cu | 
| suitable according to DIN EN 602 | No | 
| Material chemically EN 573-3 | Cu-ETP | 
| Material no | CW004A (former 2.0065. 2.0060) | 
| Coefficient of thermal expansion from 20 to 100°C | 16.8 K⁻¹10⁻⁶ | 
| Coefficient of thermal expansion from 20 to 200°C | 17.3 K⁻¹10⁻⁶ | 
| Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ | 
| Density | 8.93 g/cm³ | 
| Modulus of elasticity at 100°C | 126 GPa | 
| Modulus of elasticity at 20°C | 130 GPa | 
| Modulus of elasticity at 200°C | 122 GPa | 
| Modulus of elasticity at 300°C | 116 GPa | 
| Specific electrical conductivity at 100°C | 43 m/Ω*mm² | 
| Specific electrical conductivity at 20°C | 57 m/Ω*mm² | 
| Specific electrical conductivity at 200°C | 33 m/Ω*mm² | 
| Specific electrical conductivity at -100°C | 110 m/Ω*mm² | 
| Specific electrical conductivity at -200°C | 460 m/Ω*mm² | 
| Specific electrical resistance at 100°C | 0.023 Ω*mm²/m | 
| Specific electrical resistance at 20°C | 0.018 Ω*mm²/m | 
| Specific electrical resistance at 200°C | 0.03 Ω*mm²/m | 
| Specific electrical resistance at -100°C | 0.009 Ω*mm²/m | 
| Specific electrical resistance at -200°C | 0.002 Ω*mm²/m | 
| Specific heat at 100°C | 0.393 J/(kg·K) | 
| Specific heat at 20°C | 0.386 J/(kg·K) | 
| Specific heat at 200°C | 0.403 J/(kg·K) | 
| Thermal conductivity at 100°C | 385 W/m*K | 
| Thermal conductivity at 20°C | 394 W/m*K | 
| Thermal conductivity at 200°C | 381 W/m*K | 
| Thermal conductivity at -100°C | 435 W/m*K | 
| Thermal conductivity at -200°C | 574 W/m*K | 
| Brazing | 2 | 
| Soft soldering | 1 | 
| Gas | 6 | 
| MIG | 5 | 
| TIG | 5 | 
| Aviation | No | 
| Bi (from) | 0,0005 | 
| Bi (to) | 0,0005 | 
| Cu footnote reference | 1 | 
| Other | 0,03 | 
| Pb (from) | 0,005 | 
| Pb (to) | 0,005 | 
| Rest | Cu | 
| suitable according to DIN EN 602 | No | 
| Material chemically EN 573-3 | Cu-ETP | 
| Material no | CW004A (former 2.0065. 2.0060) | 
| Coefficient of thermal expansion from 20 to 100°C | 16.8 K⁻¹10⁻⁶ | 
| Coefficient of thermal expansion from 20 to 200°C | 17.3 K⁻¹10⁻⁶ | 
| Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ | 
| Density | 8.93 g/cm³ | 
| Modulus of elasticity at 100°C | 126 GPa | 
| Modulus of elasticity at 20°C | 130 GPa | 
| Modulus of elasticity at 200°C | 122 GPa | 
| Modulus of elasticity at 300°C | 116 GPa | 
| Specific electrical conductivity at 100°C | 43 m/Ω*mm² | 
| Specific electrical conductivity at 20°C | 57 m/Ω*mm² | 
| Specific electrical conductivity at 200°C | 33 m/Ω*mm² | 
| Specific electrical conductivity at -100°C | 110 m/Ω*mm² | 
| Specific electrical conductivity at -200°C | 460 m/Ω*mm² | 
| Specific electrical resistance at 100°C | 0.023 Ω*mm²/m | 
| Specific electrical resistance at 20°C | 0.018 Ω*mm²/m | 
| Specific electrical resistance at 200°C | 0.03 Ω*mm²/m | 
| Specific electrical resistance at -100°C | 0.009 Ω*mm²/m | 
| Specific electrical resistance at -200°C | 0.002 Ω*mm²/m | 
| Specific heat at 100°C | 0.393 J/(kg·K) | 
| Specific heat at 20°C | 0.386 J/(kg·K) | 
| Specific heat at 200°C | 0.403 J/(kg·K) | 
| Thermal conductivity at 100°C | 385 W/m*K | 
| Thermal conductivity at 20°C | 394 W/m*K | 
| Thermal conductivity at 200°C | 381 W/m*K | 
| Thermal conductivity at -100°C | 435 W/m*K | 
| Thermal conductivity at -200°C | 574 W/m*K | 
| Brazing | 2 | 
| Soft soldering | 1 | 
| Gas | 6 | 
| MIG | 5 | 
| TIG | 5 | 
| Aviation | No | 
| Bi (from) | 0,0005 | 
| Bi (to) | 0,0005 | 
| Cu footnote reference | 1 | 
| Other | 0,03 | 
| Pb (from) | 0,005 | 
| Pb (to) | 0,005 | 
| Rest | Cu | 
| suitable according to DIN EN 602 | No | 
| Material chemically EN 573-3 | Cu-ETP | 
| Material no | CW004A (former 2.0065. 2.0060) | 
| Coefficient of thermal expansion from 20 to 100°C | 16.8 K⁻¹10⁻⁶ | 
| Coefficient of thermal expansion from 20 to 200°C | 17.3 K⁻¹10⁻⁶ | 
| Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ | 
| Density | 8.93 g/cm³ | 
| Modulus of elasticity at 100°C | 126 GPa | 
| Modulus of elasticity at 20°C | 130 GPa | 
| Modulus of elasticity at 200°C | 122 GPa | 
| Modulus of elasticity at 300°C | 116 GPa | 
| Specific electrical conductivity at 100°C | 43 m/Ω*mm² | 
| Specific electrical conductivity at 20°C | 57 m/Ω*mm² | 
| Specific electrical conductivity at 200°C | 33 m/Ω*mm² | 
| Specific electrical conductivity at -100°C | 110 m/Ω*mm² | 
| Specific electrical conductivity at -200°C | 460 m/Ω*mm² | 
| Specific electrical resistance at 100°C | 0.023 Ω*mm²/m | 
| Specific electrical resistance at 20°C | 0.018 Ω*mm²/m | 
| Specific electrical resistance at 200°C | 0.03 Ω*mm²/m | 
| Specific electrical resistance at -100°C | 0.009 Ω*mm²/m | 
| Specific electrical resistance at -200°C | 0.002 Ω*mm²/m | 
| Specific heat at 100°C | 0.393 J/(kg·K) | 
| Specific heat at 20°C | 0.386 J/(kg·K) | 
| Specific heat at 200°C | 0.403 J/(kg·K) | 
| Thermal conductivity at 100°C | 385 W/m*K | 
| Thermal conductivity at 20°C | 394 W/m*K | 
| Thermal conductivity at 200°C | 381 W/m*K | 
| Thermal conductivity at -100°C | 435 W/m*K | 
| Thermal conductivity at -200°C | 574 W/m*K | 
| Brazing | 2 | 
| Soft soldering | 1 | 
| Gas | 6 | 
| MIG | 5 | 
| TIG | 5 | 
| Aviation | No | 
| Bi (from) | 0,0005 | 
| Bi (to) | 0,0005 | 
| Cu footnote reference | 1 | 
| Other | 0,03 | 
| Pb (from) | 0,005 | 
| Pb (to) | 0,005 | 
| Rest | Cu | 
| suitable according to DIN EN 602 | No | 
| Material chemically EN 573-3 | Cu-ETP | 
| Material no | CW004A (former 2.0065. 2.0060) | 
| Coefficient of thermal expansion from 20 to 100°C | 16.8 K⁻¹10⁻⁶ | 
| Coefficient of thermal expansion from 20 to 200°C | 17.3 K⁻¹10⁻⁶ | 
| Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ | 
| Density | 8.93 g/cm³ | 
| Modulus of elasticity at 100°C | 126 GPa | 
| Modulus of elasticity at 20°C | 130 GPa | 
| Modulus of elasticity at 200°C | 122 GPa | 
| Modulus of elasticity at 300°C | 116 GPa | 
| Specific electrical conductivity at 100°C | 43 m/Ω*mm² | 
| Specific electrical conductivity at 20°C | 57 m/Ω*mm² | 
| Specific electrical conductivity at 200°C | 33 m/Ω*mm² | 
| Specific electrical conductivity at -100°C | 110 m/Ω*mm² | 
| Specific electrical conductivity at -200°C | 460 m/Ω*mm² | 
| Specific electrical resistance at 100°C | 0.023 Ω*mm²/m | 
| Specific electrical resistance at 20°C | 0.018 Ω*mm²/m | 
| Specific electrical resistance at 200°C | 0.03 Ω*mm²/m | 
| Specific electrical resistance at -100°C | 0.009 Ω*mm²/m | 
| Specific electrical resistance at -200°C | 0.002 Ω*mm²/m | 
| Specific heat at 100°C | 0.393 J/(kg·K) | 
| Specific heat at 20°C | 0.386 J/(kg·K) | 
| Specific heat at 200°C | 0.403 J/(kg·K) | 
| Thermal conductivity at 100°C | 385 W/m*K | 
| Thermal conductivity at 20°C | 394 W/m*K | 
| Thermal conductivity at 200°C | 381 W/m*K | 
| Thermal conductivity at -100°C | 435 W/m*K | 
| Thermal conductivity at -200°C | 574 W/m*K | 
| Brazing | 2 | 
| Soft soldering | 1 | 
| Gas | 6 | 
| MIG | 5 | 
| TIG | 5 | 
| Aviation | No | 
| Bi (from) | 0,0005 | 
| Bi (to) | 0,0005 | 
| Cu footnote reference | 1 | 
| Other | 0,03 | 
| Pb (from) | 0,005 | 
| Pb (to) | 0,005 | 
| Rest | Cu | 
| suitable according to DIN EN 602 | No | 
| Material chemically EN 573-3 | Cu-ETP | 
| Material no | CW004A (former 2.0065. 2.0060) | 
| Coefficient of thermal expansion from 20 to 100°C | 16.8 K⁻¹10⁻⁶ | 
| Coefficient of thermal expansion from 20 to 200°C | 17.3 K⁻¹10⁻⁶ | 
| Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ | 
| Density | 8.93 g/cm³ | 
| Modulus of elasticity at 100°C | 126 GPa | 
| Modulus of elasticity at 20°C | 130 GPa | 
| Modulus of elasticity at 200°C | 122 GPa | 
| Modulus of elasticity at 300°C | 116 GPa | 
| Specific electrical conductivity at 100°C | 43 m/Ω*mm² | 
| Specific electrical conductivity at 20°C | 57 m/Ω*mm² | 
| Specific electrical conductivity at 200°C | 33 m/Ω*mm² | 
| Specific electrical conductivity at -100°C | 110 m/Ω*mm² | 
| Specific electrical conductivity at -200°C | 460 m/Ω*mm² | 
| Specific electrical resistance at 100°C | 0.023 Ω*mm²/m | 
| Specific electrical resistance at 20°C | 0.018 Ω*mm²/m | 
| Specific electrical resistance at 200°C | 0.03 Ω*mm²/m | 
| Specific electrical resistance at -100°C | 0.009 Ω*mm²/m | 
| Specific electrical resistance at -200°C | 0.002 Ω*mm²/m | 
| Specific heat at 100°C | 0.393 J/(kg·K) | 
| Specific heat at 20°C | 0.386 J/(kg·K) | 
| Specific heat at 200°C | 0.403 J/(kg·K) | 
| Thermal conductivity at 100°C | 385 W/m*K | 
| Thermal conductivity at 20°C | 394 W/m*K | 
| Thermal conductivity at 200°C | 381 W/m*K | 
| Thermal conductivity at -100°C | 435 W/m*K | 
| Thermal conductivity at -200°C | 574 W/m*K | 
| Brazing | 2 | 
| Soft soldering | 1 | 
| Gas | 6 | 
| MIG | 5 | 
| TIG | 5 | 
| Aviation | No | 
| Bi (from) | 0,0005 | 
| Bi (to) | 0,0005 | 
| Cu footnote reference | 1 | 
| Other | 0,03 | 
| Pb (from) | 0,005 | 
| Pb (to) | 0,005 | 
| Rest | Cu | 
| suitable according to DIN EN 602 | No | 
| Material chemically EN 573-3 | Cu-ETP | 
| Material no | CW004A (former 2.0065. 2.0060) | 
| Coefficient of thermal expansion from 20 to 100°C | 16.8 K⁻¹10⁻⁶ | 
| Coefficient of thermal expansion from 20 to 200°C | 17.3 K⁻¹10⁻⁶ | 
| Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ | 
| Density | 8.93 g/cm³ | 
| Modulus of elasticity at 100°C | 126 GPa | 
| Modulus of elasticity at 20°C | 130 GPa | 
| Modulus of elasticity at 200°C | 122 GPa | 
| Modulus of elasticity at 300°C | 116 GPa | 
| Specific electrical conductivity at 100°C | 43 m/Ω*mm² | 
| Specific electrical conductivity at 20°C | 57 m/Ω*mm² | 
| Specific electrical conductivity at 200°C | 33 m/Ω*mm² | 
| Specific electrical conductivity at -100°C | 110 m/Ω*mm² | 
| Specific electrical conductivity at -200°C | 460 m/Ω*mm² | 
| Specific electrical resistance at 100°C | 0.023 Ω*mm²/m | 
| Specific electrical resistance at 20°C | 0.018 Ω*mm²/m | 
| Specific electrical resistance at 200°C | 0.03 Ω*mm²/m | 
| Specific electrical resistance at -100°C | 0.009 Ω*mm²/m | 
| Specific electrical resistance at -200°C | 0.002 Ω*mm²/m | 
| Specific heat at 100°C | 0.393 J/(kg·K) | 
| Specific heat at 20°C | 0.386 J/(kg·K) | 
| Specific heat at 200°C | 0.403 J/(kg·K) | 
| Thermal conductivity at 100°C | 385 W/m*K | 
| Thermal conductivity at 20°C | 394 W/m*K | 
| Thermal conductivity at 200°C | 381 W/m*K | 
| Thermal conductivity at -100°C | 435 W/m*K | 
| Thermal conductivity at -200°C | 574 W/m*K | 
| Brazing | 2 | 
| Soft soldering | 1 | 
| Gas | 6 | 
| MIG | 5 | 
| TIG | 5 | 
| Aviation | No | 
| Bi (from) | 0,0005 | 
| Bi (to) | 0,0005 | 
| Cu footnote reference | 1 | 
| Other | 0,03 | 
| Pb (from) | 0,005 | 
| Pb (to) | 0,005 | 
| Rest | Cu | 
| suitable according to DIN EN 602 | No | 
| Material chemically EN 573-3 | Cu-ETP | 
| Material no | CW004A (former 2.0065. 2.0060) | 
| Coefficient of thermal expansion from 20 to 100°C | 16.8 K⁻¹10⁻⁶ | 
| Coefficient of thermal expansion from 20 to 200°C | 17.3 K⁻¹10⁻⁶ | 
| Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ | 
| Density | 8.93 g/cm³ | 
| Modulus of elasticity at 100°C | 126 GPa | 
| Modulus of elasticity at 20°C | 130 GPa | 
| Modulus of elasticity at 200°C | 122 GPa | 
| Modulus of elasticity at 300°C | 116 GPa | 
| Specific electrical conductivity at 100°C | 43 m/Ω*mm² | 
| Specific electrical conductivity at 20°C | 57 m/Ω*mm² | 
| Specific electrical conductivity at 200°C | 33 m/Ω*mm² | 
| Specific electrical conductivity at -100°C | 110 m/Ω*mm² | 
| Specific electrical conductivity at -200°C | 460 m/Ω*mm² | 
| Specific electrical resistance at 100°C | 0.023 Ω*mm²/m | 
| Specific electrical resistance at 20°C | 0.018 Ω*mm²/m | 
| Specific electrical resistance at 200°C | 0.03 Ω*mm²/m | 
| Specific electrical resistance at -100°C | 0.009 Ω*mm²/m | 
| Specific electrical resistance at -200°C | 0.002 Ω*mm²/m | 
| Specific heat at 100°C | 0.393 J/(kg·K) | 
| Specific heat at 20°C | 0.386 J/(kg·K) | 
| Specific heat at 200°C | 0.403 J/(kg·K) | 
| Thermal conductivity at 100°C | 385 W/m*K | 
| Thermal conductivity at 20°C | 394 W/m*K | 
| Thermal conductivity at 200°C | 381 W/m*K | 
| Thermal conductivity at -100°C | 435 W/m*K | 
| Thermal conductivity at -200°C | 574 W/m*K | 
| Brazing | 2 | 
| Soft soldering | 1 | 
| Gas | 6 | 
| MIG | 5 | 
| TIG | 5 | 
| Aviation | No | 
| Bi (from) | 0,0005 | 
| Bi (to) | 0,0005 | 
| Cu footnote reference | 1 | 
| Other | 0,03 | 
| Pb (from) | 0,005 | 
| Pb (to) | 0,005 | 
| Rest | Cu | 
| suitable according to DIN EN 602 | No | 
| Material chemically EN 573-3 | Cu-ETP | 
| Material no | CW004A (former 2.0065. 2.0060) | 
| Coefficient of thermal expansion from 20 to 100°C | 16.8 K⁻¹10⁻⁶ | 
| Coefficient of thermal expansion from 20 to 200°C | 17.3 K⁻¹10⁻⁶ | 
| Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ | 
| Density | 8.93 g/cm³ | 
| Modulus of elasticity at 100°C | 126 GPa | 
| Modulus of elasticity at 20°C | 130 GPa | 
| Modulus of elasticity at 200°C | 122 GPa | 
| Modulus of elasticity at 300°C | 116 GPa | 
| Specific electrical conductivity at 100°C | 43 m/Ω*mm² | 
| Specific electrical conductivity at 20°C | 57 m/Ω*mm² | 
| Specific electrical conductivity at 200°C | 33 m/Ω*mm² | 
| Specific electrical conductivity at -100°C | 110 m/Ω*mm² | 
| Specific electrical conductivity at -200°C | 460 m/Ω*mm² | 
| Specific electrical resistance at 100°C | 0.023 Ω*mm²/m | 
| Specific electrical resistance at 20°C | 0.018 Ω*mm²/m | 
| Specific electrical resistance at 200°C | 0.03 Ω*mm²/m | 
| Specific electrical resistance at -100°C | 0.009 Ω*mm²/m | 
| Specific electrical resistance at -200°C | 0.002 Ω*mm²/m | 
| Specific heat at 100°C | 0.393 J/(kg·K) | 
| Specific heat at 20°C | 0.386 J/(kg·K) | 
| Specific heat at 200°C | 0.403 J/(kg·K) | 
| Thermal conductivity at 100°C | 385 W/m*K | 
| Thermal conductivity at 20°C | 394 W/m*K | 
| Thermal conductivity at 200°C | 381 W/m*K | 
| Thermal conductivity at -100°C | 435 W/m*K | 
| Thermal conductivity at -200°C | 574 W/m*K | 
| Brazing | 2 | 
| Soft soldering | 1 | 
| Gas | 6 | 
| MIG | 5 | 
| TIG | 5 | 
| Aviation | No | 
| Bi (from) | 0,0005 | 
| Bi (to) | 0,0005 | 
| Cu footnote reference | 1 | 
| Other | 0,03 | 
| Pb (from) | 0,005 | 
| Pb (to) | 0,005 | 
| Rest | Cu | 
| suitable according to DIN EN 602 | No | 
| Material chemically EN 573-3 | Cu-ETP | 
| Material no | CW004A (former 2.0065. 2.0060) | 
| Coefficient of thermal expansion from 20 to 100°C | 16.8 K⁻¹10⁻⁶ | 
| Coefficient of thermal expansion from 20 to 200°C | 17.3 K⁻¹10⁻⁶ | 
| Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ | 
| Density | 8.93 g/cm³ | 
| Modulus of elasticity at 100°C | 126 GPa | 
| Modulus of elasticity at 20°C | 130 GPa | 
| Modulus of elasticity at 200°C | 122 GPa | 
| Modulus of elasticity at 300°C | 116 GPa | 
| Specific electrical conductivity at 100°C | 43 m/Ω*mm² | 
| Specific electrical conductivity at 20°C | 57 m/Ω*mm² | 
| Specific electrical conductivity at 200°C | 33 m/Ω*mm² | 
| Specific electrical conductivity at -100°C | 110 m/Ω*mm² | 
| Specific electrical conductivity at -200°C | 460 m/Ω*mm² | 
| Specific electrical resistance at 100°C | 0.023 Ω*mm²/m | 
| Specific electrical resistance at 20°C | 0.018 Ω*mm²/m | 
| Specific electrical resistance at 200°C | 0.03 Ω*mm²/m | 
| Specific electrical resistance at -100°C | 0.009 Ω*mm²/m | 
| Specific electrical resistance at -200°C | 0.002 Ω*mm²/m | 
| Specific heat at 100°C | 0.393 J/(kg·K) | 
| Specific heat at 20°C | 0.386 J/(kg·K) | 
| Specific heat at 200°C | 0.403 J/(kg·K) | 
| Thermal conductivity at 100°C | 385 W/m*K | 
| Thermal conductivity at 20°C | 394 W/m*K | 
| Thermal conductivity at 200°C | 381 W/m*K | 
| Thermal conductivity at -100°C | 435 W/m*K | 
| Thermal conductivity at -200°C | 574 W/m*K | 
| Brazing | 2 | 
| Soft soldering | 1 | 
| Gas | 6 | 
| MIG | 5 | 
| TIG | 5 | 
| Aviation | No | 
| Bi (from) | 0,0005 | 
| Bi (to) | 0,0005 | 
| Cu footnote reference | 1 | 
| Other | 0,03 | 
| Pb (from) | 0,005 | 
| Pb (to) | 0,005 | 
| Rest | Cu | 
| suitable according to DIN EN 602 | No | 
| Material chemically EN 573-3 | Cu-ETP | 
| Material no | CW004A (former 2.0065. 2.0060) | 
| Coefficient of thermal expansion from 20 to 100°C | 16.8 K⁻¹10⁻⁶ | 
| Coefficient of thermal expansion from 20 to 200°C | 17.3 K⁻¹10⁻⁶ | 
| Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ | 
| Density | 8.93 g/cm³ | 
| Modulus of elasticity at 100°C | 126 GPa | 
| Modulus of elasticity at 20°C | 130 GPa | 
| Modulus of elasticity at 200°C | 122 GPa | 
| Modulus of elasticity at 300°C | 116 GPa | 
| Specific electrical conductivity at 100°C | 43 m/Ω*mm² | 
| Specific electrical conductivity at 20°C | 57 m/Ω*mm² | 
| Specific electrical conductivity at 200°C | 33 m/Ω*mm² | 
| Specific electrical conductivity at -100°C | 110 m/Ω*mm² | 
| Specific electrical conductivity at -200°C | 460 m/Ω*mm² | 
| Specific electrical resistance at 100°C | 0.023 Ω*mm²/m | 
| Specific electrical resistance at 20°C | 0.018 Ω*mm²/m | 
| Specific electrical resistance at 200°C | 0.03 Ω*mm²/m | 
| Specific electrical resistance at -100°C | 0.009 Ω*mm²/m | 
| Specific electrical resistance at -200°C | 0.002 Ω*mm²/m | 
| Specific heat at 100°C | 0.393 J/(kg·K) | 
| Specific heat at 20°C | 0.386 J/(kg·K) | 
| Specific heat at 200°C | 0.403 J/(kg·K) | 
| Thermal conductivity at 100°C | 385 W/m*K | 
| Thermal conductivity at 20°C | 394 W/m*K | 
| Thermal conductivity at 200°C | 381 W/m*K | 
| Thermal conductivity at -100°C | 435 W/m*K | 
| Thermal conductivity at -200°C | 574 W/m*K | 
| Brazing | 2 | 
| Soft soldering | 1 | 
| Gas | 6 | 
| MIG | 5 | 
| TIG | 5 | 
                            1 very good
                            2 good
                            3 moderate
                            4 poor
                            5 unsuited
                            0 Not specified