CW004A
sheet rolled

- Form sheet rolled
- Material Copper
- Material CW004A
- Material chemically EN 573-3 Cu-ETP


BIKAR Metals companies
windings for electrical machines and apparatus
cables and wires
contact and chain wire
busbar connectors, feeder cables and switching circuits
busbars, contacts, switches
terminals, collector lamellas
Aviation | No |
Bi (from) | 0,0005 |
Bi (to) | 0,0005 |
Cu footnote reference | 1 |
Other | 0,03 |
Pb (from) | 0,005 |
Pb (to) | 0,005 |
Rest | Cu |
suitable according to DIN EN 602 | No |
Material chemically EN 573-3 | Cu-ETP |
Material no | CW004A (former 2.0065. 2.0060) |
Coefficient of thermal expansion from 20 to 100°C | 16.8 K⁻¹10⁻⁶ |
Coefficient of thermal expansion from 20 to 200°C | 17.3 K⁻¹10⁻⁶ |
Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ |
Density | 8.93 g/cm³ |
Modulus of elasticity at 100°C | 126 GPa |
Modulus of elasticity at 20°C | 130 GPa |
Modulus of elasticity at 200°C | 122 GPa |
Modulus of elasticity at 300°C | 116 GPa |
Specific electrical conductivity at 100°C | 43 m/Ω*mm² |
Specific electrical conductivity at 20°C | 57 m/Ω*mm² |
Specific electrical conductivity at 200°C | 33 m/Ω*mm² |
Specific electrical conductivity at -100°C | 110 m/Ω*mm² |
Specific electrical conductivity at -200°C | 460 m/Ω*mm² |
Specific electrical resistance at 100°C | 0.023 Ω*mm²/m |
Specific electrical resistance at 20°C | 0.018 Ω*mm²/m |
Specific electrical resistance at 200°C | 0.03 Ω*mm²/m |
Specific electrical resistance at -100°C | 0.009 Ω*mm²/m |
Specific electrical resistance at -200°C | 0.002 Ω*mm²/m |
Specific heat at 100°C | 0.393 J/(kg·K) |
Specific heat at 20°C | 0.386 J/(kg·K) |
Specific heat at 200°C | 0.403 J/(kg·K) |
Thermal conductivity at 100°C | 385 W/m*K |
Thermal conductivity at 20°C | 394 W/m*K |
Thermal conductivity at 200°C | 381 W/m*K |
Thermal conductivity at -100°C | 435 W/m*K |
Thermal conductivity at -200°C | 574 W/m*K |
Brazing | 2 |
Soft soldering | 1 |
Gas | 6 |
MIG | 5 |
TIG | 5 |
Aviation | No |
Bi (from) | 0,0005 |
Bi (to) | 0,0005 |
Cu footnote reference | 1 |
Other | 0,03 |
Pb (from) | 0,005 |
Pb (to) | 0,005 |
Rest | Cu |
suitable according to DIN EN 602 | No |
Material chemically EN 573-3 | Cu-ETP |
Material no | CW004A (former 2.0065. 2.0060) |
Coefficient of thermal expansion from 20 to 100°C | 16.8 K⁻¹10⁻⁶ |
Coefficient of thermal expansion from 20 to 200°C | 17.3 K⁻¹10⁻⁶ |
Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ |
Density | 8.93 g/cm³ |
Modulus of elasticity at 100°C | 126 GPa |
Modulus of elasticity at 20°C | 130 GPa |
Modulus of elasticity at 200°C | 122 GPa |
Modulus of elasticity at 300°C | 116 GPa |
Specific electrical conductivity at 100°C | 43 m/Ω*mm² |
Specific electrical conductivity at 20°C | 57 m/Ω*mm² |
Specific electrical conductivity at 200°C | 33 m/Ω*mm² |
Specific electrical conductivity at -100°C | 110 m/Ω*mm² |
Specific electrical conductivity at -200°C | 460 m/Ω*mm² |
Specific electrical resistance at 100°C | 0.023 Ω*mm²/m |
Specific electrical resistance at 20°C | 0.018 Ω*mm²/m |
Specific electrical resistance at 200°C | 0.03 Ω*mm²/m |
Specific electrical resistance at -100°C | 0.009 Ω*mm²/m |
Specific electrical resistance at -200°C | 0.002 Ω*mm²/m |
Specific heat at 100°C | 0.393 J/(kg·K) |
Specific heat at 20°C | 0.386 J/(kg·K) |
Specific heat at 200°C | 0.403 J/(kg·K) |
Thermal conductivity at 100°C | 385 W/m*K |
Thermal conductivity at 20°C | 394 W/m*K |
Thermal conductivity at 200°C | 381 W/m*K |
Thermal conductivity at -100°C | 435 W/m*K |
Thermal conductivity at -200°C | 574 W/m*K |
Brazing | 2 |
Soft soldering | 1 |
Gas | 6 |
MIG | 5 |
TIG | 5 |
Aviation | No |
Bi (from) | 0,0005 |
Bi (to) | 0,0005 |
Cu footnote reference | 1 |
Other | 0,03 |
Pb (from) | 0,005 |
Pb (to) | 0,005 |
Rest | Cu |
suitable according to DIN EN 602 | No |
Material chemically EN 573-3 | Cu-ETP |
Material no | CW004A (former 2.0065. 2.0060) |
Coefficient of thermal expansion from 20 to 100°C | 16.8 K⁻¹10⁻⁶ |
Coefficient of thermal expansion from 20 to 200°C | 17.3 K⁻¹10⁻⁶ |
Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ |
Density | 8.93 g/cm³ |
Modulus of elasticity at 100°C | 126 GPa |
Modulus of elasticity at 20°C | 130 GPa |
Modulus of elasticity at 200°C | 122 GPa |
Modulus of elasticity at 300°C | 116 GPa |
Specific electrical conductivity at 100°C | 43 m/Ω*mm² |
Specific electrical conductivity at 20°C | 57 m/Ω*mm² |
Specific electrical conductivity at 200°C | 33 m/Ω*mm² |
Specific electrical conductivity at -100°C | 110 m/Ω*mm² |
Specific electrical conductivity at -200°C | 460 m/Ω*mm² |
Specific electrical resistance at 100°C | 0.023 Ω*mm²/m |
Specific electrical resistance at 20°C | 0.018 Ω*mm²/m |
Specific electrical resistance at 200°C | 0.03 Ω*mm²/m |
Specific electrical resistance at -100°C | 0.009 Ω*mm²/m |
Specific electrical resistance at -200°C | 0.002 Ω*mm²/m |
Specific heat at 100°C | 0.393 J/(kg·K) |
Specific heat at 20°C | 0.386 J/(kg·K) |
Specific heat at 200°C | 0.403 J/(kg·K) |
Thermal conductivity at 100°C | 385 W/m*K |
Thermal conductivity at 20°C | 394 W/m*K |
Thermal conductivity at 200°C | 381 W/m*K |
Thermal conductivity at -100°C | 435 W/m*K |
Thermal conductivity at -200°C | 574 W/m*K |
Brazing | 2 |
Soft soldering | 1 |
Gas | 6 |
MIG | 5 |
TIG | 5 |
Aviation | No |
Bi (from) | 0,0005 |
Bi (to) | 0,0005 |
Cu footnote reference | 1 |
Other | 0,03 |
Pb (from) | 0,005 |
Pb (to) | 0,005 |
Rest | Cu |
suitable according to DIN EN 602 | No |
Material chemically EN 573-3 | Cu-ETP |
Material no | CW004A (former 2.0065. 2.0060) |
Coefficient of thermal expansion from 20 to 100°C | 16.8 K⁻¹10⁻⁶ |
Coefficient of thermal expansion from 20 to 200°C | 17.3 K⁻¹10⁻⁶ |
Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ |
Density | 8.93 g/cm³ |
Modulus of elasticity at 100°C | 126 GPa |
Modulus of elasticity at 20°C | 130 GPa |
Modulus of elasticity at 200°C | 122 GPa |
Modulus of elasticity at 300°C | 116 GPa |
Specific electrical conductivity at 100°C | 43 m/Ω*mm² |
Specific electrical conductivity at 20°C | 57 m/Ω*mm² |
Specific electrical conductivity at 200°C | 33 m/Ω*mm² |
Specific electrical conductivity at -100°C | 110 m/Ω*mm² |
Specific electrical conductivity at -200°C | 460 m/Ω*mm² |
Specific electrical resistance at 100°C | 0.023 Ω*mm²/m |
Specific electrical resistance at 20°C | 0.018 Ω*mm²/m |
Specific electrical resistance at 200°C | 0.03 Ω*mm²/m |
Specific electrical resistance at -100°C | 0.009 Ω*mm²/m |
Specific electrical resistance at -200°C | 0.002 Ω*mm²/m |
Specific heat at 100°C | 0.393 J/(kg·K) |
Specific heat at 20°C | 0.386 J/(kg·K) |
Specific heat at 200°C | 0.403 J/(kg·K) |
Thermal conductivity at 100°C | 385 W/m*K |
Thermal conductivity at 20°C | 394 W/m*K |
Thermal conductivity at 200°C | 381 W/m*K |
Thermal conductivity at -100°C | 435 W/m*K |
Thermal conductivity at -200°C | 574 W/m*K |
Brazing | 2 |
Soft soldering | 1 |
Gas | 6 |
MIG | 5 |
TIG | 5 |
Aviation | No |
Bi (from) | 0,0005 |
Bi (to) | 0,0005 |
Cu footnote reference | 1 |
Other | 0,03 |
Pb (from) | 0,005 |
Pb (to) | 0,005 |
Rest | Cu |
suitable according to DIN EN 602 | No |
Material chemically EN 573-3 | Cu-ETP |
Material no | CW004A (former 2.0065. 2.0060) |
Coefficient of thermal expansion from 20 to 100°C | 16.8 K⁻¹10⁻⁶ |
Coefficient of thermal expansion from 20 to 200°C | 17.3 K⁻¹10⁻⁶ |
Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ |
Density | 8.93 g/cm³ |
Modulus of elasticity at 100°C | 126 GPa |
Modulus of elasticity at 20°C | 130 GPa |
Modulus of elasticity at 200°C | 122 GPa |
Modulus of elasticity at 300°C | 116 GPa |
Specific electrical conductivity at 100°C | 43 m/Ω*mm² |
Specific electrical conductivity at 20°C | 57 m/Ω*mm² |
Specific electrical conductivity at 200°C | 33 m/Ω*mm² |
Specific electrical conductivity at -100°C | 110 m/Ω*mm² |
Specific electrical conductivity at -200°C | 460 m/Ω*mm² |
Specific electrical resistance at 100°C | 0.023 Ω*mm²/m |
Specific electrical resistance at 20°C | 0.018 Ω*mm²/m |
Specific electrical resistance at 200°C | 0.03 Ω*mm²/m |
Specific electrical resistance at -100°C | 0.009 Ω*mm²/m |
Specific electrical resistance at -200°C | 0.002 Ω*mm²/m |
Specific heat at 100°C | 0.393 J/(kg·K) |
Specific heat at 20°C | 0.386 J/(kg·K) |
Specific heat at 200°C | 0.403 J/(kg·K) |
Thermal conductivity at 100°C | 385 W/m*K |
Thermal conductivity at 20°C | 394 W/m*K |
Thermal conductivity at 200°C | 381 W/m*K |
Thermal conductivity at -100°C | 435 W/m*K |
Thermal conductivity at -200°C | 574 W/m*K |
Brazing | 2 |
Soft soldering | 1 |
Gas | 6 |
MIG | 5 |
TIG | 5 |
Aviation | No |
Bi (from) | 0,0005 |
Bi (to) | 0,0005 |
Cu footnote reference | 1 |
Other | 0,03 |
Pb (from) | 0,005 |
Pb (to) | 0,005 |
Rest | Cu |
suitable according to DIN EN 602 | No |
Material chemically EN 573-3 | Cu-ETP |
Material no | CW004A (former 2.0065. 2.0060) |
Coefficient of thermal expansion from 20 to 100°C | 16.8 K⁻¹10⁻⁶ |
Coefficient of thermal expansion from 20 to 200°C | 17.3 K⁻¹10⁻⁶ |
Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ |
Density | 8.93 g/cm³ |
Modulus of elasticity at 100°C | 126 GPa |
Modulus of elasticity at 20°C | 130 GPa |
Modulus of elasticity at 200°C | 122 GPa |
Modulus of elasticity at 300°C | 116 GPa |
Specific electrical conductivity at 100°C | 43 m/Ω*mm² |
Specific electrical conductivity at 20°C | 57 m/Ω*mm² |
Specific electrical conductivity at 200°C | 33 m/Ω*mm² |
Specific electrical conductivity at -100°C | 110 m/Ω*mm² |
Specific electrical conductivity at -200°C | 460 m/Ω*mm² |
Specific electrical resistance at 100°C | 0.023 Ω*mm²/m |
Specific electrical resistance at 20°C | 0.018 Ω*mm²/m |
Specific electrical resistance at 200°C | 0.03 Ω*mm²/m |
Specific electrical resistance at -100°C | 0.009 Ω*mm²/m |
Specific electrical resistance at -200°C | 0.002 Ω*mm²/m |
Specific heat at 100°C | 0.393 J/(kg·K) |
Specific heat at 20°C | 0.386 J/(kg·K) |
Specific heat at 200°C | 0.403 J/(kg·K) |
Thermal conductivity at 100°C | 385 W/m*K |
Thermal conductivity at 20°C | 394 W/m*K |
Thermal conductivity at 200°C | 381 W/m*K |
Thermal conductivity at -100°C | 435 W/m*K |
Thermal conductivity at -200°C | 574 W/m*K |
Brazing | 2 |
Soft soldering | 1 |
Gas | 6 |
MIG | 5 |
TIG | 5 |
Aviation | No |
Bi (from) | 0,0005 |
Bi (to) | 0,0005 |
Cu footnote reference | 1 |
Other | 0,03 |
Pb (from) | 0,005 |
Pb (to) | 0,005 |
Rest | Cu |
suitable according to DIN EN 602 | No |
Material chemically EN 573-3 | Cu-ETP |
Material no | CW004A (former 2.0065. 2.0060) |
Coefficient of thermal expansion from 20 to 100°C | 16.8 K⁻¹10⁻⁶ |
Coefficient of thermal expansion from 20 to 200°C | 17.3 K⁻¹10⁻⁶ |
Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ |
Density | 8.93 g/cm³ |
Modulus of elasticity at 100°C | 126 GPa |
Modulus of elasticity at 20°C | 130 GPa |
Modulus of elasticity at 200°C | 122 GPa |
Modulus of elasticity at 300°C | 116 GPa |
Specific electrical conductivity at 100°C | 43 m/Ω*mm² |
Specific electrical conductivity at 20°C | 57 m/Ω*mm² |
Specific electrical conductivity at 200°C | 33 m/Ω*mm² |
Specific electrical conductivity at -100°C | 110 m/Ω*mm² |
Specific electrical conductivity at -200°C | 460 m/Ω*mm² |
Specific electrical resistance at 100°C | 0.023 Ω*mm²/m |
Specific electrical resistance at 20°C | 0.018 Ω*mm²/m |
Specific electrical resistance at 200°C | 0.03 Ω*mm²/m |
Specific electrical resistance at -100°C | 0.009 Ω*mm²/m |
Specific electrical resistance at -200°C | 0.002 Ω*mm²/m |
Specific heat at 100°C | 0.393 J/(kg·K) |
Specific heat at 20°C | 0.386 J/(kg·K) |
Specific heat at 200°C | 0.403 J/(kg·K) |
Thermal conductivity at 100°C | 385 W/m*K |
Thermal conductivity at 20°C | 394 W/m*K |
Thermal conductivity at 200°C | 381 W/m*K |
Thermal conductivity at -100°C | 435 W/m*K |
Thermal conductivity at -200°C | 574 W/m*K |
Brazing | 2 |
Soft soldering | 1 |
Gas | 6 |
MIG | 5 |
TIG | 5 |
Aviation | No |
Bi (from) | 0,0005 |
Bi (to) | 0,0005 |
Cu footnote reference | 1 |
Other | 0,03 |
Pb (from) | 0,005 |
Pb (to) | 0,005 |
Rest | Cu |
suitable according to DIN EN 602 | No |
Material chemically EN 573-3 | Cu-ETP |
Material no | CW004A (former 2.0065. 2.0060) |
Coefficient of thermal expansion from 20 to 100°C | 16.8 K⁻¹10⁻⁶ |
Coefficient of thermal expansion from 20 to 200°C | 17.3 K⁻¹10⁻⁶ |
Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ |
Density | 8.93 g/cm³ |
Modulus of elasticity at 100°C | 126 GPa |
Modulus of elasticity at 20°C | 130 GPa |
Modulus of elasticity at 200°C | 122 GPa |
Modulus of elasticity at 300°C | 116 GPa |
Specific electrical conductivity at 100°C | 43 m/Ω*mm² |
Specific electrical conductivity at 20°C | 57 m/Ω*mm² |
Specific electrical conductivity at 200°C | 33 m/Ω*mm² |
Specific electrical conductivity at -100°C | 110 m/Ω*mm² |
Specific electrical conductivity at -200°C | 460 m/Ω*mm² |
Specific electrical resistance at 100°C | 0.023 Ω*mm²/m |
Specific electrical resistance at 20°C | 0.018 Ω*mm²/m |
Specific electrical resistance at 200°C | 0.03 Ω*mm²/m |
Specific electrical resistance at -100°C | 0.009 Ω*mm²/m |
Specific electrical resistance at -200°C | 0.002 Ω*mm²/m |
Specific heat at 100°C | 0.393 J/(kg·K) |
Specific heat at 20°C | 0.386 J/(kg·K) |
Specific heat at 200°C | 0.403 J/(kg·K) |
Thermal conductivity at 100°C | 385 W/m*K |
Thermal conductivity at 20°C | 394 W/m*K |
Thermal conductivity at 200°C | 381 W/m*K |
Thermal conductivity at -100°C | 435 W/m*K |
Thermal conductivity at -200°C | 574 W/m*K |
Brazing | 2 |
Soft soldering | 1 |
Gas | 6 |
MIG | 5 |
TIG | 5 |
Aviation | No |
Bi (from) | 0,0005 |
Bi (to) | 0,0005 |
Cu footnote reference | 1 |
Other | 0,03 |
Pb (from) | 0,005 |
Pb (to) | 0,005 |
Rest | Cu |
suitable according to DIN EN 602 | No |
Material chemically EN 573-3 | Cu-ETP |
Material no | CW004A (former 2.0065. 2.0060) |
Coefficient of thermal expansion from 20 to 100°C | 16.8 K⁻¹10⁻⁶ |
Coefficient of thermal expansion from 20 to 200°C | 17.3 K⁻¹10⁻⁶ |
Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ |
Density | 8.93 g/cm³ |
Modulus of elasticity at 100°C | 126 GPa |
Modulus of elasticity at 20°C | 130 GPa |
Modulus of elasticity at 200°C | 122 GPa |
Modulus of elasticity at 300°C | 116 GPa |
Specific electrical conductivity at 100°C | 43 m/Ω*mm² |
Specific electrical conductivity at 20°C | 57 m/Ω*mm² |
Specific electrical conductivity at 200°C | 33 m/Ω*mm² |
Specific electrical conductivity at -100°C | 110 m/Ω*mm² |
Specific electrical conductivity at -200°C | 460 m/Ω*mm² |
Specific electrical resistance at 100°C | 0.023 Ω*mm²/m |
Specific electrical resistance at 20°C | 0.018 Ω*mm²/m |
Specific electrical resistance at 200°C | 0.03 Ω*mm²/m |
Specific electrical resistance at -100°C | 0.009 Ω*mm²/m |
Specific electrical resistance at -200°C | 0.002 Ω*mm²/m |
Specific heat at 100°C | 0.393 J/(kg·K) |
Specific heat at 20°C | 0.386 J/(kg·K) |
Specific heat at 200°C | 0.403 J/(kg·K) |
Thermal conductivity at 100°C | 385 W/m*K |
Thermal conductivity at 20°C | 394 W/m*K |
Thermal conductivity at 200°C | 381 W/m*K |
Thermal conductivity at -100°C | 435 W/m*K |
Thermal conductivity at -200°C | 574 W/m*K |
Brazing | 2 |
Soft soldering | 1 |
Gas | 6 |
MIG | 5 |
TIG | 5 |
Aviation | No |
Bi (from) | 0,0005 |
Bi (to) | 0,0005 |
Cu footnote reference | 1 |
Other | 0,03 |
Pb (from) | 0,005 |
Pb (to) | 0,005 |
Rest | Cu |
suitable according to DIN EN 602 | No |
Material chemically EN 573-3 | Cu-ETP |
Material no | CW004A (former 2.0065. 2.0060) |
Coefficient of thermal expansion from 20 to 100°C | 16.8 K⁻¹10⁻⁶ |
Coefficient of thermal expansion from 20 to 200°C | 17.3 K⁻¹10⁻⁶ |
Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ |
Density | 8.93 g/cm³ |
Modulus of elasticity at 100°C | 126 GPa |
Modulus of elasticity at 20°C | 130 GPa |
Modulus of elasticity at 200°C | 122 GPa |
Modulus of elasticity at 300°C | 116 GPa |
Specific electrical conductivity at 100°C | 43 m/Ω*mm² |
Specific electrical conductivity at 20°C | 57 m/Ω*mm² |
Specific electrical conductivity at 200°C | 33 m/Ω*mm² |
Specific electrical conductivity at -100°C | 110 m/Ω*mm² |
Specific electrical conductivity at -200°C | 460 m/Ω*mm² |
Specific electrical resistance at 100°C | 0.023 Ω*mm²/m |
Specific electrical resistance at 20°C | 0.018 Ω*mm²/m |
Specific electrical resistance at 200°C | 0.03 Ω*mm²/m |
Specific electrical resistance at -100°C | 0.009 Ω*mm²/m |
Specific electrical resistance at -200°C | 0.002 Ω*mm²/m |
Specific heat at 100°C | 0.393 J/(kg·K) |
Specific heat at 20°C | 0.386 J/(kg·K) |
Specific heat at 200°C | 0.403 J/(kg·K) |
Thermal conductivity at 100°C | 385 W/m*K |
Thermal conductivity at 20°C | 394 W/m*K |
Thermal conductivity at 200°C | 381 W/m*K |
Thermal conductivity at -100°C | 435 W/m*K |
Thermal conductivity at -200°C | 574 W/m*K |
Brazing | 2 |
Soft soldering | 1 |
Gas | 6 |
MIG | 5 |
TIG | 5 |
Aviation | No |
Bi (from) | 0,0005 |
Bi (to) | 0,0005 |
Cu footnote reference | 1 |
Other | 0,03 |
Pb (from) | 0,005 |
Pb (to) | 0,005 |
Rest | Cu |
suitable according to DIN EN 602 | No |
Material chemically EN 573-3 | Cu-ETP |
Material no | CW004A (former 2.0065. 2.0060) |
Coefficient of thermal expansion from 20 to 100°C | 16.8 K⁻¹10⁻⁶ |
Coefficient of thermal expansion from 20 to 200°C | 17.3 K⁻¹10⁻⁶ |
Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ |
Density | 8.93 g/cm³ |
Modulus of elasticity at 100°C | 126 GPa |
Modulus of elasticity at 20°C | 130 GPa |
Modulus of elasticity at 200°C | 122 GPa |
Modulus of elasticity at 300°C | 116 GPa |
Specific electrical conductivity at 100°C | 43 m/Ω*mm² |
Specific electrical conductivity at 20°C | 57 m/Ω*mm² |
Specific electrical conductivity at 200°C | 33 m/Ω*mm² |
Specific electrical conductivity at -100°C | 110 m/Ω*mm² |
Specific electrical conductivity at -200°C | 460 m/Ω*mm² |
Specific electrical resistance at 100°C | 0.023 Ω*mm²/m |
Specific electrical resistance at 20°C | 0.018 Ω*mm²/m |
Specific electrical resistance at 200°C | 0.03 Ω*mm²/m |
Specific electrical resistance at -100°C | 0.009 Ω*mm²/m |
Specific electrical resistance at -200°C | 0.002 Ω*mm²/m |
Specific heat at 100°C | 0.393 J/(kg·K) |
Specific heat at 20°C | 0.386 J/(kg·K) |
Specific heat at 200°C | 0.403 J/(kg·K) |
Thermal conductivity at 100°C | 385 W/m*K |
Thermal conductivity at 20°C | 394 W/m*K |
Thermal conductivity at 200°C | 381 W/m*K |
Thermal conductivity at -100°C | 435 W/m*K |
Thermal conductivity at -200°C | 574 W/m*K |
Brazing | 2 |
Soft soldering | 1 |
Gas | 6 |
MIG | 5 |
TIG | 5 |
Aviation | No |
Bi (from) | 0,0005 |
Bi (to) | 0,0005 |
Cu footnote reference | 1 |
Other | 0,03 |
Pb (from) | 0,005 |
Pb (to) | 0,005 |
Rest | Cu |
suitable according to DIN EN 602 | No |
Material chemically EN 573-3 | Cu-ETP |
Material no | CW004A (former 2.0065. 2.0060) |
Coefficient of thermal expansion from 20 to 100°C | 16.8 K⁻¹10⁻⁶ |
Coefficient of thermal expansion from 20 to 200°C | 17.3 K⁻¹10⁻⁶ |
Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ |
Density | 8.93 g/cm³ |
Modulus of elasticity at 100°C | 126 GPa |
Modulus of elasticity at 20°C | 130 GPa |
Modulus of elasticity at 200°C | 122 GPa |
Modulus of elasticity at 300°C | 116 GPa |
Specific electrical conductivity at 100°C | 43 m/Ω*mm² |
Specific electrical conductivity at 20°C | 57 m/Ω*mm² |
Specific electrical conductivity at 200°C | 33 m/Ω*mm² |
Specific electrical conductivity at -100°C | 110 m/Ω*mm² |
Specific electrical conductivity at -200°C | 460 m/Ω*mm² |
Specific electrical resistance at 100°C | 0.023 Ω*mm²/m |
Specific electrical resistance at 20°C | 0.018 Ω*mm²/m |
Specific electrical resistance at 200°C | 0.03 Ω*mm²/m |
Specific electrical resistance at -100°C | 0.009 Ω*mm²/m |
Specific electrical resistance at -200°C | 0.002 Ω*mm²/m |
Specific heat at 100°C | 0.393 J/(kg·K) |
Specific heat at 20°C | 0.386 J/(kg·K) |
Specific heat at 200°C | 0.403 J/(kg·K) |
Thermal conductivity at 100°C | 385 W/m*K |
Thermal conductivity at 20°C | 394 W/m*K |
Thermal conductivity at 200°C | 381 W/m*K |
Thermal conductivity at -100°C | 435 W/m*K |
Thermal conductivity at -200°C | 574 W/m*K |
Brazing | 2 |
Soft soldering | 1 |
Gas | 6 |
MIG | 5 |
TIG | 5 |
Aviation | No |
Bi (from) | 0,0005 |
Bi (to) | 0,0005 |
Cu footnote reference | 1 |
Other | 0,03 |
Pb (from) | 0,005 |
Pb (to) | 0,005 |
Rest | Cu |
suitable according to DIN EN 602 | No |
Material chemically EN 573-3 | Cu-ETP |
Material no | CW004A (former 2.0065. 2.0060) |
Coefficient of thermal expansion from 20 to 100°C | 16.8 K⁻¹10⁻⁶ |
Coefficient of thermal expansion from 20 to 200°C | 17.3 K⁻¹10⁻⁶ |
Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ |
Density | 8.93 g/cm³ |
Modulus of elasticity at 100°C | 126 GPa |
Modulus of elasticity at 20°C | 130 GPa |
Modulus of elasticity at 200°C | 122 GPa |
Modulus of elasticity at 300°C | 116 GPa |
Specific electrical conductivity at 100°C | 43 m/Ω*mm² |
Specific electrical conductivity at 20°C | 57 m/Ω*mm² |
Specific electrical conductivity at 200°C | 33 m/Ω*mm² |
Specific electrical conductivity at -100°C | 110 m/Ω*mm² |
Specific electrical conductivity at -200°C | 460 m/Ω*mm² |
Specific electrical resistance at 100°C | 0.023 Ω*mm²/m |
Specific electrical resistance at 20°C | 0.018 Ω*mm²/m |
Specific electrical resistance at 200°C | 0.03 Ω*mm²/m |
Specific electrical resistance at -100°C | 0.009 Ω*mm²/m |
Specific electrical resistance at -200°C | 0.002 Ω*mm²/m |
Specific heat at 100°C | 0.393 J/(kg·K) |
Specific heat at 20°C | 0.386 J/(kg·K) |
Specific heat at 200°C | 0.403 J/(kg·K) |
Thermal conductivity at 100°C | 385 W/m*K |
Thermal conductivity at 20°C | 394 W/m*K |
Thermal conductivity at 200°C | 381 W/m*K |
Thermal conductivity at -100°C | 435 W/m*K |
Thermal conductivity at -200°C | 574 W/m*K |
Brazing | 2 |
Soft soldering | 1 |
Gas | 6 |
MIG | 5 |
TIG | 5 |
Aviation | No |
Bi (from) | 0,0005 |
Bi (to) | 0,0005 |
Cu footnote reference | 1 |
Other | 0,03 |
Pb (from) | 0,005 |
Pb (to) | 0,005 |
Rest | Cu |
suitable according to DIN EN 602 | No |
Material chemically EN 573-3 | Cu-ETP |
Material no | CW004A (former 2.0065. 2.0060) |
Coefficient of thermal expansion from 20 to 100°C | 16.8 K⁻¹10⁻⁶ |
Coefficient of thermal expansion from 20 to 200°C | 17.3 K⁻¹10⁻⁶ |
Coefficient of thermal expansion from 20 to 300°C | 17.7 K⁻¹10⁻⁶ |
Density | 8.93 g/cm³ |
Modulus of elasticity at 100°C | 126 GPa |
Modulus of elasticity at 20°C | 130 GPa |
Modulus of elasticity at 200°C | 122 GPa |
Modulus of elasticity at 300°C | 116 GPa |
Specific electrical conductivity at 100°C | 43 m/Ω*mm² |
Specific electrical conductivity at 20°C | 57 m/Ω*mm² |
Specific electrical conductivity at 200°C | 33 m/Ω*mm² |
Specific electrical conductivity at -100°C | 110 m/Ω*mm² |
Specific electrical conductivity at -200°C | 460 m/Ω*mm² |
Specific electrical resistance at 100°C | 0.023 Ω*mm²/m |
Specific electrical resistance at 20°C | 0.018 Ω*mm²/m |
Specific electrical resistance at 200°C | 0.03 Ω*mm²/m |
Specific electrical resistance at -100°C | 0.009 Ω*mm²/m |
Specific electrical resistance at -200°C | 0.002 Ω*mm²/m |
Specific heat at 100°C | 0.393 J/(kg·K) |
Specific heat at 20°C | 0.386 J/(kg·K) |
Specific heat at 200°C | 0.403 J/(kg·K) |
Thermal conductivity at 100°C | 385 W/m*K |
Thermal conductivity at 20°C | 394 W/m*K |
Thermal conductivity at 200°C | 381 W/m*K |
Thermal conductivity at -100°C | 435 W/m*K |
Thermal conductivity at -200°C | 574 W/m*K |
Brazing | 2 |
Soft soldering | 1 |
Gas | 6 |
MIG | 5 |
TIG | 5 |
1 very good
2 good
3 moderate
4 poor
5 unsuited
0 Not specified