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CW004A

hexagon bar

A technical illustration of the product with dimensions of the material CW004A from the material Copper in the shape hexagon bar
  • Form hexagon bar
  • Material Copper
  • Material CW004A
  • Material chemically EN 573-3 Cu 57 (Cu-ETP)

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You can find an overview of all standard dimensions here in our stock list.
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An image of the material CW004A from the material Copper in the shape hexagon bar
A technical illustration of the product of the material CW004A from the material Copper in the shape hexagon bar

Areas of application

windings for electrical machines and apparatus

cables and wires

contact and chain wire

Areas of application

busbar connectors, feeder cables and switching circuits

busbars, contacts, switches

terminals, collector lamellas

Features of this material

  • good resistance in natural atmosphere (also in sea air) and industrial atmosphere
  • insensitive to stress corrosion cracking

Information about the material

  • Aviation
    Aviation No
  • Chemical specifications
    Bi (from) 0.0005
    Bi (to) 0.0005
    Cu footnote reference 1
    Other 0.03
    Pb (from) 0.005
    Pb (to) 0.005
    Rest Cu

    1) Einschließlich Silber bis max. 0,015 % 2) Ein Sauerstoffgehalt bis 0,06 % ist zulässig, wenn zwischen Käufer
    und Lieferant vereinbart.

  • Food industry
    suitable according to DIN EN 602 No
  • Material
    Material chemically EN 573-3 Cu 57 (Cu-ETP)
    Material no CW004A (former 2.0065. 2.0060)
  • physical properties
    Coefficient of thermal expansion from 20 to 100°C 16.8 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 200°C 17.3 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 300°C 17.7 K⁻¹10⁻⁶
    Density 8.93 g/cm³
    Modulus of elasticity at 100°C 126 GPa
    Modulus of elasticity at 20°C 130 GPa
    Modulus of elasticity at 200°C 122 GPa
    Modulus of elasticity at 300°C 116 GPa
    Specific electrical conductivity at 100°C 43 m/Ω*mm²
    Specific electrical conductivity at 20°C 57 m/Ω*mm²
    Specific electrical conductivity at 200°C 33 m/Ω*mm²
    Specific electrical conductivity at -100°C 110 m/Ω*mm²
    Specific electrical conductivity at -200°C 460 m/Ω*mm²
    Specific electrical resistance at 100°C 0.023 Ω*mm²/m
    Specific electrical resistance at 20°C 0.018 Ω*mm²/m
    Specific electrical resistance at 200°C 0.03 Ω*mm²/m
    Specific electrical resistance at -100°C 0.009 Ω*mm²/m
    Specific electrical resistance at -200°C 0.002 Ω*mm²/m
    Specific heat at 100°C 0.393 J/(kg·K)
    Specific heat at 20°C 0.386 J/(kg·K)
    Specific heat at 200°C 0.403 J/(kg·K)
    Thermal conductivity at 100°C 385 W/m*K
    Thermal conductivity at 20°C 394 W/m*K
    Thermal conductivity at 200°C 381 W/m*K
    Thermal conductivity at -100°C 435 W/m*K
    Thermal conductivity at -200°C 574 W/m*K
  • Soldering
    Brazing 2
    Soft soldering 1
  • Welding
    Gas 6
    MIG 5
    TIG 5
  • Aviation
    Aviation No
  • Chemical specifications
    Bi (from) 0.0005
    Bi (to) 0.0005
    Cu footnote reference 1
    Other 0.03
    Pb (from) 0.005
    Pb (to) 0.005
    Rest Cu

    1) Einschließlich Silber bis max. 0,015 % 2) Ein Sauerstoffgehalt bis 0,06 % ist zulässig, wenn zwischen Käufer
    und Lieferant vereinbart.

  • Food industry
    suitable according to DIN EN 602 No
  • Material
    Material chemically EN 573-3 Cu 57 (Cu-ETP)
    Material no CW004A (former 2.0065. 2.0060)
  • physical properties
    Coefficient of thermal expansion from 20 to 100°C 16.8 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 200°C 17.3 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 300°C 17.7 K⁻¹10⁻⁶
    Density 8.93 g/cm³
    Modulus of elasticity at 100°C 126 GPa
    Modulus of elasticity at 20°C 130 GPa
    Modulus of elasticity at 200°C 122 GPa
    Modulus of elasticity at 300°C 116 GPa
    Specific electrical conductivity at 100°C 43 m/Ω*mm²
    Specific electrical conductivity at 20°C 57 m/Ω*mm²
    Specific electrical conductivity at 200°C 33 m/Ω*mm²
    Specific electrical conductivity at -100°C 110 m/Ω*mm²
    Specific electrical conductivity at -200°C 460 m/Ω*mm²
    Specific electrical resistance at 100°C 0.023 Ω*mm²/m
    Specific electrical resistance at 20°C 0.018 Ω*mm²/m
    Specific electrical resistance at 200°C 0.03 Ω*mm²/m
    Specific electrical resistance at -100°C 0.009 Ω*mm²/m
    Specific electrical resistance at -200°C 0.002 Ω*mm²/m
    Specific heat at 100°C 0.393 J/(kg·K)
    Specific heat at 20°C 0.386 J/(kg·K)
    Specific heat at 200°C 0.403 J/(kg·K)
    Thermal conductivity at 100°C 385 W/m*K
    Thermal conductivity at 20°C 394 W/m*K
    Thermal conductivity at 200°C 381 W/m*K
    Thermal conductivity at -100°C 435 W/m*K
    Thermal conductivity at -200°C 574 W/m*K
  • Soldering
    Brazing 2
    Soft soldering 1
  • Welding
    Gas 6
    MIG 5
    TIG 5
  • Aviation
    Aviation No
  • Chemical specifications
    Bi (from) 0.0005
    Bi (to) 0.0005
    Cu footnote reference 1
    Other 0.03
    Pb (from) 0.005
    Pb (to) 0.005
    Rest Cu

    1) Einschließlich Silber bis max. 0,015 % 2) Ein Sauerstoffgehalt bis 0,06 % ist zulässig, wenn zwischen Käufer
    und Lieferant vereinbart.

  • Food industry
    suitable according to DIN EN 602 No
  • Material
    Material chemically EN 573-3 Cu 57 (Cu-ETP)
    Material no CW004A (former 2.0065. 2.0060)
  • physical properties
    Coefficient of thermal expansion from 20 to 100°C 16.8 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 200°C 17.3 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 300°C 17.7 K⁻¹10⁻⁶
    Density 8.93 g/cm³
    Modulus of elasticity at 100°C 126 GPa
    Modulus of elasticity at 20°C 130 GPa
    Modulus of elasticity at 200°C 122 GPa
    Modulus of elasticity at 300°C 116 GPa
    Specific electrical conductivity at 100°C 43 m/Ω*mm²
    Specific electrical conductivity at 20°C 57 m/Ω*mm²
    Specific electrical conductivity at 200°C 33 m/Ω*mm²
    Specific electrical conductivity at -100°C 110 m/Ω*mm²
    Specific electrical conductivity at -200°C 460 m/Ω*mm²
    Specific electrical resistance at 100°C 0.023 Ω*mm²/m
    Specific electrical resistance at 20°C 0.018 Ω*mm²/m
    Specific electrical resistance at 200°C 0.03 Ω*mm²/m
    Specific electrical resistance at -100°C 0.009 Ω*mm²/m
    Specific electrical resistance at -200°C 0.002 Ω*mm²/m
    Specific heat at 100°C 0.393 J/(kg·K)
    Specific heat at 20°C 0.386 J/(kg·K)
    Specific heat at 200°C 0.403 J/(kg·K)
    Thermal conductivity at 100°C 385 W/m*K
    Thermal conductivity at 20°C 394 W/m*K
    Thermal conductivity at 200°C 381 W/m*K
    Thermal conductivity at -100°C 435 W/m*K
    Thermal conductivity at -200°C 574 W/m*K
  • Soldering
    Brazing 2
    Soft soldering 1
  • Welding
    Gas 6
    MIG 5
    TIG 5
  • Aviation
    Aviation No
  • Chemical specifications
    Bi (from) 0.0005
    Bi (to) 0.0005
    Cu footnote reference 1
    Other 0.03
    Pb (from) 0.005
    Pb (to) 0.005
    Rest Cu

    1) Einschließlich Silber bis max. 0,015 % 2) Ein Sauerstoffgehalt bis 0,06 % ist zulässig, wenn zwischen Käufer
    und Lieferant vereinbart.

  • Food industry
    suitable according to DIN EN 602 No
  • Material
    Material chemically EN 573-3 Cu 57 (Cu-ETP)
    Material no CW004A (former 2.0065. 2.0060)
  • physical properties
    Coefficient of thermal expansion from 20 to 100°C 16.8 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 200°C 17.3 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 300°C 17.7 K⁻¹10⁻⁶
    Density 8.93 g/cm³
    Modulus of elasticity at 100°C 126 GPa
    Modulus of elasticity at 20°C 130 GPa
    Modulus of elasticity at 200°C 122 GPa
    Modulus of elasticity at 300°C 116 GPa
    Specific electrical conductivity at 100°C 43 m/Ω*mm²
    Specific electrical conductivity at 20°C 57 m/Ω*mm²
    Specific electrical conductivity at 200°C 33 m/Ω*mm²
    Specific electrical conductivity at -100°C 110 m/Ω*mm²
    Specific electrical conductivity at -200°C 460 m/Ω*mm²
    Specific electrical resistance at 100°C 0.023 Ω*mm²/m
    Specific electrical resistance at 20°C 0.018 Ω*mm²/m
    Specific electrical resistance at 200°C 0.03 Ω*mm²/m
    Specific electrical resistance at -100°C 0.009 Ω*mm²/m
    Specific electrical resistance at -200°C 0.002 Ω*mm²/m
    Specific heat at 100°C 0.393 J/(kg·K)
    Specific heat at 20°C 0.386 J/(kg·K)
    Specific heat at 200°C 0.403 J/(kg·K)
    Thermal conductivity at 100°C 385 W/m*K
    Thermal conductivity at 20°C 394 W/m*K
    Thermal conductivity at 200°C 381 W/m*K
    Thermal conductivity at -100°C 435 W/m*K
    Thermal conductivity at -200°C 574 W/m*K
  • Soldering
    Brazing 2
    Soft soldering 1
  • Welding
    Gas 6
    MIG 5
    TIG 5
  • Aviation
    Aviation No
  • Chemical specifications
    Bi (from) 0.0005
    Bi (to) 0.0005
    Cu footnote reference 1
    Other 0.03
    Pb (from) 0.005
    Pb (to) 0.005
    Rest Cu

    1) Einschließlich Silber bis max. 0,015 % 2) Ein Sauerstoffgehalt bis 0,06 % ist zulässig, wenn zwischen Käufer
    und Lieferant vereinbart.

  • Food industry
    suitable according to DIN EN 602 No
  • Material
    Material chemically EN 573-3 Cu 57 (Cu-ETP)
    Material no CW004A (former 2.0065. 2.0060)
  • physical properties
    Coefficient of thermal expansion from 20 to 100°C 16.8 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 200°C 17.3 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 300°C 17.7 K⁻¹10⁻⁶
    Density 8.93 g/cm³
    Modulus of elasticity at 100°C 126 GPa
    Modulus of elasticity at 20°C 130 GPa
    Modulus of elasticity at 200°C 122 GPa
    Modulus of elasticity at 300°C 116 GPa
    Specific electrical conductivity at 100°C 43 m/Ω*mm²
    Specific electrical conductivity at 20°C 57 m/Ω*mm²
    Specific electrical conductivity at 200°C 33 m/Ω*mm²
    Specific electrical conductivity at -100°C 110 m/Ω*mm²
    Specific electrical conductivity at -200°C 460 m/Ω*mm²
    Specific electrical resistance at 100°C 0.023 Ω*mm²/m
    Specific electrical resistance at 20°C 0.018 Ω*mm²/m
    Specific electrical resistance at 200°C 0.03 Ω*mm²/m
    Specific electrical resistance at -100°C 0.009 Ω*mm²/m
    Specific electrical resistance at -200°C 0.002 Ω*mm²/m
    Specific heat at 100°C 0.393 J/(kg·K)
    Specific heat at 20°C 0.386 J/(kg·K)
    Specific heat at 200°C 0.403 J/(kg·K)
    Thermal conductivity at 100°C 385 W/m*K
    Thermal conductivity at 20°C 394 W/m*K
    Thermal conductivity at 200°C 381 W/m*K
    Thermal conductivity at -100°C 435 W/m*K
    Thermal conductivity at -200°C 574 W/m*K
  • Soldering
    Brazing 2
    Soft soldering 1
  • Welding
    Gas 6
    MIG 5
    TIG 5
  • Aviation
    Aviation No
  • Chemical specifications
    Bi (from) 0.0005
    Bi (to) 0.0005
    Cu footnote reference 1
    Other 0.03
    Pb (from) 0.005
    Pb (to) 0.005
    Rest Cu

    1) Einschließlich Silber bis max. 0,015 % 2) Ein Sauerstoffgehalt bis 0,06 % ist zulässig, wenn zwischen Käufer
    und Lieferant vereinbart.

  • Food industry
    suitable according to DIN EN 602 No
  • Material
    Material chemically EN 573-3 Cu 57 (Cu-ETP)
    Material no CW004A (former 2.0065. 2.0060)
  • physical properties
    Coefficient of thermal expansion from 20 to 100°C 16.8 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 200°C 17.3 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 300°C 17.7 K⁻¹10⁻⁶
    Density 8.93 g/cm³
    Modulus of elasticity at 100°C 126 GPa
    Modulus of elasticity at 20°C 130 GPa
    Modulus of elasticity at 200°C 122 GPa
    Modulus of elasticity at 300°C 116 GPa
    Specific electrical conductivity at 100°C 43 m/Ω*mm²
    Specific electrical conductivity at 20°C 57 m/Ω*mm²
    Specific electrical conductivity at 200°C 33 m/Ω*mm²
    Specific electrical conductivity at -100°C 110 m/Ω*mm²
    Specific electrical conductivity at -200°C 460 m/Ω*mm²
    Specific electrical resistance at 100°C 0.023 Ω*mm²/m
    Specific electrical resistance at 20°C 0.018 Ω*mm²/m
    Specific electrical resistance at 200°C 0.03 Ω*mm²/m
    Specific electrical resistance at -100°C 0.009 Ω*mm²/m
    Specific electrical resistance at -200°C 0.002 Ω*mm²/m
    Specific heat at 100°C 0.393 J/(kg·K)
    Specific heat at 20°C 0.386 J/(kg·K)
    Specific heat at 200°C 0.403 J/(kg·K)
    Thermal conductivity at 100°C 385 W/m*K
    Thermal conductivity at 20°C 394 W/m*K
    Thermal conductivity at 200°C 381 W/m*K
    Thermal conductivity at -100°C 435 W/m*K
    Thermal conductivity at -200°C 574 W/m*K
  • Soldering
    Brazing 2
    Soft soldering 1
  • Welding
    Gas 6
    MIG 5
    TIG 5
  • Aviation
    Aviation No
  • Chemical specifications
    Bi (from) 0.0005
    Bi (to) 0.0005
    Cu footnote reference 1
    Other 0.03
    Pb (from) 0.005
    Pb (to) 0.005
    Rest Cu

    1) Einschließlich Silber bis max. 0,015 % 2) Ein Sauerstoffgehalt bis 0,06 % ist zulässig, wenn zwischen Käufer
    und Lieferant vereinbart.

  • Food industry
    suitable according to DIN EN 602 No
  • Material
    Material chemically EN 573-3 Cu 57 (Cu-ETP)
    Material no CW004A (former 2.0065. 2.0060)
  • physical properties
    Coefficient of thermal expansion from 20 to 100°C 16.8 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 200°C 17.3 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 300°C 17.7 K⁻¹10⁻⁶
    Density 8.93 g/cm³
    Modulus of elasticity at 100°C 126 GPa
    Modulus of elasticity at 20°C 130 GPa
    Modulus of elasticity at 200°C 122 GPa
    Modulus of elasticity at 300°C 116 GPa
    Specific electrical conductivity at 100°C 43 m/Ω*mm²
    Specific electrical conductivity at 20°C 57 m/Ω*mm²
    Specific electrical conductivity at 200°C 33 m/Ω*mm²
    Specific electrical conductivity at -100°C 110 m/Ω*mm²
    Specific electrical conductivity at -200°C 460 m/Ω*mm²
    Specific electrical resistance at 100°C 0.023 Ω*mm²/m
    Specific electrical resistance at 20°C 0.018 Ω*mm²/m
    Specific electrical resistance at 200°C 0.03 Ω*mm²/m
    Specific electrical resistance at -100°C 0.009 Ω*mm²/m
    Specific electrical resistance at -200°C 0.002 Ω*mm²/m
    Specific heat at 100°C 0.393 J/(kg·K)
    Specific heat at 20°C 0.386 J/(kg·K)
    Specific heat at 200°C 0.403 J/(kg·K)
    Thermal conductivity at 100°C 385 W/m*K
    Thermal conductivity at 20°C 394 W/m*K
    Thermal conductivity at 200°C 381 W/m*K
    Thermal conductivity at -100°C 435 W/m*K
    Thermal conductivity at -200°C 574 W/m*K
  • Soldering
    Brazing 2
    Soft soldering 1
  • Welding
    Gas 6
    MIG 5
    TIG 5
  • Aviation
    Aviation No
  • Chemical specifications
    Bi (from) 0.0005
    Bi (to) 0.0005
    Cu footnote reference 1
    Other 0.03
    Pb (from) 0.005
    Pb (to) 0.005
    Rest Cu

    1) Einschließlich Silber bis max. 0,015 % 2) Ein Sauerstoffgehalt bis 0,06 % ist zulässig, wenn zwischen Käufer
    und Lieferant vereinbart.

  • Food industry
    suitable according to DIN EN 602 No
  • Material
    Material chemically EN 573-3 Cu 57 (Cu-ETP)
    Material no CW004A (former 2.0065. 2.0060)
  • physical properties
    Coefficient of thermal expansion from 20 to 100°C 16.8 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 200°C 17.3 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 300°C 17.7 K⁻¹10⁻⁶
    Density 8.93 g/cm³
    Modulus of elasticity at 100°C 126 GPa
    Modulus of elasticity at 20°C 130 GPa
    Modulus of elasticity at 200°C 122 GPa
    Modulus of elasticity at 300°C 116 GPa
    Specific electrical conductivity at 100°C 43 m/Ω*mm²
    Specific electrical conductivity at 20°C 57 m/Ω*mm²
    Specific electrical conductivity at 200°C 33 m/Ω*mm²
    Specific electrical conductivity at -100°C 110 m/Ω*mm²
    Specific electrical conductivity at -200°C 460 m/Ω*mm²
    Specific electrical resistance at 100°C 0.023 Ω*mm²/m
    Specific electrical resistance at 20°C 0.018 Ω*mm²/m
    Specific electrical resistance at 200°C 0.03 Ω*mm²/m
    Specific electrical resistance at -100°C 0.009 Ω*mm²/m
    Specific electrical resistance at -200°C 0.002 Ω*mm²/m
    Specific heat at 100°C 0.393 J/(kg·K)
    Specific heat at 20°C 0.386 J/(kg·K)
    Specific heat at 200°C 0.403 J/(kg·K)
    Thermal conductivity at 100°C 385 W/m*K
    Thermal conductivity at 20°C 394 W/m*K
    Thermal conductivity at 200°C 381 W/m*K
    Thermal conductivity at -100°C 435 W/m*K
    Thermal conductivity at -200°C 574 W/m*K
  • Soldering
    Brazing 2
    Soft soldering 1
  • Welding
    Gas 6
    MIG 5
    TIG 5
  • Aviation
    Aviation No
  • Chemical specifications
    Bi (from) 0.0005
    Bi (to) 0.0005
    Cu footnote reference 1
    Other 0.03
    Pb (from) 0.005
    Pb (to) 0.005
    Rest Cu

    1) Einschließlich Silber bis max. 0,015 % 2) Ein Sauerstoffgehalt bis 0,06 % ist zulässig, wenn zwischen Käufer
    und Lieferant vereinbart.

  • Food industry
    suitable according to DIN EN 602 No
  • Material
    Material chemically EN 573-3 Cu 57 (Cu-ETP)
    Material no CW004A (former 2.0065. 2.0060)
  • physical properties
    Coefficient of thermal expansion from 20 to 100°C 16.8 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 200°C 17.3 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 300°C 17.7 K⁻¹10⁻⁶
    Density 8.93 g/cm³
    Modulus of elasticity at 100°C 126 GPa
    Modulus of elasticity at 20°C 130 GPa
    Modulus of elasticity at 200°C 122 GPa
    Modulus of elasticity at 300°C 116 GPa
    Specific electrical conductivity at 100°C 43 m/Ω*mm²
    Specific electrical conductivity at 20°C 57 m/Ω*mm²
    Specific electrical conductivity at 200°C 33 m/Ω*mm²
    Specific electrical conductivity at -100°C 110 m/Ω*mm²
    Specific electrical conductivity at -200°C 460 m/Ω*mm²
    Specific electrical resistance at 100°C 0.023 Ω*mm²/m
    Specific electrical resistance at 20°C 0.018 Ω*mm²/m
    Specific electrical resistance at 200°C 0.03 Ω*mm²/m
    Specific electrical resistance at -100°C 0.009 Ω*mm²/m
    Specific electrical resistance at -200°C 0.002 Ω*mm²/m
    Specific heat at 100°C 0.393 J/(kg·K)
    Specific heat at 20°C 0.386 J/(kg·K)
    Specific heat at 200°C 0.403 J/(kg·K)
    Thermal conductivity at 100°C 385 W/m*K
    Thermal conductivity at 20°C 394 W/m*K
    Thermal conductivity at 200°C 381 W/m*K
    Thermal conductivity at -100°C 435 W/m*K
    Thermal conductivity at -200°C 574 W/m*K
  • Soldering
    Brazing 2
    Soft soldering 1
  • Welding
    Gas 6
    MIG 5
    TIG 5
  • Aviation
    Aviation No
  • Chemical specifications
    Bi (from) 0.0005
    Bi (to) 0.0005
    Cu footnote reference 1
    Other 0.03
    Pb (from) 0.005
    Pb (to) 0.005
    Rest Cu

    1) Einschließlich Silber bis max. 0,015 % 2) Ein Sauerstoffgehalt bis 0,06 % ist zulässig, wenn zwischen Käufer
    und Lieferant vereinbart.

  • Food industry
    suitable according to DIN EN 602 No
  • Material
    Material chemically EN 573-3 Cu 57 (Cu-ETP)
    Material no CW004A (former 2.0065. 2.0060)
  • physical properties
    Coefficient of thermal expansion from 20 to 100°C 16.8 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 200°C 17.3 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 300°C 17.7 K⁻¹10⁻⁶
    Density 8.93 g/cm³
    Modulus of elasticity at 100°C 126 GPa
    Modulus of elasticity at 20°C 130 GPa
    Modulus of elasticity at 200°C 122 GPa
    Modulus of elasticity at 300°C 116 GPa
    Specific electrical conductivity at 100°C 43 m/Ω*mm²
    Specific electrical conductivity at 20°C 57 m/Ω*mm²
    Specific electrical conductivity at 200°C 33 m/Ω*mm²
    Specific electrical conductivity at -100°C 110 m/Ω*mm²
    Specific electrical conductivity at -200°C 460 m/Ω*mm²
    Specific electrical resistance at 100°C 0.023 Ω*mm²/m
    Specific electrical resistance at 20°C 0.018 Ω*mm²/m
    Specific electrical resistance at 200°C 0.03 Ω*mm²/m
    Specific electrical resistance at -100°C 0.009 Ω*mm²/m
    Specific electrical resistance at -200°C 0.002 Ω*mm²/m
    Specific heat at 100°C 0.393 J/(kg·K)
    Specific heat at 20°C 0.386 J/(kg·K)
    Specific heat at 200°C 0.403 J/(kg·K)
    Thermal conductivity at 100°C 385 W/m*K
    Thermal conductivity at 20°C 394 W/m*K
    Thermal conductivity at 200°C 381 W/m*K
    Thermal conductivity at -100°C 435 W/m*K
    Thermal conductivity at -200°C 574 W/m*K
  • Soldering
    Brazing 2
    Soft soldering 1
  • Welding
    Gas 6
    MIG 5
    TIG 5
  • Aviation
    Aviation No
  • Chemical specifications
    Bi (from) 0.0005
    Bi (to) 0.0005
    Cu footnote reference 1
    Other 0.03
    Pb (from) 0.005
    Pb (to) 0.005
    Rest Cu

    1) Einschließlich Silber bis max. 0,015 % 2) Ein Sauerstoffgehalt bis 0,06 % ist zulässig, wenn zwischen Käufer
    und Lieferant vereinbart.

  • Food industry
    suitable according to DIN EN 602 No
  • Material
    Material chemically EN 573-3 Cu 57 (Cu-ETP)
    Material no CW004A (former 2.0065. 2.0060)
  • physical properties
    Coefficient of thermal expansion from 20 to 100°C 16.8 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 200°C 17.3 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 300°C 17.7 K⁻¹10⁻⁶
    Density 8.93 g/cm³
    Modulus of elasticity at 100°C 126 GPa
    Modulus of elasticity at 20°C 130 GPa
    Modulus of elasticity at 200°C 122 GPa
    Modulus of elasticity at 300°C 116 GPa
    Specific electrical conductivity at 100°C 43 m/Ω*mm²
    Specific electrical conductivity at 20°C 57 m/Ω*mm²
    Specific electrical conductivity at 200°C 33 m/Ω*mm²
    Specific electrical conductivity at -100°C 110 m/Ω*mm²
    Specific electrical conductivity at -200°C 460 m/Ω*mm²
    Specific electrical resistance at 100°C 0.023 Ω*mm²/m
    Specific electrical resistance at 20°C 0.018 Ω*mm²/m
    Specific electrical resistance at 200°C 0.03 Ω*mm²/m
    Specific electrical resistance at -100°C 0.009 Ω*mm²/m
    Specific electrical resistance at -200°C 0.002 Ω*mm²/m
    Specific heat at 100°C 0.393 J/(kg·K)
    Specific heat at 20°C 0.386 J/(kg·K)
    Specific heat at 200°C 0.403 J/(kg·K)
    Thermal conductivity at 100°C 385 W/m*K
    Thermal conductivity at 20°C 394 W/m*K
    Thermal conductivity at 200°C 381 W/m*K
    Thermal conductivity at -100°C 435 W/m*K
    Thermal conductivity at -200°C 574 W/m*K
  • Soldering
    Brazing 2
    Soft soldering 1
  • Welding
    Gas 6
    MIG 5
    TIG 5
  • Aviation
    Aviation No
  • Chemical specifications
    Bi (from) 0.0005
    Bi (to) 0.0005
    Cu footnote reference 1
    Other 0.03
    Pb (from) 0.005
    Pb (to) 0.005
    Rest Cu

    1) Einschließlich Silber bis max. 0,015 % 2) Ein Sauerstoffgehalt bis 0,06 % ist zulässig, wenn zwischen Käufer
    und Lieferant vereinbart.

  • Food industry
    suitable according to DIN EN 602 No
  • Material
    Material chemically EN 573-3 Cu 57 (Cu-ETP)
    Material no CW004A (former 2.0065. 2.0060)
  • physical properties
    Coefficient of thermal expansion from 20 to 100°C 16.8 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 200°C 17.3 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 300°C 17.7 K⁻¹10⁻⁶
    Density 8.93 g/cm³
    Modulus of elasticity at 100°C 126 GPa
    Modulus of elasticity at 20°C 130 GPa
    Modulus of elasticity at 200°C 122 GPa
    Modulus of elasticity at 300°C 116 GPa
    Specific electrical conductivity at 100°C 43 m/Ω*mm²
    Specific electrical conductivity at 20°C 57 m/Ω*mm²
    Specific electrical conductivity at 200°C 33 m/Ω*mm²
    Specific electrical conductivity at -100°C 110 m/Ω*mm²
    Specific electrical conductivity at -200°C 460 m/Ω*mm²
    Specific electrical resistance at 100°C 0.023 Ω*mm²/m
    Specific electrical resistance at 20°C 0.018 Ω*mm²/m
    Specific electrical resistance at 200°C 0.03 Ω*mm²/m
    Specific electrical resistance at -100°C 0.009 Ω*mm²/m
    Specific electrical resistance at -200°C 0.002 Ω*mm²/m
    Specific heat at 100°C 0.393 J/(kg·K)
    Specific heat at 20°C 0.386 J/(kg·K)
    Specific heat at 200°C 0.403 J/(kg·K)
    Thermal conductivity at 100°C 385 W/m*K
    Thermal conductivity at 20°C 394 W/m*K
    Thermal conductivity at 200°C 381 W/m*K
    Thermal conductivity at -100°C 435 W/m*K
    Thermal conductivity at -200°C 574 W/m*K
  • Soldering
    Brazing 2
    Soft soldering 1
  • Welding
    Gas 6
    MIG 5
    TIG 5
  • Aviation
    Aviation No
  • Chemical specifications
    Bi (from) 0.0005
    Bi (to) 0.0005
    Cu footnote reference 1
    Other 0.03
    Pb (from) 0.005
    Pb (to) 0.005
    Rest Cu

    1) Einschließlich Silber bis max. 0,015 % 2) Ein Sauerstoffgehalt bis 0,06 % ist zulässig, wenn zwischen Käufer
    und Lieferant vereinbart.

  • Food industry
    suitable according to DIN EN 602 No
  • Material
    Material chemically EN 573-3 Cu 57 (Cu-ETP)
    Material no CW004A (former 2.0065. 2.0060)
  • physical properties
    Coefficient of thermal expansion from 20 to 100°C 16.8 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 200°C 17.3 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 300°C 17.7 K⁻¹10⁻⁶
    Density 8.93 g/cm³
    Modulus of elasticity at 100°C 126 GPa
    Modulus of elasticity at 20°C 130 GPa
    Modulus of elasticity at 200°C 122 GPa
    Modulus of elasticity at 300°C 116 GPa
    Specific electrical conductivity at 100°C 43 m/Ω*mm²
    Specific electrical conductivity at 20°C 57 m/Ω*mm²
    Specific electrical conductivity at 200°C 33 m/Ω*mm²
    Specific electrical conductivity at -100°C 110 m/Ω*mm²
    Specific electrical conductivity at -200°C 460 m/Ω*mm²
    Specific electrical resistance at 100°C 0.023 Ω*mm²/m
    Specific electrical resistance at 20°C 0.018 Ω*mm²/m
    Specific electrical resistance at 200°C 0.03 Ω*mm²/m
    Specific electrical resistance at -100°C 0.009 Ω*mm²/m
    Specific electrical resistance at -200°C 0.002 Ω*mm²/m
    Specific heat at 100°C 0.393 J/(kg·K)
    Specific heat at 20°C 0.386 J/(kg·K)
    Specific heat at 200°C 0.403 J/(kg·K)
    Thermal conductivity at 100°C 385 W/m*K
    Thermal conductivity at 20°C 394 W/m*K
    Thermal conductivity at 200°C 381 W/m*K
    Thermal conductivity at -100°C 435 W/m*K
    Thermal conductivity at -200°C 574 W/m*K
  • Soldering
    Brazing 2
    Soft soldering 1
  • Welding
    Gas 6
    MIG 5
    TIG 5
  • Aviation
    Aviation No
  • Chemical specifications
    Bi (from) 0.0005
    Bi (to) 0.0005
    Cu footnote reference 1
    Other 0.03
    Pb (from) 0.005
    Pb (to) 0.005
    Rest Cu

    1) Einschließlich Silber bis max. 0,015 % 2) Ein Sauerstoffgehalt bis 0,06 % ist zulässig, wenn zwischen Käufer
    und Lieferant vereinbart.

  • Food industry
    suitable according to DIN EN 602 No
  • Material
    Material chemically EN 573-3 Cu 57 (Cu-ETP)
    Material no CW004A (former 2.0065. 2.0060)
  • physical properties
    Coefficient of thermal expansion from 20 to 100°C 16.8 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 200°C 17.3 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 300°C 17.7 K⁻¹10⁻⁶
    Density 8.93 g/cm³
    Modulus of elasticity at 100°C 126 GPa
    Modulus of elasticity at 20°C 130 GPa
    Modulus of elasticity at 200°C 122 GPa
    Modulus of elasticity at 300°C 116 GPa
    Specific electrical conductivity at 100°C 43 m/Ω*mm²
    Specific electrical conductivity at 20°C 57 m/Ω*mm²
    Specific electrical conductivity at 200°C 33 m/Ω*mm²
    Specific electrical conductivity at -100°C 110 m/Ω*mm²
    Specific electrical conductivity at -200°C 460 m/Ω*mm²
    Specific electrical resistance at 100°C 0.023 Ω*mm²/m
    Specific electrical resistance at 20°C 0.018 Ω*mm²/m
    Specific electrical resistance at 200°C 0.03 Ω*mm²/m
    Specific electrical resistance at -100°C 0.009 Ω*mm²/m
    Specific electrical resistance at -200°C 0.002 Ω*mm²/m
    Specific heat at 100°C 0.393 J/(kg·K)
    Specific heat at 20°C 0.386 J/(kg·K)
    Specific heat at 200°C 0.403 J/(kg·K)
    Thermal conductivity at 100°C 385 W/m*K
    Thermal conductivity at 20°C 394 W/m*K
    Thermal conductivity at 200°C 381 W/m*K
    Thermal conductivity at -100°C 435 W/m*K
    Thermal conductivity at -200°C 574 W/m*K
  • Soldering
    Brazing 2
    Soft soldering 1
  • Welding
    Gas 6
    MIG 5
    TIG 5
  • Aviation
    Aviation No
  • Chemical specifications
    Bi (from) 0.0005
    Bi (to) 0.0005
    Cu footnote reference 1
    Other 0.03
    Pb (from) 0.005
    Pb (to) 0.005
    Rest Cu

    1) Einschließlich Silber bis max. 0,015 % 2) Ein Sauerstoffgehalt bis 0,06 % ist zulässig, wenn zwischen Käufer
    und Lieferant vereinbart.

  • Food industry
    suitable according to DIN EN 602 No
  • Material
    Material chemically EN 573-3 Cu 57 (Cu-ETP)
    Material no CW004A (former 2.0065. 2.0060)
  • physical properties
    Coefficient of thermal expansion from 20 to 100°C 16.8 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 200°C 17.3 K⁻¹10⁻⁶
    Coefficient of thermal expansion from 20 to 300°C 17.7 K⁻¹10⁻⁶
    Density 8.93 g/cm³
    Modulus of elasticity at 100°C 126 GPa
    Modulus of elasticity at 20°C 130 GPa
    Modulus of elasticity at 200°C 122 GPa
    Modulus of elasticity at 300°C 116 GPa
    Specific electrical conductivity at 100°C 43 m/Ω*mm²
    Specific electrical conductivity at 20°C 57 m/Ω*mm²
    Specific electrical conductivity at 200°C 33 m/Ω*mm²
    Specific electrical conductivity at -100°C 110 m/Ω*mm²
    Specific electrical conductivity at -200°C 460 m/Ω*mm²
    Specific electrical resistance at 100°C 0.023 Ω*mm²/m
    Specific electrical resistance at 20°C 0.018 Ω*mm²/m
    Specific electrical resistance at 200°C 0.03 Ω*mm²/m
    Specific electrical resistance at -100°C 0.009 Ω*mm²/m
    Specific electrical resistance at -200°C 0.002 Ω*mm²/m
    Specific heat at 100°C 0.393 J/(kg·K)
    Specific heat at 20°C 0.386 J/(kg·K)
    Specific heat at 200°C 0.403 J/(kg·K)
    Thermal conductivity at 100°C 385 W/m*K
    Thermal conductivity at 20°C 394 W/m*K
    Thermal conductivity at 200°C 381 W/m*K
    Thermal conductivity at -100°C 435 W/m*K
    Thermal conductivity at -200°C 574 W/m*K
  • Soldering
    Brazing 2
    Soft soldering 1
  • Welding
    Gas 6
    MIG 5
    TIG 5

1 very good
2 good
3 moderate
4 poor
5 unsuited
0 Not specified

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